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Freescale Semiconductor
Advance Information
Document Number: MM908E425
Rev. 1.0, 8/2006
Integrated Quad Half H-Bridge
with Power Supply, Embedded
MCU, and LIN Serial
Communication
The 908E425 is an integrated single-package solution including a
high-performance HC08 microcontroller with a SMARTMOSTM
analog control IC. The HC08 includes Flash Memory, a timer,
Enhanced Serial Communications Interface (ESCI), an Analog-to-
Digital Converter (ADC), Serial Peripheral Interface (SPI) (only
internal), and an Internal Clock Generator (ICG) module. The analog
control die provides fully protected H-Bridge/high-side outputs,
voltage regulator, autonomous watchdog with cyclic wake-up, and
Local Interconnect Network (LIN) physical layer.
The single-package solution, together with LIN, provides optimal
application performance adjustments and space-saving PCB design.
It is well suited for the control of automotive mirror, door lock, and
light-levelling applications.
908E425
H-BRIDGE POWER SUPPLY WITH
EMBEDDED MCU AND LIN
DWB SUFFIX
98ASA10712D
54-PIN SOICWB-EP
Features
• High-Performance M68HC908EY16 Core
• 16 K Bytes of On-Chip Flash Memory
• 512 Bytes of RAM
ORDERING INFORMATION
• Internal Clock Generation Module
• Two 16-bit, 2-Channel Timers
• 10-Bit Analog-to-Digital Converter
• LIN Physical Layer
Device
www.DataSheet4U.com
MM908E425AIDWB
Temperature
Range (TA)
Package
0°C to 85°C 54 SOICW EP
• Autonomous Watchdog with Cyclic Wakeup
• Three Two-Pin Hall-Effect Sensor Input Ports
• One Analog Input with Switchable Current Source
• Four Low RDS (ON) Half-Bridge Outputs
• One Low RDS (ON) High-Side Output
• 13 Micro Controller I/Os
3 908E425
LIN
VREFH
VDDA
EVDD
VDD
VSUP
VREFL
VSSA
EVSS
VSS
RST
RST_A
IRQ
IRQ_A
SS
PTB1/AD1
RXD
PTE1/RXD
PTD1/TACH1
FGEN
BEMF
PTD0/TACH0/BEMF
GND EP
HB1
HB2
HB3
HB4
HS
HVDD
H1
H2
H3
PA1
PORT A I/OS
PORT B I/OS
PORT C I/OS
M
M
M
4 Half-Bridges
Controlling
3 Loads
High-Side
Output
Switchable Internal
VDD Output
Three
2-Terminal Hall-Effect
Sensor Inputs
Analog Input with
Current Source
Microcontroller
Ports
2
Figure 1. 908E425 Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2006. All rights reserved.

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BLOCK DIAGRAM
BLOCK DIAGRAM
GND1-2
VSUP1-3
RST_A
IRQ_A
BEMF
FGEN
LIN
RXD
SS
PTE1/RXD
PTD1/TACH1
PTD0/TACH0
PTB1/AD1
RST
IRQ
VREFL
VSSA
EVSS
EVDD
VDDA
VREFH
908E425
2
Figure 2. 908E425 Simplified Internal Block Diagram
Analog Integrated Circuit Device Data
Freescale Semiconductor

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PIN CONNECTIONS
PIN CONNECTIONS
PTB7/AD7/TBCH1
PTB6/AD6/TBCH0
PTC4 /OSC1
PTC3 /OSC2
PTC2 / MCLK
PTB5 /AD5
PTB4 /AD4
PTB3 /AD3
IRQ
RST
PTB1/AD1
PTD0 / TACH0 / BEMF
PTD1/TACH1
NC
FGEN
BEMF
RST_A
IRQ_A
SS
LIN
NC
NC
HB1
VSUP1
GND1
HB2
VSUP2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
Exposed
Pad
54 PTA0/KBD0
53 PTA1/KBD1
52 PTA2/KBD2
51 FLSVPP
50 PTA3/KBD3
49 PTA4/KBD4
48 VREFH
47 VDDA
46 EVDD
45 EVSS
44 VSSA
43 VREFL
42 PTE1/RXD
41 RXD
40 VSS
39 PA1
38 VDD
37 H1
36 H2
35 H3
34 HVDD
33 NC
32 HB4
31 VSUP3
30 GND2
29 HB3
28 HS
Figure 3. 908E425 Pin Connections (Transparent Package Top View)
Table 1. 908E425 Pin Definitions
A functional description of each pin can be found in the Functional Pin Description section beginning on page 14.
Pin Function
Pin
Pin Name
Formal Name
Definition
MCU
MCU
MCU
MCU
1
PTB7/AD7/TBCH1
Port B I/Os
These pins are special-function, bidirectional I/O port pins that
2 PTB6/AD6/TBCH0
are shared with other functional modules in the MCU.
6 PTB5/AD5
7 PTB4/AD4
8 PTB3/AD3
11 PTB1/AD1
3
PTC4/OSC1
Port C I/Os
These pins are special-function, bidirectional I/O port pins that
4 PTC3/OSC2
are shared with other functional modules in the MCU.
5 PTC2/MCLK
9 IRQ External Interrupt This pin is an asynchronous external interrupt input pin.
Input
10
RST
External Reset
This pin is bidirectional, allowing a reset of the entire system. It
is driven low when any internal reset source is asserted.
MCU
MCU
12 PTD0/TACH0/BEMF
13 PTD1/TACH1
14, 21, 22, 33
NC
42 PTE1/RXD
Port D I/Os
No Connect
Port E I/O
These pins are special-function, bidirectional I/O port pins that
are shared with other functional modules in the MCU.
Not connected.
This pin is a special-function, bidirectional I/O port pin that can
is shared with other functional modules in the MCU.
MCU
43
48
VREFL
VREFH
ADC References
These pins are the reference voltage pins for the analog-to-
digital converter (ADC).
908E425
Analog Integrated Circuit Device Data
Freescale Semiconductor
3

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PIN CONNECTIONS
Table 1. 908E425 Pin Definitions (continued)
A functional description of each pin can be found in the Functional Pin Description section beginning on page 14.
Pin Function
Pin
Pin Name
Formal Name
Definition
MCU
MCU
MCU
MCU
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
44
47
45
46
49
50
52
53
54
51
15
16
17
18
19
20
23
26
29
32
24
27
31
25
30
28
34
VSSA
VDDA
EVSS
EVDD
PTA4/KBD4
PTA3/KBD3
PTA2/KBD2
PTA1/KBD1
PTA0/KBD0
FLSVPP
FGEN
BEMF
RST_A
IRQ_A
SS
LIN
HB1
HB2
HB3
HB4
VSUP1
VSUP2
VSUP3
GND1
GND2
HS
HVDD
ADC Supply
Pins
MCU Power Supply
Pins
Port A I/Os
These pins are the power supply pins for the analog-to-digital
converter.
These pins are the ground and power supply pins, respectively.
The MCU operates from a single power supply.
These pins are special-function, bidirectional I/O port pins that
are shared with other functional modules in the MCU.
Test Pin
For test purposes only. Do not connect in the application.
Current Limitation This is the input pin for the half-bridge current limitation and the
Frequency Input high-side inrush current limiter PWM frequency.
Back Electromagnetic This pin gives the user information about back electromagnetic
Force Output
force (BEMF).
Internal Reset
This pin is the bidirectional reset pin of the analog die.
Internal Interrupt
Output
This pin is the interrupt output pin of the analog die indicating
errors or wake-up events.
Slave Select
This pin is the SPI slave select pin for the analog chip.
LIN Bus
This pin represents the single-wire bus transmitter and receiver.
Half-Bridge Outputs
This device includes power MOSFETs configured as four half-
bridge driver outputs. These outputs may be configured for step
motor drivers, DC motor drivers, or as high-side and low-side
switches.
Power Supply Pins These pins are device power supply pins.
Power Ground Pins These pins are device power ground connections.
High-Side Output
Switchable
VDD Output
This output pin is a low RDS(ON) high-side switch.
This pin is a switchable VDD output for driving resistive loads
requiring a regulated 5.0 V supply; e.g., 3-pin Hall-effect
sensors.
Analog
Analog
Analog
Analog
Analog
35
36
37
38
39
40
41
EP
H3
H2
H1
VDD
PA1
VSS
RXD
Exposed Pad
Hall-Effect Sensor These pins provide inputs for Hall-effect sensors and switches.
Inputs
Voltage Regulator
Output
Analog Input
Voltage Regulator
Ground
LIN Transceiver
Output
Exposed Pad
The +5.0 V voltage regulator output pin is intended to supply
the embedded microcontroller.
This pin is an analog input port with selectable source values.
Ground pin for the connection of all non-power ground
connections (microcontroller and sensors).
This pin is the output of LIN transceiver.
The exposed pad pin on the bottom side of the package
conducts heat from the chip to the PCB board.
908E425
4
Analog Integrated Circuit Device Data
Freescale Semiconductor

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ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Supply Voltage
Analog Chip Supply Voltage under Normal Operation, Steady State
Analog Chip Supply Voltage under Transient Conditions (1)
Microcontroller Chip Supply Voltage
Input Pin Voltage
Analog Chip
Microcontroller Chip
Maximum Microcontroller Current per Pin
All Pins Except VDD, VSS, PTA0:PTA6, PTC0:PTC1
Pins PTA0:PTA6, PTC0:PTC1
Maximum Microcontroller VSS Output Current
Maximum Microcontroller VDD Input Current
LIN Supply Voltage
Normal Operation (Steady-State)
Transient Conditions (1)
ESD Voltage (2)
Human Body Model (HBM)
Machine Model (MM)
Charge Device Model (CDM)
VSUP(SS)
VSUP(PK)
VDD
-0.3 to 28
-0.3 to 40
-0.3 to 6.0
VIN (ANALOG)
VIN (MCU)
-0.3 to 5.5
VSS-0.3 to VDD+0.3
IPIN(1)
IPIN(2)
IMVSS
IMVDD
±15
± 25
100
100
VBUS(SS)
VBUS(DYNAMIC)
VESD
-18 to 28
40
± 3000
± 150
± 500
V
V
mA
mA
mA
V
V
THERMAL RATINGS
Storage Temperature
TSTG
°C
Ambient Operating Temperature
Operating Case Temperature (3)
Operating Junction Temperature (4)
Peak Package Reflow Temperature During Solder Mounting (5)
TA
TC
TJ
TSOLDER
0 to 85
0 to 85
0 to 125
245
°C
°C
°C
°C
Notes
1. Transient capability for pulses with a time of t < 0.5 sec.
2. ESD voltage testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ), ESD voltage testing is
performed in accordance with the Machine Model (CZAP =200 pF, RZAP = 0 , ESD voltage testing is performed in accordance with
Charge Device Model, robotic (CZAP =4.0 pF).
3. The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
4. The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation on the analog die. The analog die temperature must not exceed 150°C under these conditions.
5. Pin soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause
malfunction or permanent damage to the device.
Analog Integrated Circuit Device Data
Freescale Semiconductor
908E425
5