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MN101E01J, MN101E01K, MN101E01L,
MN101E01M
Type
Internal ROM type
ROM (byte)
RAM (byte)
Package (Lead-free)
Minimum Instruction
Execution Time
MN101E01J
MN101E01K
MN101E01L
MN101E01M
MN101EF01M
Mask ROM
FLASH
192K
256K
320K
384K
10K 14K 20K 24K
QFP100-P-1818B
LQFP100-P-1414, QFP100-P-1818B
[Standard]
0.0625 µs (at 3.0 V to 3.6 V, 32 MHz)
0.1 µs (at 3.0 V to 3.6 V, 20 MHz)
62.5 µs (at 3.0 V to 3.6 V, 32 kHz)
[Double speed]
0.10 µs (at 3.0 V to 3.6 V, 10 MHz)
[Standard]
0.0625 µs
(at 3.0 V to 3.6 V, 32 MHz)
[Double speed]
0.10 µs
(at 3.0 V to 3.6 V,10 MHz)
Interrupts
RESET, Watchdog, External 0 to 5, Timer 0 to 6, Timer 7 (2 systems), Time base, Serial 0 (2 systems), Serial 1 (2 systems), Serial 2,
Serial 3, Serial 4 (2 systems), Automatic transfer finish, A/D conversion finish, Key interrupts (8 lines)
Timer Counter
Timer counter 0 : 8-bit × 1
(square-wave/8-bit PWM output, event count, generation of remote control carrier, pulse width measurement,
generation of real time)
Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input
Interrupt source ........... coincidence with compare register 0
Timer counter 1 : 8-bit × 1 (square-wave output, event count, synchronous output event)
Clock source................ 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input
Interrupt source ........... coincidence with compare register 1
Timer counter 0, 1 can be cascade-connected.
Timer counter 2 : 8-bit × 1
(square-wave/8-bit PWM output, event count, synchronous output event, pulse width measurement generation of real
time, serial baud rate timer)
Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input
Interrupt source ........... coincidence with compare register 2
Timer counter 3 : 8-bit × 1
(square-wave output, event count, generation of remote control carrier, serial baud rate timer)
Clock source................ 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input
Interrupt source ........... coincidence with compare register 3
Timer counter 2, 3 can be cascade-connected.
Timer counter 4 : 8-bit × 1
(square-wave/8-bit PWM output, event count, pulse width measurement, serial baud rate timer)
Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input frequency
Interrupt source ........... coincidence with compare register 4
Timer counter 5 : 8-bit × 1 (square-wave output, event count, serial baud rate timer)
Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input
Interrupt source ........... coincidence with compare register 5
Timer counter 4, 5 can be cascade-connected.
MAD00034KEM

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MN101E01J, MN101E01K, MN101E01L, MN101E01M
Timer counter 6 : 8-bit freerun timer
Clock source................ 1/1 of system clock frequency; 1/1, 1/4096, 1/8192 of OSC oscillation clock frequency; 1/1, 1/4096,
1/8192 of XI oscillation clock frequency
Interrupt source ........... coincidence with compare register 6
Timer counter 7 : 16-bit × 1
(square-wave/16-bit PWM output, cycle / duty continuous variable, event count, synchronous output evevt, pulse width
measurement, input capture)
Clock source................ 1/1, 1/2, 1/4, 1/16 of system clock frequency; 1/1, 1/2, 1/4, 1/16 of OSC oscillation clock frequency; 1/1,
1/2, 1/4, 1/16 of external clock input frequency
Interrupt source ........... coincidence with compare register 7 (2 lines)
Time base timer (one-minute count setting)
Clock source................ 1/1 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency
Interrupt source ........... 1/128, 1/256, 1/512, 1/1024, 1/8192, 1/32768 of clock source frequency
Watchdog timer
Interrupt source ........... 1/65536, 1/262144, 1/1048576, 1/4194304 of system clock frequency
Serial interface
Serial 0 : synchronous type/UART (full-duplex) × 1
Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 2, 4; 1/2, 1/4, 1/16, 1/64 of OSC
oscillation clock frequency
Serial 1 : synchronous type/UART (full-duplex) × 1
Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 4, 5; 1/2, 1/4, 1/8, 1/16, 1/64 of OSC
oscillation clock frequency
Serial 2 : synchronous type/single-master I²C× 1
Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 2, 3; 1/2, 1/4, 1/8, 1/16, 1/32, 1/64,
1/128 of OSC oscillation clock frequency
Serial 3 : synchronous type/single-master I²C × 1
Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 3, 5; 1/2, 1/4, 1/8, 1/16, 1/32, 1/64,
1/128 of OSC oscillation clock frequency
Serial 4 : synchronous type/UART (full-duplex) × 1
Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 2, 5 ; 1/2, 1/4, 1/16, 1/64 of OSC
oscillation clock frequency
DMA controller
Max. Transfer cycles : 255
Starting factor : external request, various types of interrupt, software
Transfer mode : 1-byte transfer, word transfer, burst transfer
I/O Pins
I/O
34 (5 V IF port) Common use , Specified pull-up resistor available, Input/output selectable (bit unit)
50 (3 V IF port) Common use , Specified pull-up resistor available, Input/output selectable (bit unit)
A/D converter
10-bit × 8-ch. (with S/H)
D/A converter
8-bit × 1-ch.
Special Ports
Buzzer output, remote control carrier signal output, high-current drive port
ROM Correction
Correcting address designation : up to 3 addresses possible
MAD00034KEM

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Electrical Charactreistics (Supply current)
Parameter
Symbol
Condition
Operating supply current
Supply current at HALT
Supply current at STOP
IDD1
IDD2
IDD3
IDD4
IDD5
IDD6
fosc = 32.0 MHz , VDD1 = 3.3 V , (fs = fosc/2)
fosc = 20.0 MHz , VDD1 = 3.3 V , (fs = fosc/2)
fosc = 32.768 kHz , VDD1 = 3.3 V , (fs = fosc/2)
fx = 32.768 kHz , VDD1 = 3.3 V
VDD1 = 3.3 V , Ta = 25°C
VDD1 = 3.3 V , Ta = 85°C
Development tools
In-circuit Emulator
PX-ICE101E+PRBV101E01-QFP100-P-1818B
PX-ICE101E+PRBV101E01-LQFP100-P-1414
Pin Assignment
Limit
Unit
min typ max
11 (48) 30 (80) mA
8 (43) 22 (75) mA
30 (60) 120 (180) µA
12 30 µA
0.3 3.0 µA
80 µA
( ) : Flash memory built-in type
TXD0B, SBO0B, P90
RXD0B, SBI0B, P91
SBT0B, P92
SDA3B, SBO3B, P93
SBI3B, P94
SCL3B, SBT3B, P95
IRQ2B, PD0
IRQ3B, PD1
TM4IOB, PD2
TM5IOB, PD3
TM7IOB, PD4
BUZZER, PD5
SYSCLK, PD6
VDD3
PD7
VSS3
AN0, PA0
AN1, PA1
AN2, PA2
AN3, PA3
AN4, PA4
AN5, PA5
AN6, PA6
AN7, PA7
5V I/F port
VREF+
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
MN101E01J
MN101E01K
MN101E01L
MN101E01M
50 P63, KEY3, A11
49 P62, KEY2, A10
48 P61, KEY1, A9
47 P60, KEY0, A8
46 P57, A7
45 P56, A6
44 P55, A5
43 P54, A4
42 P53, A3
41 P52, A2
40 P51, A1
39 P50, A0
38 P35, SBT3A, SCL3A
37 P34, SBI3A
36 P33, SBO3A, SDA3A
35 P32, SBT1
34 P31, SBI1, RXD1
33 P30, SBO1, TXD1
32 P25, IRQ5
31 P24, IRQ4
30 P23, IRQ3A
29 P22, IRQ2A
28 P21, IRQ1
27 P20, IRQ0
26 P16, TM7IOA
QFP100-P-1818B
LQFP100-P-1414
MAD00034KEM

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Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
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