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®
Data Sheet
Advanced Synchronous Rectified Buck
MOSFET Drivers with Pre-POR OVP
The ISL6612A and ISL6613A are high frequency MOSFET
drivers specifically designed to drive upper and lower power
N-Channel MOSFETs in a synchronous rectified buck
converter topology. These drivers combined with HIP63xx or
ISL65xx Multi-Phase Buck PWM controllers and N-Channel
MOSFETs form complete core-voltage regulator solutions for
advanced microprocessors.
The ISL6612A drives the upper gate to 12V, while the lower
gate can be independently driven over a range from 5V to
12V. The ISL6613A drives both upper and lower gates over
a range of 5V to 12V. This drive-voltage provides the
flexibility necessary to optimize applications involving trade-
offs between gate charge and conduction losses.
An advanced adaptive zero shoot-through protection is
integrated to prevent both the upper and lower MOSFETs
from conducting simultaneously and to minimize the dead
time. These products add an overvoltage protection feature
operational before VCC exceeds its turn-on threshold, at
which the PHASE node is connected to the gate of the low
side MOSFET (LGATE). The output voltage of the converter
is then limited by the threshold of the low side MOSFET,
which provides some protection to the microprocessor if the
upper MOSFET(s) is shorted during initial startup.
These drivers also feature a three-state PWM input which,
working together with Intersil’s multi-phase PWM controllers,
prevents a negative transient on the output voltage when the
output is shut down. This feature eliminates the Schottky
diode that is used in some systems for protecting the load
from reversed output voltage events.
ISL6612A, ISL6613A
July 27, 2006
FN9159.6
Features
• Pin-to-pin Compatible with HIP6601 SOIC family
• Dual MOSFET Drives for Synchronous Rectified Bridge
• Advanced Adaptive Zero Shoot-Through Protection
- Body Diode Detection
- Auto-zero of rDS(ON) Conduction Offset Effect
• Adjustable Gate Voltage (5V to 12V) for Optimal Efficiency
• 36V Internal Bootstrap Schottky Diode
• Bootstrap Capacitor Overcharging Prevention
• Supports High Switching Frequency (up to 2MHz)
- 3A Sinking Current Capability
- Fast Rise/Fall Times and Low Propagation Delays
• Three-State PWM Input for Output Stage Shutdown
• Three-State PWM Input Hysteresis for Applications With
Power Sequencing Requirement
• Pre-POR Overvoltage Protection
• VCC Undervoltage Protection
• Expandable Bottom Copper Pad for Enhanced Heat
Sinking
• Dual Flat No-Lead (DFN) Package
- Near Chip-Scale Package Footprint; Improves PCB
Efficiency and Thinner in Profile
• Pb-Free Plus Anneal Available (RoHS Compliant)
Applications
• Core Regulators for Intel® and AMD® Microprocessors
• High Current DC/DC Converters
• High Frequency and High Efficiency VRM and VRD
Related Literature
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
• Technical Brief TB417 for Power Train Design, Layout
Guidelines, and Feedback Compensation Design
1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2005, 2006. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.

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ISL6612A, ISL6613A
Ordering Information
PART NUMBER
ISL6612ACB
ISL6612ACB-T
ISL6612ACBZ (Note)
ISL6612ACBZ-T (Note)
ISL6612ACBZA (Note)
ISL6612ACBZA-T (Note)
ISL6612ACR
ISL6612ACR-T
ISL6612ACRZ (Note)
ISL6612ACRZ-T (Note)
ISL6612AECB
ISL6612AECB-T
ISL6612AECBZ (Note)
ISL6612AECBZ-T (Note)
ISL6612AEIB
ISL6612AEIB-T
ISL6612AEIBZ (Note)
ISL6612AEIBZ-T (Note)
ISL6612AIB
ISL6612AIB-T
ISL6612AIBZ (Note)
ISL6612AIBZ-T (Note)
ISL6612AIR
ISL6612AIR-T
ISL6612AIRZ (Note)
ISL6612AIRZ-T (Note)
ISL6613ACB
ISL6613ACB-T
ISL6613ACBZ (Note)
ISL6613ACBZ-T (Note)
ISL6613ACR
ISL6613ACR-T
ISL6613ACRZ (Note)
ISL6613ACRZ-T (Note)
ISL6613AECB
ISL6613AECB-T
ISL6613AECBZ (Note)
ISL6613AECBZ-T (Note)
ISL6613AEIB
ISL6613AEIB-T
PART MARKING
ISL6612ACB
ISL6612ACB
6612ACBZ
6612ACBZ
6612ACBZ
6612ACBZ
12AC
12AC
12AZ
12AZ
6612AECB
6612AECB
6612AECBZ
6612AECBZ
6612AEIB
6612AEIB
6612AEIBZ
6612AEIBZ
ISL6612AIB
ISL6612AIB
6612AIBZ
6612AIBZ
12AI
12AI
2AIZ
2AIZ
ISL6613ACB
ISL6613ACB
6613ACBZ
6613ACBZ
13AC
13AC
13AZ
13AZ
6613AECB
6613AECB
6613AECBZ
6613AECBZ
6613AEIB
6613AEIB
TEMP.
RANGE (°C)
PACKAGE
0 to 85
8 Ld SOIC
8 Ld SOIC Tape and Reel
0 to 85
8 Ld SOIC (Pb-free)
8 Ld SOIC Tape and Reel (Pb-free)
0 to 85
8 Ld SOIC (Pb-free)
8 Ld SOIC Tape and Reel (Pb-free)
0 to 85
10 Ld 3x3 DFN
10 Ld 3x3 DFN Tape and Reel
0 to 85
10 Ld 3x3 DFN (Pb-free)
10 Ld 3x3 DFN Tape and Reel (Pb-free)
0 to 85
8 Ld EPSOIC
8 Ld EPSOIC Tape and Reel
0 to 85
8 Ld EPSOIC (Pb-free)
8 Ld EPSOIC Tape and Reel (Pb-free)
-40 to +85
8 Ld EPSOIC
8 Ld EPSOIC Tape and Reel
-40 to +85
8 Ld EPSOIC (Pb-free)
8 Ld EPSOIC Tape and Reel (Pb-free)
-40 to +85
8 Ld SOIC
8 Ld SOIC Tape and Reel
-40 to +85
8 Ld SOIC (Pb-free)
8 Ld SOIC Tape and Reel (Pb-free)
-40 to +85
10 Ld 3x3 DFN
10 Ld 3x3 DFN Tape and Reel
-40 to +85
10 Ld 3x3 DFN (Pb-free)
10 Ld 3x3 DFN Tape and Reel (Pb-free)
0 to 85
8 Ld SOIC
8 Ld SOIC Tape and Reel
0 to 85
8 Ld SOIC (Pb-free)
8 Ld SOIC Tape and Reel (Pb-free)
0 to 85
10 Ld 3x3 DFN
10 Ld 3x3 DFN Tape and Reel
0 to 85
10 Ld 3x3 DFN (Pb-free)
10 Ld 3x3 DFN Tape and Reel (Pb-free)
0 to 85
8 Ld EPSOIC
8 Ld EPSOIC Tape and Reel
0 to 85
8 Ld EPSOIC (Pb-free)
8 Ld EPSOIC Tape and Reel (Pb-free)
-40 to +85
8 Ld EPSOIC
8 Ld EPSOIC Tape and Reel
2
PKG.
DWG. #
M8.15
M8.15
M8.15
M8.15
M8.15
M8.15
L10.3x3
L10.3x3
L10.3x3
L10.3x3
M8.15B
M8.15B
M8.15B
M8.15B
M8.15B
M8.15B
M8.15B
M8.15B
M8.15
M8.15
M8.15
M8.15
L10.3x3
L10.3x3
L10.3x3
L10.3x3
M8.15
M8.15
M8.15
M8.15
L10.3x3
L10.3x3
L10.3x3
L10.3x3
M8.15B
M8.15B
M8.15B
M8.15B
M8.15B
M8.15B
FN9159.6
July 27, 2006

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ISL6612A, ISL6613A
Ordering Information (Continued)
PART NUMBER
PART MARKING
TEMP.
RANGE (°C)
PACKAGE
PKG.
DWG. #
ISL6613AEIBZ (Note)
6613AEIBZ
-40 to +85
8 Ld EPSOIC (Pb-free)
M8.15B
ISL6613AEIBZ-T (Note) 6613AEIBZ
8 Ld EPSOIC Tape and Reel (Pb-free)
M8.15B
ISL6613AIB
ISL6613AIB
-40 to +85
8 Ld SOIC
M8.15
ISL6613AIB-T
ISL6613AIB
8 Ld SOIC Tape and Reel
M8.15
ISL6613AIBZ (Note)
6613AIBZ
-40 to +85
8 Ld SOIC (Pb-free)
M8.15
ISL6613AIBZ-T (Note)
6613AIBZ
8 Ld SOIC Tape and Reel (Pb-free)
M8.15
ISL6613AIR
13AI
-40 to +85
10 Ld 3x3 DFN
L10.3x3
ISL6613AIR-T
13AI
10 Ld 3x3 DFN Tape and Reel
L10.3x3
ISL6613AIRZ (Note)
3AIZ
-40 to +85
10 Ld 3x3 DFN (Pb-free)
L10.3x3
ISL6613AIRZ-T (Note)
3AIZ
10 Ld 3x3 DFN Tape and Reel (Pb-free)
L10.3x3
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
Check website for availability.
Pinouts
ISL6612ACB, ISL6612AIB, ISL6613ACB, ISL6613AIB (SOIC)
ISL6612AECB, ISL6612AEIB, ISL6613AECB, ISL6613AEIB
(EPSOIC)
TOP VIEW
UGATE 1
BOOT 2
PWM 3
GND 4
GND
8 PHASE
7 PVCC
6 VCC
5 LGATE
ISL6612ACR, ISL6612AIR, ISL6613ACR, ISL6613AIR
(10 LD 3X3 DFN)
TOP VIEW
UGATE 1
BOOT 2
N/C 3
PWM 4
GND 5
GND
10 PHASE
9 PVCC
8 N/C
7 VCC
6 LGATE
Block Diagram
ISL6612A AND ISL6613A
VCC
PWM
UVCC
+5V
10K
8K
Pre-POR OVP
FEATURES
POR/
CONTROL
LOGIC
SHOOT-
THROUGH
PROTECTION
(LVCC)
BOOT
UGATE
PHASE
PVCC
UVCC = VCC FOR ISL6612A
UVCC = PVCC FOR ISL6613A
LGATE
PAD
GND
FOR DFN AND EPSOIC-DEVICES, THE PAD ON THE BOTTOM SIDE OF
THE PACKAGE MUST BE SOLDERED TO THE CIRCUIT’S GROUND.
3 FN9159.6
July 27, 2006

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ISL6612A, ISL6613A
Typical Application - 3 Channel Converter Using ISL65xx and ISL6612A Gate Drivers
+5V TO 12V
+12V
+5V
VFB VCC
COMP
VSEN
PGOOD
PWM1
PWM2
PWM3
MAIN
CONTROL
VID ISL65xx
ISEN1
ISEN2
FS
ISEN3
GND
VCC
BOOT
PVCC
UGATE
PHASE
PWM ISL6612A
LGATE
GND
+5V TO 12V
+12V
VCC
BOOT
PVCC
UGATE
PWM ISL6612A PHASE
LGATE
GND
+5V TO 12V
VCC
BOOT
PVCC
UGATE
ISL6612A PHASE
PWM
LGATE
GND
+12V
+VCORE
4 FN9159.6
July 27, 2006

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ISL6612A, ISL6613A
Absolute Maximum Ratings
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15V
Supply Voltage (PVCC) . . . . . . . . . . . . . . . . . . . . . . . . . VCC + 0.3V
BOOT Voltage (VBOOT-GND) . . . . . . . . . . . . . . . . . . . . . . . . . . . 36V
Input Voltage (VPWM). . . . . . . . . . . . . . . . . . . . . . .GND - 0.3V to 7V
UGATE . . . . . . . . . . . . . . . . . . . VPHASE - 0.3VDC to VBOOT + 0.3V
VPHASE - 3.5V (<100ns Pulse Width, 2µJ) to VBOOT + 0.3V
LGATE . . . . . . . . . . . . . . . . . . . . . . GND - 0.3VDC to VPVCC + 0.3V
GND - 5V (<100ns Pulse Width, 2µJ) to VPVCC + 0.3V
PHASE . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND - 0.3VDC to 15VDC
GND - 8V (<400ns, 20µJ) to 30V (<200ns, VBOOT-GND<36V)
ESD Rating
Human Body Model . . . . . . . . . . . . . . . . . . . .Class I JEDEC STD
Thermal Information
Thermal Resistance
θJA (°C/W) θJC (°C/W)
SOIC Package (Note 1) . . . . . . . . . . . . 100
N/A
EPSOIC Package (Notes 2, 3) . . . . . .
50
7
DFN Package (Notes 2, 3). . . . . . . . . .
48
7
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150°C
Maximum Storage Temperature Range. . . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C
(SOIC - Lead Tips Only)
Recommended Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . . . -40°C to 85°C
Maximum Operating Junction Temperature . . . . . . . . . . . . . . 125°C
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12V ±10%
Supply Voltage Range, PVCC . . . . . . . . . . . . . . . . .5V to 12V ±10%
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.
2. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
3. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications Recommended Operating Conditions, Unless Otherwise Noted.
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
VCC SUPPLY CURRENT
Bias Supply Current
Gate Drive Bias Current
POWER-ON RESET AND ENABLE
IVCC
IVCC
IPVCC
IPVCC
ISL6612A, fPWM = 300kHz, VVCC =12V
ISL6613A, fPWM = 300kHz, VVCC =12V
ISL6612A, fPWM = 1MHz, VVCC = 12V
ISL6613A, fPWM = 1MHz, VVCC = 12V
ISL6612A, fPWM = 300kHz, VPVCC = 12V
ISL6613A, fPWM = 300kHz, VPVCC = 12V
ISL6612A, fPWM = 1MHz, VPVCC = 12V
ISL6613A, fPWM = 1MHz, VPVCC = 12V
-
-
-
-
-
-
-
-
VCC Rising Threshold
VCC Rising Threshold
VCC Falling Threshold
VCC Falling Threshold
PWM INPUT (See Timing Diagram on Page 7)
TA = 0°C to 85°C
TA = -40°C to 85°C
TA = 0°C to 85°C
TA = -40°C to 85°C
9.35
8.35
7.35
6.35
Input Current
PWM Rising Threshold
IPWM
VPWM = 5V
VPWM = 0V
VCC = 12V
-
-
-
PWM Falling Threshold
VCC = 12V
-
Typical Three-State Shutdown Window
VCC = 12V
1.80
Three-State Lower Gate Falling Threshold
VCC = 12V
-
Three-State Lower Gate Rising Threshold
VCC = 12V
-
TYP MAX UNITS
7.2 - mA
4.5 - mA
11 - mA
5 - mA
2.5 - mA
5.2 - mA
7 - mA
13 - mA
9.80
9.80
7.60
7.60
10.00
10.00
8.00
8.00
V
V
V
V
450
-400
3.00
2.00
-
1.50
1.00
-
-
-
-
2.40
-
-
µA
µA
V
V
V
V
V
5 FN9159.6
July 27, 2006