IBIS4-6600.pdf 데이터시트 (총 30 페이지) - 파일 다운로드 IBIS4-6600 데이타시트 다운로드

No Preview Available !

www.DataSheet4U.com
IBIS4-6600
Datasheet
IBIS4-6600
High resolution 6.6 M Pixel
Rolling shutter
CMOS Image sensor
Datasheet
Cypress Semiconductor Corporation 3901 North First Street
San Jose, CA 95134
408-943-2600
Contact: info@Fillfactory.com Document #: 38-05708 Rev.**(Revision 1.3 )
Page 1 of 63

No Preview Available !

IBIS4-6600
Datasheet
Table of contents
1 INTRODUCTION ..................................................................................................4
1.1 OVERVIEW .......................................................................................................4
1.2 KEY FEATURES .................................................................................................5
1.3 PART NUMBER ..................................................................................................5
2 SPECIFICATIONS ................................................................................................6
2.1 GENERAL SPECIFICATIONS................................................................................6
2.2 ELECTRO-OPTICAL SPECIFICATIONS .................................................................6
2.2.1 Overview ..................................................................................................6
2.2.2 Spectral response curve ...........................................................................7
2.2.3 Photo-voltaic response curve...................................................................8
2.3 FEATURES AND GENERAL SPECIFICATIONS .......................................................8
2.4 ELECTRICAL SPECIFICATIONS ...........................................................................9
2.4.1 Absolute maximum ratings.......................................................................9
2.4.2 Recommended operating conditions ........................................................9
2.4.3 DC Electrical characteristics ................................................................10
3 SENSOR ARCHITECTURE AND OPERATION ..............................................11
3.1 FLOOR PLAN ...................................................................................................11
3.2 PIXEL .............................................................................................................12
3.2.1 Architecture............................................................................................12
3.2.2 FPN and PRNU......................................................................................12
3.2.3 Color filter array....................................................................................13
3.2.4 Dark and dummy pixels .........................................................................14
3.3 PIXEL RATE ....................................................................................................14
3.4 REGION-OF-INTEREST (ROI) READ OUT.........................................................15
3.5 OUTPUT AMPLIFIER ........................................................................................15
3.5.1 Stage 1: Offset, FPN correction and multiplexing.................................16
3.5.2 Stage 2: Programmable gain amplifier .................................................16
3.5.3 Stage 3: Output drivers..........................................................................17
3.5.4 Offset DACs ...........................................................................................18
3.6 SUB-SAMPLING MODES...................................................................................19
3.7 ELECTRONIC SHUTTER....................................................................................25
3.8 HIGH DYNAMIC RANGE MODES.......................................................................26
3.8.1 Double slope integration........................................................................26
3.8.2 Non-destructive readout (NDR).............................................................27
3.9 SEQUENCER....................................................................................................28
3.9.1 Internal registers....................................................................................28
3.9.2 Detailed description of registers............................................................30
3.9.3 Serial to Parallel interface.....................................................................37
Cypress Semiconductor Corporation 3901 North First Street
San Jose, CA 95134
408-943-2600
Contact: info@Fillfactory.com Document #: 38-05708 Rev.**(Revision 1.3 )
Page 2 of 63

No Preview Available !

IBIS4-6600
Datasheet
4 TIMING DIAGRAMS .........................................................................................39
4.1 SEQUENCER CONTROL SIGNALS......................................................................39
4.2 BASIC FRAME AND LINE TIMING .....................................................................39
4.3 PIXEL OUTPUT TIMING ....................................................................................40
4.3.1 Two outputs............................................................................................40
4.3.2 Multiplexing to one output .....................................................................41
4.3.3 ADC timing ............................................................................................42
5 PIN LIST ..............................................................................................................43
NOTE ON POWER-ON BEHAVIOR.................................................................................45
6 PAD POSITIONING AND PACKAGING..........................................................47
6.1 BARE DIE........................................................................................................47
6.2 BONDING PADS...............................................................................................48
6.2.1 Probe pad positions ...............................................................................48
6.2.2 Bonding pad positions............................................................................49
6.3 PACKAGE DRAWING .......................................................................................51
6.3.1 Technical drawing of the 68-pins LCC package....................................51
6.3.2 Bonding of the IBIS4-6600 sensor in the 68-pins LCC package ...........54
6.4 GLASS LID SPECIFICATIONS ............................................................................55
6.4.1 Color sensor...........................................................................................55
6.4.2 Monochrome sensor...............................................................................56
7 BOUNDARY SCAN TEST STRUCTURES.......................................................57
8 STORAGE AND HANDLING ............................................................................58
8.1 STORAGE CONDITIONS....................................................................................58
8.2 HANDLING AND SOLDER PRECAUTIONS ..........................................................58
9 ORDERING INFORMATION.............................................................................60
APPENDIX A: IBIS4 EVALUATION KIT................................................................62
Cypress Semiconductor Corporation 3901 North First Street
San Jose, CA 95134
408-943-2600
Contact: info@Fillfactory.com Document #: 38-05708 Rev.**(Revision 1.3 )
Page 3 of 63

No Preview Available !

IBIS4-6600
Datasheet
1 Introduction
1.1 Overview
The IBIS4-6600 is a solid state CMOS image sensor that integrates the functionality
of complete analog image acquisition, digitizer and digital signal processing system
on a single chip. The image sensor compromises a 6.6 MPixel resolution with
2210x3002 active pixels. The image size is fully programmable to user-defined
windows of interest. The pixels are on a 3.5 µm pitch. The sensor is available in a
Monochrome version or Bayer (RGB) patterned color filter array.
User programmable row and column start/stop positions allow windowing down to
2x1 pixel window for digital zoom. Sub sampling reduces resolution while
maintaining the constant field of view. The analog video output of the pixel array is
processed by an on-chip analog signal pipeline. Double Sampling (DS) eliminates the
fixed pattern noise. The programmable gain and offset amplifier maps the signal
swing to the ADC input range. A 10-bit ADC converts the analog data to a 10-bit
digital word stream. The sensor uses a 3-wire Serial-Parallel (SPI) interface. It
operates with a single 2.5V power supply and requires only one master clock for
operation up to 40 MHz. It is housed in a 68-pin ceramic LCC package.
The IBIS4-6600 is designed taking into consideration interfacing requirements to
standard video encoders. In addition to the 10-bit pixel data stream, the sensor outputs
the valid frame, line and pixel sync signals needed for encoding.
This datasheet allows the user to develop a camera system based on the described
timing and interfacing.
Cypress Semiconductor Corporation 3901 North First Street
San Jose, CA 95134
408-943-2600
Contact: info@Fillfactory.com Document #: 38-05708 Rev.**(Revision 1.3 )
Page 4 of 63

No Preview Available !

IBIS4-6600
Datasheet
1.2 Key features
6.6 Mpixel resolution: 2210 x 3002 active pixels – progressive scan.
3.5 µm pitch square pixels (based on the high-fill factor active pixel sensor
technology of FillFactory (US patent No. 6,225,670 and others)).
Monochrome or Bayer (RGB) color filters.
Single 2.5V supply; Single master clock.
High pixel rate of 40 MHz using a 40 MHz system clock.
10-bit digital output.
61 dB dynamic range.
High optical dynamic range with double slope integration and Non Destructive
Read out (NDR) modes.
Electronic rolling shutter.
Pixel addressability to support Region-of-Interest windowing and sub
sampling.
On-chip Double Sampling FPN correction.
Digital programmable using a 3-wire Serial-to-Parallel Interface (SPI).
Programmable gain and offset amplifier.
68-pins ceramic LCC package.
1.3 Part number
Part number
IBIS4-6600-M-1
CYII4SM6600AA-HBC – Preliminary
IBIS4-6600-M-2
CYII4SM6600AA-QBC – Preliminary
IBIS4-6600-C-1
CYII4SC6600AA-HAC – Preliminary
IBIS4-6600-C-2
CYII4SC6600AA-QAC – Preliminary
Package
84 pins
JLCC *
68 pins
LCC
84 pins
JLCC
68 pins
LCC
Monochrome
/ color die
Monochrome
Monochrome
Color
Color
Glass lid
Monochrome**
Monochrome
Color***
Color
* JLCC package for use in evaluation kits only.
** D263 is used as monochrome glass lid (see Figure 34 for spectral transmittance).
*** S8612 is used as color glass lid (see Figure 33 for spectral transmittance).
Other packaging combinations are available upon special request.
Cypress Semiconductor Corporation 3901 North First Street
San Jose, CA 95134
408-943-2600
Contact: info@Fillfactory.com Document #: 38-05708 Rev.**(Revision 1.3 )
Page 5 of 63