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Freescale Semiconductor
Technical Data
Integrated Stepper Motor Driver
with Embedded MCU and LIN
Serial Communication
Document order number: MM908E626
Rev 3.0, 12/2005
908E626
The 908E626 is an integrated single-package solution that includes
a high-performance HC08 microcontroller with a SMARTMOSTM
analog control IC. The HC08 includes flash memory, a timer, enhanced
serial communications interface (ESCI), an analog-to-digital converter
(ADC), serial peripheral interface (SPI) (only internal), and an internal
clock generator (ICG) module. The analog control die provides fully
protected H-Bridge outputs, voltage regulator, autonomous watchdog,
and local interconnect network (LIN) physical layer.
The single-package solution, together with LIN, provides optimal
application performance adjustments and space-saving PCB design. It
is well suited for the control of automotive stepper applications like
climate control and light-levelling.
STEPPER MOTOR DRIVER
WITH EMBEDDED MCU AND LIN
Features
• High-Performance M68HC08EY16 Core
• 16 K Bytes of On-Chip Flash Memory
• 512 Bytes of RAM
• Internal Clock Generation Module
• Two 16-Bit, 2-Channel Timers
• 10-Bit Analog-to-Digital Converter
• Four Low RDS(ON) Half-Bridge Outputs
• 13 Microcontroller I/Os
DWB SUFFIX
98ARL105910
54-TERMINAL SOICWB-EP
Device
MM908E626AVDWB
Temperature
Range (TA)
-40°C to 115°C
908E626 Simplified Application Diagram
Package
54 SOIC
WB-EP
LIN
VREFH
VDDA
EVDD
VDD
908E626
VSUP[1:3]
VREFL
VSSA
EVSS
VSS
RST
RST_A
IRQ
IRQ_A
SS
PTB1/AD1
RXD
PTE1/RXD
PTD1/TACH1
FGEN
BEMF
PTD0/TACH0/BEMF
GND[1:2] EP
HB1
HB2
HB3
HB4
HVDD
Port A I/Os
Port B I/Os
Port C I/Os
Bipolar
N
S
Step
Motor
Switchable Internal
VDD Output
Microcontroller
Ports
Figure 1. 908E626 Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2005. All rights reserved.

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GND1-2
VSUP1-3
RST_A
IRQ_A
BEMF
FGEN
LIN
RXD
SS
PTE1/RXD
PTD1/TACH1
PTD0/TACH0
PTB1/AD1
RST
IRQ
VREFL
VSSA
EVSS
EVDD
VDDA
VREFH
Internal Bus
PORT C PORT D PORT E
DDRC DDRD DDRE
DDRA
PORT A
DDRB
PORT B
908E626
2
Figure 2. Figure 1. 908E626 Simplified Internal Block Diagram
Analog Integrated Circuit Device Data
Freescale Semiconductor

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TERMINAL CONNECTIONS
TERMINAL CONNECTIONS
Transparent Top
View of Package
PTB7/AD7/TBCH1
PTB6/AD6/TBCH0
PTC4 /OSC1
PTC3 /OSC2
PTC2 / MCLK
PTB5 /AD5
PTB4 /AD4
PTB3 /AD3
IRQ
RST
PTB1/AD1
PTD0 / TACH0 / BEMF
PTD1/TACH1
NC
FGEN
BEMF
RST_A
IRQ_A
SS
LIN
NC
NC
HB1
VSUP1
GND1
HB2
VSUP2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
Exposed
Pad
54 PTA0/KBD0
53 PTA1/KBD1
52 PTA2/KBD2
51 FLSVPP
50 PTA3/KBD3
49 PTA4/KBD4
48 VREFH
47 VDDA
46 EVDD
45 EVSS
44 VSSA
43 VREFL
42 PTE1/RXD
41 RXD
40 VSS
39 NC
38 VDD
37 NC
36 NC
35 NC
34 HVDD
33 NC
32 HB4
31 VSUP3
30 GND2
29 HB3
28 NC
Figure 3. 908E626 Terminal Connections
Table 1. 908E626 TERMINAL DEFINITIONS
A functional description of each terminal can be found in the Functional Terminal Description section beginning on page 14.
Die Terminal Terminal Name
Formal Name
Definition
MCU
MCU
MCU
MCU
1 PTB7/AD7/TBCH1
2 PTB6/AD6/TBCH0
6 PTB5/AD5
7 PTB4/AD4
8 PTB3/AD3
11 PTB1/AD1
Port B I/Os
These terminals are special-function, bidirectional I/O port terminals
that are shared with other functional modules in the MCU.
3 PTC4/OSC1
4 PTC3/OSC2
5 PTC2/MCLK
Port C I/Os
These terminals are special-function, bidirectional I/O port terminals
that are shared with other functional modules in the MCU.
9 IRQ External Interrupt This terminal is an asynchronous external interrupt input terminal.
Input
10
RST
External Reset
This terminal is bidirectional, allowing a reset of the entire system. It
is driven low when any internal reset source is asserted.
MCU
12
13
14, 21, 22,
28, 33, 35,
36, 37, 39
PTD0/TACH0/BEMF
PTD1/TACH1
NC
Port D I/Os
No Connect
These terminals are special-function, bidirectional I/O port terminals
that are shared with other functional modules in the MCU.
Not connected.
Analog Integrated Circuit Device Data
Freescale Semiconductor
908E626
3

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TERMINAL CONNECTIONS
Table 1. 908E626 TERMINAL DEFINITIONS
A functional description of each terminal can be found in the Functional Terminal Description section beginning on page 14.
Die Terminal Terminal Name
Formal Name
Definition
MCU
42
PTE1/ RXD
Port E I/O
This terminal is a special-function, bidirectional I/O port terminal that
can is shared with other functional modules in the MCU.
MCU
43
48
VREFL
VREFH
ADC References
These terminals are the reference voltage terminals for the analog-
to-digital converter (ADC).
MCU
44
47
VSSA
VDDA
ADC Supply
Terminals
These terminals are the power supply terminals for the analog-to-
digital converter.
MCU
45
46
EVSS
EVDD
MCU Power Supply These terminals are the ground and power supply terminals,
Terminals
respectively. The MCU operates from a single power supply.
MCU
MCU
49
50
52
53
54
51
PTA4/KBD4
PTA3/KBD3
PTA2/KBD2
PTA1/KBD1
PTA0/KBD0
FLSVPP
Port A I/Os
These terminals are special-function, bidirectional I/O port terminals
that are shared with other functional modules in the MCU.
Test Terminal
For test purposes only. Do not connect in the application.
Analog
15
FGEN
Current Limitation
Frequency Input
This is the input terminal for the half-bridge current limitation PWM
frequency.
Analog
16
BEMF
Back Electromagnetic This terminal gives the user information about back electromagnetic
Force Output
force (BEMF).
Analog
17
RST_A
Internal Reset
This terminal is the bidirectional reset terminal of the analog die.
Analog
18
IRQ_A
Internal Interrupt
Output
This terminal is the interrupt output terminal of the analog die
indicating errors or wake-up events.
Analog
19
SS
Slave Select
This terminal is the SPI slave select terminal for the analog chip.
Analog
20
LIN
LIN Bus
This terminal represents the single-wire bus transmitter and receiver.
Analog
Analog
Analog
Analog
23
26
29
32
24
27
31
25
30
34
HB1
HB2
HB3
HB4
VSUP1
VSUP2
VSUP3
GND1
GND2
HVDD
Half-Bridge Outputs
This device includes power MOSFETs configured as four half-bridge
driver outputs. These outputs may be configured for step motor
drivers, DC motor drivers, or as high-side and low-side switches.
Power Supply
Terminals
These terminals are device power supply terminals.
Power Ground
Terminals
Switchable VDD
Output
These terminals are device power ground connections.
This terminal is a switchable VDD output for driving resistive loads
requiring a regulated 5.0 V supply; e.g., 3-terminal Hall-effect
sensors.
Analog
38
VDD
Voltage Regulator
Output
The +5.0 V voltage regulator output terminal is intended to supply
the embedded microcontroller.
Analog
40
VSS
Voltage Regulator
Ground
Ground terminal for the connection of all non-power ground
connections (microcontroller and sensors).
Analog
41
EP
RXD
Exposed Pad
LIN Transceiver
Output
Exposed Pad
This terminal is the output of LIN transceiver.
The exposed pad terminal on the bottom side of the package
conducts heat from the chip to the PCB board.
908E626
4
Analog Integrated Circuit Device Data
Freescale Semiconductor

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MAXIMUM RATINGS
MAXIMUM RATINGS
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted. Exceeding limits on any terminal may cause permanent damage
to the device.
Rating
Symbol
Value
Unit
ELECTRICAL RATINGS
Supply Voltage
Analog Chip Supply Voltage under Normal Operation (Steady-
State)
Analog Chip Supply Voltage under Transient Conditions (1)
Microcontroller Chip Supply Voltage
VSUP(SS)
VSUP(PK)
VDD
-0.3 to 28
-0.3 to 40
-0.3 to 6.0
V
Input Terminal Voltage
Analog Chip
Microcontroller Chip
Maximum Microcontroller Current per Terminal
All Terminals Except VDD, VSS, PTA0:PTA6, PTC0:PTC1
Terminals PTA0:PTA6, PTC0:PTC1
Maximum Microcontroller VSS Output Current
VIN (ANALOG)
VIN (MCU)
IPIN(1)
IPIN(2)
IMVSS
-0.3 to 5.5
VSS-0.3 to VDD+0.3
±15
± 25
100
V
mA
mA
Maximum Microcontroller VDD Input Current
IMVDD
100 mA
LIN Supply Voltage
Normal Operation (Steady-State)
Transient Conditions (1)
ESD Voltage
Human Body Model (2)
Machine Model (3)
Charge Device Model (4)
VBUS(SS)
VBUS(DYNAMIC)
VESD1
VESD2
VESD3
-18 to 28
40
± 3000
± 150
± 500
V
V
THERMAL RATINGS
Storage Temperature
Operating Case Temperature (5)
TSTG
TC
-40 to 150
-40 to 115
°C
°C
Operating Junction Temperature(6)
TJ
-40 to 135
°C
Peak Package Reflow Temperature During Solder Mounting (7)
TSOLDER
245
°C
Notes
1. Transient capability for pulses with a time of t < 0.5 sec.
2. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ).
3. ESD2 testing is performed in accordance with the Machine Model (CZAP =200 pF, RZAP = 0 ).
4. ESD3 testing is performed in accordance with Charge Device Model, robotic (CZAP =4.0 pF).
5. The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
6. The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation on the analog die. The analog die temperature must not exceed 150°C under these conditions
7. Terminal soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Analog Integrated Circuit Device Data
Freescale Semiconductor
908E626
5