X28HC64.pdf 데이터시트 (총 17 페이지) - 파일 다운로드 X28HC64 데이타시트 다운로드

No Preview Available !

®
Data Sheet
June 7, 2006
X28HC64
64K, 8K x 8 Bit
FN8109.1
5 Volt, Byte Alterable EEPROM
FEATURES
• 70ns access time
• Simple byte and page write
—Single 5V supply
—No external high voltages or VPP control circuits
— Self-timed
—No erase before write
—No complex programming algorithms
—No overerase problem
• Low power CMOS
—40mA active current max.
—200µA standby current max.
• Fast write cycle times
—64-byte page write operation
—Byte or page write cycle: 2ms typical
—Complete memory rewrite: 0.25 sec. typical
—Effective byte write cycle time: 32µs typical
• Software data protection
• End of write detection
—DATA polling
—Toggle bit
www.DataSheet4U.com
PIN CONFIGURATIONS
Plastic DIP
Flat Pack
CERDIP
SOIC
NC
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
VSS
1 28
2 27
3 26
4 25
5 24
6 23
7 X28HC64 22
8 21
9 20
10 19
11 18
12 17
13 16
14 15
VCC
WE
NC
A8
A9
A11
OE
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
LCC
PLCC
4 3 2 1 32 31 30
A6 5
29 A8
A5 6
28 A9
A4 7
27 A11
A3 8
A2 9
X28HC64
(Top View)
A1 10
26 NC
25 OE
24 A10
A0 11
23 CE
NC 12
22 I/O7
I/O0 13
21 I/O6
14 15 16 17 18 19 20
• High reliability
—Endurance: 1 million cycles
—Data retention: 100 years
• JEDEC approved byte-wide pin out
• Pb-free plus anneal available (RoHS compliant)
DESCRIPTION
The X28HC64 is an 8K x 8 EEPROM, fabricated with
Intersil’s proprietary, high performance, floating gate
CMOS technology. Like all Intersil programmable non-
volatile memories, the X28HC64 is a 5V only device. It
features the JEDEC approved pinout for byte-wide
memories, compatible with industry standard RAMs.
The X28HC64 supports a 64-byte page write operation,
effectively providing a 32µs/byte write cycle, and
enabling the entire memory to be typically written in 0.25
seconds. The X28HC64 also features DATA Polling and
Toggle Bit Polling, two methods providing early end of
write detection. In addition, the X28HC64 includes a
user-optional software data protection mode that further
enhances Intersil’s hardware write protect capability.
Intersil EEPROMs are designed and tested for appli-
cations requiring extended endurance. Inherent data
retention is greater than 100 years.
A2
A1
A0
I/O 0
I/O 1
I/O 2
NC
VSS
NC
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
CE
A10
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
TSOP
X28HC64
PGA
I/O1 I/O2 I/O3 I/O5 I/O6
12 13 15 17 18
I/O0 A0
11 10
VSS I/O4 I/O7
14 16 19
A1 A2
CE A10
98
20 21
X28HC64
A3
7
A4
6
(BOTT OM
OE
22
A11
23
VIEW)
A5 A12 VCC A9
A8
5 2 28 24 25
A6 A7
NC WE NC
4 3 1 27 26
Bottom View
32 A 3
31 A 4
30 A 5
29 A 6
28 A 7
27 A 12
26 NC
25 NC
24 VCC
23 NC
22 WE
21 NC
20 A 8
19 A 9
18 A11
17 OE
1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2005-2006. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.

No Preview Available !

X28HC64
Ordering Information
PART NUMBER
X28HC64EM-70
X28HC64J-70*
X28HC64JI-70*
X28HC64JIZ-70* (Note)
X28HC64JZ-70* (Note)
X28HC64KM-70
X28HC64P-70
X28HC64PZ-70 (Note)
X28HC64S-70*
X28HC64SI-70*
X28HC64SM-70*
X28HC64SZ-70 (Note)
X28HC64J-90*
X28HC64JI-90*
X28HC64JIZ-90* (Note)
X28HC64KM-90
X28HC64KMB-90
X28HC64P-90
X28HC64PI-90
X28HC64PIZ-90 (Note)
X28HC64PZ-90 (Note)
X28HC64S-90*
PART MARKING
X28HC64EM-70
X28HC64J-70
X28HC64JI-70
X28HC64JI-70 Z
X28HC64J-70 Z
X28HC64KM-70
X28HC64P-70
X28HC64P-70 Z
X28HC64S-70
X28HC64SI-70
X28HC64SM-70
X28HC64S-70 Z
X28HC64J-90
X28HC64JI-90
X28HC64JI-90 Z
X28HC64KM-90
C X28HC64KMB-90
X28HC64P-90
X28HC64PI-90
X28HC64PI-90 Z
X28HC64P-90 Z
X28HC64S-90
TEMPERATURE
RANGE (°C)
-55 to 125
0 to 70
-40 to 85
-40 to 85
0 to 70
-55 to 125
0 to 70
0 to 70
0 to 70
-40 to 85
-55 to 125
0 to 70
0 to 70
-40 to 85
-40 to 85
-55 to 125
MIL-STD-883
0 to 70
-40 to 85
-40 to 85
0 to 70
0 to 70
ACCESS TIME
(ns)
PACKAGE
PKG. DWG. #
70 32 Ld LCC (458 mil)
32 Ld PLCC
N32.45x55
32 Ld PLCC
N32.45x55
32 Ld PLCC (Pb-free)
N32.45x55
32 Ld PLCC (Pb-free)
N32.45x55
28 Ld PGA
G28.550x650A
28 Ld PDIP
E28.6
28 Ld PDIP** (Pb-free)
E28.6
28 Ld SOIC (300 mil)
M28.3
28 Ld SOIC (300 mil)
M28.3
28 Ld SOIC (300 mil)
M28.3
28 Ld SOIC (300 mil) (Pb-free) M28.3
90 32 Ld PLCC
N32.45x55
32 Ld PLCC
N32.45x55
32 Ld PLCC (Pb-free)
N32.45x55
28 Ld PGA
G28.550x650A
28 Ld PGA
G28.550x650A
28 Ld PDIP
E28.6
28 Ld PDIP
E28.6
28 Ld PDIP** (Pb-free)
E28.6
28 Ld PDIP** (Pb-free)
E28.6
28 Ld SOIC (300 mil)
M28.3
2 FN8109.1
June 7, 2006

No Preview Available !

X28HC64
Ordering Information (Continued)
PART NUMBER
PART MARKING
TEMPERATURE ACCESS TIME
RANGE (°C)
(ns)
PACKAGE
PKG. DWG. #
X28HC64D-12
X28HC64D-12
0 to 70
120 28 Ld CERDIP
X28HC64DI-12
X28HC64DI-12
-40 to 85
28 Ld CERDIP
X28HC64DM-12
X28HC64DM-12
-55 to 125
28 Ld CERDIP
X28HC64DMB-12
C X28HC64DMB-12
MIL-STD-883
28 Ld CERDIP
X28HC64FM-12
X28HC64FM-12
-55 to 125
28 Ld FLATPACK (440 mil)
X28HC64J-12*
X28HC64J-12
0 to 70
32 Ld PLCC
N32.45x55
X28HC64JI-12*
X28HC64JI-12
-40 to 85
32 Ld PLCC
N32.45x55
X28HC64JIZ-12* (Note) X28HC64JI-12 Z
-40 to 85
32 Ld PLCC (Pb-free)
N32.45x55
X28HC64JZ-12* (Note) X28HC64J-12 Z
0 to 70
32 Ld PLCC (Pb-free)
N32.45x55
X28HC64KMB-12
C X28HC64KMB-12
MIL-STD-883
28 Ld PGA
G28.550x650A
X28HC64P-12
X28HC64P-12
0 to 70
28 Ld PDIP
E28.6
X28HC64PI-12
X28HC64PI-12
-40 to 85
28 Ld PDIP
E28.6
X28HC64PIZ-12 (Note) X28HC64PI-12 Z
-40 to 85
28 Ld PDIP** (Pb-free)
E28.6
X28HC64PZ-12 (Note) X28HC64P-12 Z
0 to 70
28 Ld PDIP** (Pb-free)
E28.6
X28HC64S-12*
X28HC64S-12
0 to 70
28 Ld SOIC (300 mil)
M28.3
X28HC64SI-12*
X28HC64SI-12
-40 to 85
28 Ld SOIC (300 mil)
M28.3
X28HC64SIZ-12* (Note) X28HC64SI-12 Z
-40 to 85
28 Ld SOIC (300 mil) (Pb-free) M28.3
X28HC64SZ-12 (Note) X28HC64S-12 Z
0 to 70
28 Ld SOIC (300 mil) (Pb-free) M28.3
X28HC64DM-15
X28HC64DM-15
-55 to 125
150 28 Ld CERDIP
X28HC64J-15T1
X28HC64J-15
0 to 70
32 Ld PLCC Tape and Reel N32.45x55
X28HC64JI-15
X28HC64JI-15
-40 to 85
32 Ld PLCC
N32.45x55
X28HC64JM-15
X28HC64JM-15
-55 to 125
32 Ld PLCC
N32.45x55
X28HC64JZ-15* (Note) X28HC64J-15 Z
0 to 70
32 Ld PLCC (Pb-free)
N32.45x55
X28HC64KMB-15
C X28HC64KMB-15
MIL-STD-883
28 Ld PGA
G28.550x650A
X28HC64P-15
X28HC64P-15
0 to 70
28 Ld PDIP
E28.6
X28HC64PIZ-15 (Note) X28HC64PI-15 Z
-40 to 85
28 Ld PDIP** (Pb-free)
E28.6
X28HC64PZ-15 (Note) X28HC64P-15 Z
0 to 70
28 Ld PDIP** (Pb-free)
E28.6
X28HC64S-15
X28HC64S-15
0 to 70
28 Ld SOIC (300 mil)
M28.3
X28HC64SI-15
X28HC64SI-15
-40 to 85
28 Ld SOIC (300 mil)
M28.3
*Add "T1" suffix for tape and reel.
**Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3 FN8109.1
June 7, 2006

No Preview Available !

X28HC64
PIN DESCRIPTIONS
Addresses (A0-A12)
The Address inputs select an 8-bit memory location
during a read or write operation.
Chip Enable (CE)
The Chip Enable input must be LOW to enable all
read/write operations. When CE is HIGH, power con-
sumption is reduced.
Output Enable (OE)
The Output Enable input controls the data output buff-
ers and is used to initiate read operations.
PIN NAMES
Symbol
A0-A12
I/O0-I/O7
WE
CE
OE
VCC
VSS
NC
Data In/Data Out (I/O0-I/O7)
Data is written to or read from the X28HC64 through
the I/O pins.
Write Enable (WE)
The Write Enable input controls the writing of data to
the X28HC64.
BLOCK DIAGRAM
A0–A12
Address
Inputs
X Buffers
Latches and
Decoder
Y Buffers
Latches
and
Decoder
65,536-Bit
EEPROM
Array
I/O Buffers
and Latches
CE Control
OE Logic and
WE Timing
VCC
VSS
I/O0–I/O7
Data Inputs/Outputs
Description
Address Inputs
Data Input/Output
Write Enable
Chip Enable
Output Enable
+5V
Ground
No Connect
4 FN8109.1
June 7, 2006

No Preview Available !

X28HC64
DEVICE OPERATION
Read
Read operations are initiated by both OE and CE
LOW. The read operation is terminated by either CE or
OE returning HIGH. This two line control architecture
eliminates bus contention in a system environment.
The data bus will be in a high impedance state when
either OE or CE is HIGH.
Write
Write operations are initiated when both CE and WE
are LOW and OE is HIGH. The X28HC64 supports
both a CE and WE controlled write cycle. That is, the
address is latched by the falling edge of either CE or
WE, whichever occurs last. Similarly, the data is
latched internally by the rising edge of either CE or
WE, whichever occurs first. A byte write operation,
once initiated, will automatically continue to comple-
tion, typically within 2ms.
Page Write Operation
The page write feature of the X28HC64 allows the
entire memory to be written in 0.25 seconds. Page write
allows two to sixty-four bytes of data to be consecutively
written to the X28HC64 prior to the commencement of
the internal programming cycle. The host can fetch data
from another device within the system during a page
write operation (change the source address), but the
page address (A6 through A12) for each subsequent
valid write cycle to the part during this operation must
be the same as the initial page address.
The page write mode can be initiated during any write
operation. Following the initial byte write cycle, the
host can write an additional one to sixty-three bytes in
the same manner. Each successive byte load cycle,
started by the WE HIGH to LOW transition, must begin
within 100µs of the falling edge of the preceding WE. If
a subsequent WE HIGH to LOW transition is not
detected within 100µs, the internal automatic program-
ming cycle will commence. There is no page write win-
dow limitation. Effectively the page write window is
infinitely wide, so long as the host continues to access
the device within the byte load cycle time of 100µs.
Write Operation Status Bits
The X28HC64 provides the user two write operation
status bits. These can be used to optimize a system
write cycle time. The status bits are mapped onto the
I/O bus as shown in Figure 1.
Figure 1. Status Bit Assignment
I/O DP TB 5 4 3 2 1 0
Reserved
Toggle Bit
DATA Polling
DATA Polling (I/O7)
The X28HC64 features DATA Polling as a method to
indicate to the host system that the byte write or page
write cycle has completed. DATA Polling allows a sim-
ple bit test operation to determine the status of the
X28HC64, eliminating additional interrupt inputs or
external hardware. During the internal programming
cycle, any attempt to read the last byte written will pro-
duce the complement of that data on I/O7 (i.e. write
data = 0xxx xxxx, read data = 1xxx xxxx). Once the
programming cycle is complete, I/O7 will reflect true data.
Toggle Bit (I/O6)
The X28HC64 also provides another method for deter-
mining when the internal write cycle is complete. Dur-
ing the internal programming cycle I/O6 will toggle
from HIGH to LOW and LOW to HIGH on subsequent
attempts to read the device. When the internal cycle is
complete the toggling will cease and the device will be
accessible for additional read or write operations.
5 FN8109.1
June 7, 2006