needs for future
will be met with
Thin Film Technology.
High speed system design needs full wave regime implementation in
order to maintain signal fidelity. Harmonics not considered at slower speeds must
be accounted for when fast rise times and high bandwidths are to be used. When
edge rates and circuit speeds enter the sub-nanosecond regime, all components
used in a system design must obey high speed design rules, whether they be pack-
ages, devices, integrated circuits, interconnects, or printed circuit boards.
Thin film component design is uniquely appropriate for high frequency
design: the precision of pattern features, purity of film, stability of substrate mate-
rials, and advanced assembly technologies offer solutions for high speed design.
Wave propagation through correctly designed thin film elements provide for pre-
cise impedance control, a reduction in capacitive and inductive parasitics, and
elimination of ground bounce. Shielded designs protect for electro-magnetic and
Thin Film Technology Corporation manufactures high speed delay lines
based on microstrip, stripline, and multi-conductor transmission lines. Available
in leaded, surface mount, and chip configuration, these products have performance
to 5 gigahertz. New designs and materials are under continuous development to
extend this range. It is our philosophy that higher technology components can
improve your system performance and lower your costs, both now and in the
High frequency measurement is essential to assure correct device char-
acterization. Attention to field patterns is necessary when representing transmis-
sion lines in order to understand reflections, mismatches, and skin effects. Test
design layout should replicate the field patterns that will actually occur with the
real package, so that accurate device characteristics represented by scattering para-
meters can be made. Proper calibration standards used at the device under test are
sine qua non.