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Intel® Advanced+ Boot Block Flash
Memory (C3)
28F800C3, 28F160C3, 28F320C3 (x16)
Datasheet
Product Features
Flexible SmartVoltage Technology
— 2.7 V– 3.6 V read/program/erase
m— 12 V for fast production programming
1.65 V to 2.5 V or 2.7 V to 3.6 V I/O
oOption
.c—Reduces overall system power
High Performance
— 2.7 V– 3.6 V: 70 ns max access time
UOptimized Architecture for Code Plus
Data Storage
t4—Eight 4 Kword blocks, top or bottom
parameter boot
e— Up to 127 x 32 Kword blocks
— Fast program suspend capability
e— Fast erase suspend capability
Flexible Block Locking
h— Lock/unlock any block
— Full protection on power-up
S— Write Protect (WP#) pin for hardware
block protection
taLow Power Consumption
— 9 mA typical read
a— 7 uA typical standby with Automatic
Power Savings feature
.DExtended Temperature Operation
— -40 °C to +85 °C
128-bit Protection Register
—64 bit unique device identifier
—64 bit user programmable OTP cells
Extended Cycling Capability
—Minimum 100,000 block erase cycles
Software
—Supported by Intel’s Advanced Flash
File Managers -- Intel® VFM, Intel®
FDI, etc.
—Code and data storage in the same
memory device
—Robust Power Loss Recovery for Data
Loss Prevention
—Common Flash Interface
http://www.intel.com/go/flashsw
Standard Surface Mount Packaging
—48-Ball µBGA*/VFBGA
—64-Ball Easy BGA packages
—48-TSOP package
ETOX™ VIII (0.13 µm) Flash
Technology
—8, 16, 32 Mbit
ETOX™ VII (0.18 µm) Flash Technology
—16, 32 Mbit
ETOX™ VI (0.25 µm) Flash Technology
—8, 16 and 32 Mbit
wThe Intel® Advanced+ Book Block Flash Memory (C3) device, manufactured on Intel’s latest
0.13 µm and 0.18 µm technologies, represents a feature-rich solution for low-power
wapplications. The C3 device incorporates low-voltage capability (3 V read, program, and erase)
with high-speed, low-power operation. Flexible block locking allows any block to be
mindependently locked or unlocked. Add to this the Intel® Flash Data Integrator (Intel® FDI)
w osoftware and you have a cost-effective, flexible, monolithic code plus data storage solution.
.cIntel® Advanced+ Boot Block Flash Memory (C3) products are available in 48-lead TSOP, 48-
Uball CSP, and 64-ball Easy BGA packages. Additional information on this product family can be
t4obtained from the Intel® Flash website: http://www.intel.com/design/flash.
.DataSheeOrder Number: 290645, Revision: 023
www May 2005

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Copyright © 2005, Intel Corporation. All Rights Reserved.
May 2005
2
Intel® Advanced+ Boot Block Flash Memory (C3)
Order Number: 290645, Revision: 023
Datasheet

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Intel® Advanced+ Boot Block Flash Memory (C3)
Contents
1.0 Introduction....................................................................................................................................7
1.1 Nomenclature ....................................................................................................................... 7
1.2 Conventions .......................................................................................................................... 7
2.0 Functional Overview ..................................................................................................................... 8
2.1 Product Overview .................................................................................................................8
2.2 Block Diagram ......................................................................................................................9
2.3 Memory Map ......................................................................................................................... 9
3.0 Package Information ................................................................................................................... 12
3.1 mBGA* and VF BGA Package............................................................................................12
3.2 TSOP Package ................................................................................................................... 13
3.3 Easy BGA Package ............................................................................................................ 14
4.0 Ballout and Signal Descriptions ................................................................................................ 15
4.1 48-Lead TSOP Package ..................................................................................................... 15
4.2 64-Ball Easy BGA Package ................................................................................................ 18
4.3 Signal Descriptions ............................................................................................................. 18
5.0 Maximum Ratings and Operating Conditions........................................................................... 20
5.1 Absolute Maximum Ratings ................................................................................................ 20
5.2 Operating Conditions .......................................................................................................... 20
6.0 Electrical Specifications ............................................................................................................. 22
6.1 Current Characteristics ....................................................................................................... 22
6.2 DC Voltage Characteristics.................................................................................................24
7.0 AC Characteristics ......................................................................................................................25
7.1 AC Read Characteristics .................................................................................................... 25
7.2 AC Write Characteristics..................................................................................................... 29
7.3 Erase and Program Timings ............................................................................................... 33
7.4 AC I/O Test Conditions ....................................................................................................... 33
7.5 Device Capacitance ............................................................................................................ 34
8.0 Power and Reset Specifications ................................................................................................ 35
8.1 Active Power (Program/Erase/Read).................................................................................. 35
8.2 Automatic Power Savings (APS) ........................................................................................ 35
8.3 Standby Power ................................................................................................................... 35
8.4 Deep Power-Down Mode.................................................................................................... 35
8.5 Power and Reset Considerations ....................................................................................... 36
8.5.1 Power-Up/Down Characteristics ............................................................................ 36
8.5.2 RP# Connected to System Reset .......................................................................... 36
8.5.3 VCC, VPP and RP# Transitions ............................................................................ 36
8.5.4 Reset Specifications .............................................................................................. 37
8.6 Power Supply Decoupling................................................................................................... 37
9.0 Device Operations ....................................................................................................................... 39
Datasheet
Intel® Advanced+ Boot Block Flash Memory (C3)
Order Number: 290645, Revision: 023
May 2005
3