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3 Volt Advanced Boot Block Flash
Memory
28F004/400B3, 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
Preliminary Datasheet
Product Features
s Flexible SmartVoltage Technology
— 2.7 V–3.6 V Read/Program/Erase
— 12 V VPP Fast Production Programming
s 2.7 V or 1.65 V I/O Option
— Reduces Overall System Power
s High Performance
— 2.7 V–3.6 V: 70 ns Max Access Time
s Optimized Block Sizes
— Eight 8-KB Blocks for Data,Top or
Bottom Locations
— Up to One Hundred Twenty-Seven 64-
KB Blocks for Code
s Block Locking
— VCC-Level Control through WP#
s Low Power Consumption
— 9 mA Typical Read Current
s Absolute Hardware-Protection
— VPP = GND Option
— VCC Lockout Voltage
s Extended Temperature Operation
— –40 °C to +85 °C
s Automated Program and Block Erase
— Status Registers
s Intel® Flash Data Integrator Software
— Flash Memory Manager
— System Interrupt Manager
— Supports Parameter Storage, Streaming
Data (e.g., Voice)
s Extended Cycling Capability
— Minimum 100,000 Block Erase Cycles
Guaranteed
s Automatic Power Savings Feature
— Typical ICCS after Bus Inactivity
s Standard Surface Mount Packaging
— 48-Ball CSP Packages
— 40- and 48-Lead TSOP Packages
s Density and Footprint Upgradeable for
common package
— 4-, 8-, 16-, 32- and 64-Mbit Densities
s ETOX™ VII (0.18 µ) Flash Technology
— 28F160/320/640B3xC
— 4-, 8-, 16-, and 32-Mbit also exist on
ETOX™ V (0.4µ) and/or ETOX ™ VI
(0.25µ) Flash Technology
s x8 not recommended for new designs
s 4-Mbit density not recommended for new
designs
The 3 Volt Advanced Boot Block flash memory, manufactured on Intel’s latest 0.18 µm
technology, represents a feature-rich solution at overall lower system cost. The 3 Volt Advanced
Boot Block flash memory products in x16 will be available in 48-lead TSOP and 48-ball CSP
packages. The x8 option of this product family will only be available in 40-lead TSOP and 48-
ball µBGA* packages. Additional information on this product family can be obtained by
accessing Intel’s website at: http://www.intel.com/design/flash.
Notice: This document contains preliminary information on new products in production. The
specifications are subject to change without notice. Verify with your local Intel sales office that
you have the latest datasheet before finalizing a design.
Order Number: 290580-012
October 2000

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Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any
intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no
liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties
relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products
are not intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The 28F004/400B3, 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3 may contain design defects or errors known as errata which may cause
the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-
548-4725 or by visiting Intel's website at http://www.intel.com.
Copyright © Intel Corporation 1999– 2000.
*Other brands and names are the property of their respective owners.
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28F004/400B3, 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
Contents
1.0 Introduction .................................................................................................................. 1
1.1 Product Overview .................................................................................................. 2
2.0 Product Description .................................................................................................. 3
2.1 Package Pinouts ................................................................................................... 3
2.2 Block Organization ................................................................................................ 7
2.2.1 Parameter Blocks ..................................................................................... 7
2.2.2 Main Blocks .............................................................................................. 7
3.0 Principles of Operation............................................................................................ 7
3.1 Bus Operation ....................................................................................................... 7
3.1.1 Read......................................................................................................... 8
3.1.2 Output Disable.......................................................................................... 8
3.1.3 Standby .................................................................................................... 8
3.1.4 Deep Power-Down / Reset.......................................................................8
3.1.5 Write ......................................................................................................... 9
3.2 Modes of Operation............................................................................................... 9
3.2.1 Read Array ............................................................................................... 9
3.2.2 Read Identifier ........................................................................................11
3.2.3 Read Status Register .............................................................................11
3.2.4 Program Mode........................................................................................12
3.2.5 Erase Mode ............................................................................................12
3.3 Block Locking ......................................................................................................14
3.3.1 WP# = VIL for Block Locking ..................................................................14
3.3.2 WP# = VIH for Block Unlocking ..............................................................15
3.4 VPP Program and Erase Voltages .......................................................................15
3.4.1 VPP = VIL for Complete Protection .........................................................15
3.5 Power Consumption ............................................................................................15
3.5.1 Active Power ..........................................................................................16
3.5.2 Automatic Power Savings (APS)............................................................16
3.5.3 Standby Power .......................................................................................16
3.5.4 Deep Power-Down Mode .......................................................................16
3.6 Power-Up/Down Operation .................................................................................16
3.6.1 RP# Connected to System Reset...........................................................17
3.6.2 VCC, VPP and RP# Transitions ...............................................................17
3.7 Power Supply Decoupling ...................................................................................17
4.0 Electrical Specifications........................................................................................18
4.1 Absolute Maximum Ratings.................................................................................18
4.2 Operating Conditions...........................................................................................19
4.3 Capacitance ........................................................................................................19
4.4 DC Characteristics ..............................................................................................20
4.5 AC Characteristics —Read Operations...............................................................23
4.6 AC Characteristics —Write Operations ...............................................................27
4.7 Program and Erase Timings................................................................................31
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