ABSOLUTE MAXIMUM RATINGS
Storage Temperature Range ...........– 65°C to + 125°C
Voltage on any Pin
Referenced to Gnd........................... – 0.5V to + 10V
Voltage on “DNC” pins .........No connections permitted
to these pins.
Lead Temperature (soldering, 10 secs) .......... + 225°C
RECOMMENDED OPERATING CONDITIONS
Absolute Maximum Ratings indicate limits beyond
which permanent damage to the device and impaired
reliability may occur. These are stress ratings provided
for information only and functional operation of the
device at these or any other conditions beyond those
indicated in the operational sections of this speciﬁca-
tion are not implied.
For guaranteed speciﬁcations and test conditions, see
The guaranteed speciﬁcations apply only for the test
conditions listed. Some performance characteristics
may degrade when the device is not operated under
the listed test conditions.
(Operating Conditions: VIN = 6.5V, IOUT = 0mA, COUT = 0.001µF, TA = -40 to +85°C unless otherwise specified.)
Min Typ Max Units
TA = 25°C
Input Voltage Range
5.1 9.0 V
∆VOUT/∆VIN Line Regulation
∆VOUT/∆IOUT Load Regulation
Long Term Stability
+5.5V ≤ VIN ≤ +8.0V
0mA ≤ ISOURCE ≤ 10mA
-10mA ≤ ISINK ≤ 0mA
TA = 25°C
15 50 µV/mA
Short Circuit Current(4)
Output Voltage Noise
∆T = -40°C to +85°C
IOUT = 5mA, ∆VOUT = -0.01%
TA = 25°C
0.1Hz to 10Hz
Note: 1. Over the speciﬁed temperature range. Temperature coefﬁcient is measured by the box method whereby the change in VOUT is
divided by the temperature range; in this case, -40°C to +85°C = 125°C.
2. Thermal Hysteresis is the change in VOUT created by package stress @ TA = 25°C after temperature cycling. VOUT is read initially at
TA = 25°C; the X60008 is then cycled between Hot (85°C) and Cold (-40°C) before a second VOUT measurement is taken at 25°C.
The deviation between the initial VOUT reading and the second VOUT reading is then expressed in ppm.
3. Dropout voltage (VDO) is the minimum voltage (VIN) into the X60008 which will produce the output voltage (∆VOUT) drop speciﬁed in
the Electrical Characteristics table.
4. Guaranteed by Device Characterization
REV 1.16 10/24/03
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