P0404FCxxC.pdf 데이터시트 (총 6 페이지) - 파일 다운로드 P0404FCxxC 데이타시트 다운로드

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APPLICATIONS
Cellular Phones
MCM Boards
Wireless Communication Circuits
IR LEDs
SMART & PCMCIA Cards
IEC COMPATIBILITY (EN61000-4)
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
61000-4-4 (EFT): 40A - 5/50ns
FEATURES
ESD Protection > 25 kilovolts
Available in Voltages Ranging From 3.3V to 36V
250 Watts Peak Pulse Power per Line (tp = 8/20µs)
Bidirectional Configuration & Monolithic Structure
Protects 1 to 3 Lines
RoHS Compliant
MECHANICAL CHARACTERISTICS
Standard EIA Chip Size: 0404
Weight 0.73 milligrams (Approximate)
Available in Lead-Free Plating
Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
Consult Factory for Leaded Device Availability
Flammability Rating UL 94V-0
8mm Plastic & Paper Tape and Reel Per EIA Standard 481
Device Marking On Reel
Top Contacts: Solder Bump 0.004” in Height (Nominal)
PIN CONFIGURATION
P0404FC3.3C*
thru
P0404FC36C*
PFLIP CHIP ARRAY
0402 CHIP SHOWN
05154.R6 2/07
1 www.protekdevices.com
*U.S. Patent No. Des. “D456,367S”

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DEVICE CHARACTERISTICS
P0404FC3.3C*
thru
P0404FC36C*
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
PARAMETER
SYMBOL
VALUE
Peak Pulse Power (tp = 8/20µs) - See Figure 1
Operating Temperature
Storage Temperature
PPP 250
TA -55 to 150
TSTG
-55 to 150
UNITS
Watts
°C
°C
PART
NUMBER
(See Note 1)
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
MAXIMUM
LEAKAGE
CURRENT
(See Note 2)
TYPICAL
CAPACITANCE
P0404FC3.3C
P0404FC05C
P0404FC08C
P0404FC12C
P0404FC15C
P0404FC24C
P0404FC36C
VWM
VOLTS
3.3
5.0
8.0
12.0
15.0
24.0
36.0
@ 1mA
V(BR)
VOLTS
4.0
6.0
8.5
13.3
16.7
26.7
40.0
@ IP = 1A
VC
VOLTS
7.0
11.0
13.2
19.8
25.4
37.2
70.0
@8/20µs
VC @ IPP
12.5V @ 20A
14.7V @ 17A
19.2V @ 13A
29.7V @ 9.0A
35.7V @ 7.0A
55.0V @ 5.0A
84.0V @ 3.0A
@VWM
ID
µA
75*
10**
10***
1
1
1
1
Note 1: All devices are bidirectional. Electrical characteristics apply in both directions.
Note 2: *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current <500nA @ 3.3V. ***Maximum leakage current <200nA @ 5V.
@0V, 1 MHz
C
pF
150
100
75
50
40
30
25
10,000
1,000
100
10
0.01
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
250W, 8/20µs Waveform
1
10
100
1,000
10,000
td - Pulse Duration - µs
120
100
80
60
40
20
0
0
FIGURE 2
PULSE WAVE FORM
TEST
t
f
Peak Value I
WAVEFORM
PP
PARAMETERS
tf = 8µs
e-t td = 20µs
t
d
=
t
IPP/2
5
10 15
20 25
30
t - Time - µs
05154.R6 2/07
2 www.protekdevices.com
*U.S. Patent No. Des. “D456,367S”

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GRAPHS
05154.R6 2/07
FIGURE 3
POWER DERATING CURVE
100
Peak Pulse Power
8/20µs
80
60
40
20
0
0
Average Power
25 50 75 100 125 150
TA - Ambient Temperature - °C
P0404FC3.3C*
thru
P0404FC36C*
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR P0404FC05C
35
25
15
5
-5
ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 5
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR P0404FC05C
14
12
10
8
6
4
2
0
0 5 10 15 20
IPP - Peak Pulse Current - Amps
3 www.protekdevices.com
*U.S. Patent No. Des. “D456,367S”

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APPLICATION INFORMATION
P0404FC3.3C*
thru
P0404FC36C*
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
±50µm
±20µm
60 Seconds
270°C
REQUIREMENTS
Temperature:
TP for Lead-Free (SnAgCu): 260-270°C
TP for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
TP
TL
TSMAX
TSMIN
05154.R6 2/07
Ramp-up
155°
Ramp-down
TS - Preheat
140°
t 25°C to Peak
30-60 seconds
Ramp-up
Solder Time Ramp-down
15 seconds 15-20 seconds
4 www.protekdevices.com
*U.S. Patent No. Des. “D456,367S”

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0404 PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
TOP
AB C
F
END
E
H
I
G
MOUNTING PAD LAYOUT - Option 1
C AD
HG
I
DIE
SOLDER
BUMP
E
SOLDER PRINT
0.010” - 0.012” DIA.
SOLDER PADS
F
SOLDER MASK
P0404FC3.3C*
thru
P0404FC36C*
PACKAGE DIMENSIONS
DIM MILLIMETERS
INCHES
A 0.56 NOM 0.022 NOM
B 0.86 NOM 0.034 NOM
C
1.0 ± 0.02
0.039 ± 0.001
E 0.15 SQ
0.006 SQ
F
1.0 ± 0.0254
0.039 ± 0.001
G 0.15 NOM 0.006 NOM
H 0.127 MAX 0.005 MAX
0.076 MIN
0.003 MIN
I
0.406 NOM
0.016 NOM
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad
and outline: .xxx ± 0.05mm (± 0.002”).
PAD DIMENSIONS
DIM MILLIMETERS
A 0.51
C 0.30
D 0.46
E 0.20
F 0.15 SQ
G 0.71
H 0.99
I 0.51
INCHES
0.020
0.012
0.018
0.008
0.006 SQ
0.028
0.039
0.020
NOTE:
1. Preferred: Using 0.1mm (0.004”) stencil.
05154.R6 2/07
5 www.protekdevices.com
*U.S. Patent No. Des. “D456,367S”