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IBIS4-6600
Datasheet
IBIS4-6600
High resolution 6.6 M Pixel
Rolling shutter
CMOS Image sensor
Datasheet
Cypress Semiconductor Corporation 3901 North First Street
San Jose, CA 95134
408-943-2600
Contact: info@Fillfactory.com Document #: 38-05708 Rev.**(Revision 1.3 )
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IBIS4-6600
Datasheet
Table of contents
1 INTRODUCTION ..................................................................................................4
1.1 OVERVIEW .......................................................................................................4
1.2 KEY FEATURES .................................................................................................5
1.3 PART NUMBER ..................................................................................................5
2 SPECIFICATIONS ................................................................................................6
2.1 GENERAL SPECIFICATIONS................................................................................6
2.2 ELECTRO-OPTICAL SPECIFICATIONS .................................................................6
2.2.1 Overview ..................................................................................................6
2.2.2 Spectral response curve ...........................................................................7
2.2.3 Photo-voltaic response curve...................................................................8
2.3 FEATURES AND GENERAL SPECIFICATIONS .......................................................8
2.4 ELECTRICAL SPECIFICATIONS ...........................................................................9
2.4.1 Absolute maximum ratings.......................................................................9
2.4.2 Recommended operating conditions ........................................................9
2.4.3 DC Electrical characteristics ................................................................10
3 SENSOR ARCHITECTURE AND OPERATION ..............................................11
3.1 FLOOR PLAN ...................................................................................................11
3.2 PIXEL .............................................................................................................12
3.2.1 Architecture............................................................................................12
3.2.2 FPN and PRNU......................................................................................12
3.2.3 Color filter array....................................................................................13
3.2.4 Dark and dummy pixels .........................................................................14
3.3 PIXEL RATE ....................................................................................................14
3.4 REGION-OF-INTEREST (ROI) READ OUT.........................................................15
3.5 OUTPUT AMPLIFIER ........................................................................................15
3.5.1 Stage 1: Offset, FPN correction and multiplexing.................................16
3.5.2 Stage 2: Programmable gain amplifier .................................................16
3.5.3 Stage 3: Output drivers..........................................................................17
3.5.4 Offset DACs ...........................................................................................18
3.6 SUB-SAMPLING MODES...................................................................................19
3.7 ELECTRONIC SHUTTER....................................................................................25
3.8 HIGH DYNAMIC RANGE MODES.......................................................................26
3.8.1 Double slope integration........................................................................26
3.8.2 Non-destructive readout (NDR).............................................................27
3.9 SEQUENCER....................................................................................................28
3.9.1 Internal registers....................................................................................28
3.9.2 Detailed description of registers............................................................30
3.9.3 Serial to Parallel interface.....................................................................37
Cypress Semiconductor Corporation 3901 North First Street
San Jose, CA 95134
408-943-2600
Contact: info@Fillfactory.com Document #: 38-05708 Rev.**(Revision 1.3 )
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IBIS4-6600
Datasheet
4 TIMING DIAGRAMS .........................................................................................39
4.1 SEQUENCER CONTROL SIGNALS......................................................................39
4.2 BASIC FRAME AND LINE TIMING .....................................................................39
4.3 PIXEL OUTPUT TIMING ....................................................................................40
4.3.1 Two outputs............................................................................................40
4.3.2 Multiplexing to one output .....................................................................41
4.3.3 ADC timing ............................................................................................42
5 PIN LIST ..............................................................................................................43
NOTE ON POWER-ON BEHAVIOR.................................................................................45
6 PAD POSITIONING AND PACKAGING..........................................................47
6.1 BARE DIE........................................................................................................47
6.2 BONDING PADS...............................................................................................48
6.2.1 Probe pad positions ...............................................................................48
6.2.2 Bonding pad positions............................................................................49
6.3 PACKAGE DRAWING .......................................................................................51
6.3.1 Technical drawing of the 68-pins LCC package....................................51
6.3.2 Bonding of the IBIS4-6600 sensor in the 68-pins LCC package ...........54
6.4 GLASS LID SPECIFICATIONS ............................................................................55
6.4.1 Color sensor...........................................................................................55
6.4.2 Monochrome sensor...............................................................................56
7 BOUNDARY SCAN TEST STRUCTURES.......................................................57
8 STORAGE AND HANDLING ............................................................................58
8.1 STORAGE CONDITIONS....................................................................................58
8.2 HANDLING AND SOLDER PRECAUTIONS ..........................................................58
9 ORDERING INFORMATION.............................................................................60
APPENDIX A: IBIS4 EVALUATION KIT................................................................62
Cypress Semiconductor Corporation 3901 North First Street
San Jose, CA 95134
408-943-2600
Contact: info@Fillfactory.com Document #: 38-05708 Rev.**(Revision 1.3 )
Page 3 of 63