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®
Data Sheet
Dual Advanced Synchronous Rectified
Buck MOSFET Drivers with Pre-POR OVP
The ISL6614B integrates two ISL6613B MOSFET drivers
and is specifically designed to drive two Channel MOSFETs
in a synchronous rectified buck converter topology. This
driver combined with HIP63xx or ISL65xx Multi-Phase Buck
PWM controllers and N-Channel MOSFETs forms complete
core-voltage regulator solutions for advanced
microprocessors.
The ISL6614B features 7V rising threshold and drives both
the upper and lower gates simultaneously over a range from
5V to 12V. This drive-voltage provides the flexibility
necessary to optimize applications involving trade-offs
between gate charge and conduction losses. This driver is
optimized for POL DC/DC Converters for IBA Systems.
An advanced adaptive zero shoot-through protection is
integrated to prevent both the upper and lower MOSFETs
from conducting simultaneously and to minimize the dead
time. These products add an overvoltage protection feature
operational before VCC exceeds its turn-on threshold, at
which the PHASE node is connected to the gate of the low
side MOSFET (LGATE). The output voltage of the converter
is then limited by the threshold of the low side MOSFET,
which provides some protection to the microprocessor if the
upper MOSFET(s) is shorted during start-up.
The ISL6614B also features a three-state PWM input which,
working together with Intersil’s multi-phase PWM controllers,
prevents a negative transient on the output voltage when the
output is shut down. This feature eliminates the Schottky
diode that is used in some systems for protecting the load
from reversed output voltage events.
ISL6614B
January 3, 2006
FN9206.2
Features
• Pin-to-pin Compatible with HIP6602 SOIC family
• Quad N-Channel MOSFET Drives for Two Synchronous
Rectified Bridges
• Low VCC Rising Threshold (7V) for IBA Applications
• Advanced Adaptive Zero Shoot-Through Protection
- Body Diode Detection
- Auto-zero of rDS(ON) Conduction Offset Effect
• Adjustable Gate Voltage (5V to 12V) for Optimal Efficiency
• Internal Bootstrap Schottky Diode
• Bootstrap Capacitor Overcharging Prevention
• Supports High Switching Frequency (up to 1MHz)
- 3A Sinking Current Capability
- Fast Rise/Fall Times and Low Propagation Delays
• Three-State PWM Input for Output Stage Shutdown
• Three-State PWM Input Hysteresis for Applications With
Power Sequencing Requirement
• Pre-POR Overvoltage Protection
• VCC Undervoltage Protection
• Expandable Bottom Copper Pad for Enhanced Heat
Sinking
• QFN Package:
- Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat
No Leads - Package Outline
- Near Chip Scale Package footprint, which improves
PCB efficiency and has a thinner profile
• Pb-Free Plus Anneal Available (RoHS Compliant)
Applications
• Optimized for POL DC/DC Converters for IBA Systems
• Core Regulators for Intel® and AMD® Microprocessors
• High Current DC/DC Converters
• High Frequency and High Efficiency VRM and VRD
Related Literature
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
• Technical Brief 400 and 417 for Power Train Design,
Layout Guidelines, and Feedback Compensation Design
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2006. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.

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Pinouts
ISL6614BCB/ISL6614BCBZ (14 LD SOIC)
TOP VIEW
PWM1 1
PWM2 2
GND 3
LGATE1 4
PVCC 5
PGND 6
LGATE2 7
14 VCC
13 PHASE1
12 UGATE1
11 BOOT1
10 BOOT2
9 UGATE2
8 PHASE2
ISL6614B
ISL6614BCR/ISL6614BCRZ (16 LD QFN)
TOP VIEW
16 15 14 13
GND 1
LGATE1 2
PVCC 3
PGND 4
GND
12 UGATE1
11 BOOT1
10 BOOT2
9 UGATE2
5678
Ordering Information
PART NUMBER
PART MARKING
TEMP.
RANGE (°C)
PACKAGE
PKG.
DWG. #
ISL6614BCB
6614BCB
0 to 85
14 Ld SOIC
M14.15
ISL6614BCB-T
6614BCB
14 Ld SOIC Tape and Reel
ISL6614BCBZ (Note)
6614BCBZ
0 to 85
14 Ld SOIC (Pb-free)
M14.15
ISL6614BCBZ-T (Note)
6614BCBZ
14 Ld SOIC Tape and Reel (Pb-free)
ISL6614BCR
6614BCR
0 to 85
16 Ld 4x4 QFN
L16.4x4
ISL6614BCR-T
6614BCR
16 Ld 4x4 QFN Tape and Reel
ISL6614BCRZ (Note)
6614BCRZ
0 to 85
16 Ld 4x4 QFN (Pb-free)
L16.4x4
ISL6614BCRZ-T (Note) 6614BCRZ
16 Ld 4x4 QFN Tape and Reel (Pb-free)
ISL6614BIB
6614BIB
-40 to 85
14 Ld SOIC
M14.15
ISL6614BIB-T
6614BIB
14 Ld SOIC Tape and Reel
ISL6614BIBZ (Note)
6614BIBZ
-40 to 85
14 Ld SOIC (Pb-free)
M14.15
ISL6614BIBZ-T (Note)
6614BIBZ
14 Ld SOIC Tape and Reel (Pb-free)
ISL6614BIR
6614BIR
-40 to 85
16 Ld 4x4 QFN
L16.4x4
ISL6614BIR-T
6614BIR
16 Ld 4x4 QFN Tape and Reel
ISL6614BIRZ (Note)
6614BIRZ
-40 to 85
16 Ld 4x4 QFN (Pb-free)
L16.4x4
ISL6614BIRZ-T (Note)
6614BIRZ
16 Ld 4x4 QFN Tape and Reel (Pb-free)
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified
at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
Contact the factory for availability.
2 FN9206.2
January 3, 2006

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Block Diagram
ISL6614B
VCC
+5V
PVCC
PRE-POR OVP
FEATURES
10K
PWM1
8K
SHOOT-
THROUGH
PROTECTION
PVCC
CONTROL
+5V LOGIC
10K
PWM2
GND
8K
PGND
PVCC
SHOOT-
THROUGH
PROTECTION
BOOT1
UGATE1
PHASE1
CHANNEL 1
LGATE1
PGND
BOOT2
UGATE2
PHASE2
PVCC
CHANNEL 2
LGATE2
PGND
PAD FOR ISL6614BCR, THE PAD ON THE BOTTOM SIDE OF
THE QFN PACKAGE MUST BE SOLDERED TO THE CIRCUIT’S GROUND.
3 FN9206.2
January 3, 2006

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ISL6614B
Typical Application - 4 Channel Converter Using ISL65xx and ISL6614B Gate Drivers
7V TO 12V
VCC
BOOT1
UGATE1
PHASE1
+12V
PGOOD
EN
VID
+5V
FB COMP
VSEN
VCC
ISEN1
PWM1
PWM2
MAIN ISEN2
CONTROL
ISL65xx
DUAL
DRIVER
ISL6614B
LGATE1
PVCC
5V TO 12V
BOOT2
+12V
PWM1
PWM2
UGATE2
PHASE2
LGATE2
GND
PGND
FS/DIS
ISEN3
PWM3
PWM4
GND ISEN4
7V TO 12V
VCC
BOOT1
UGATE1
PHASE1
+12V
LGATE1
DUAL
DRIVER
ISL6614B
PVCC
5V TO 12V
BOOT2
+12V
PWM1
PWM2
UGATE2
PHASE2
LGATE2
GND
PGND
+VCORE
4 FN9206.2
January 3, 2006

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ISL6614B
Absolute Maximum Ratings
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15V
Supply Voltage (PVCC) . . . . . . . . . . . . . . . . . . . . . . . . . VCC + 0.3V
BOOT Voltage (VBOOT-GND). . . . . . . . . . . . . . . . . . . . . . . . . . . .36V
Input Voltage (VPWM) . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 7V
UGATE. . . . . . . . . . . . . . . . . . . VPHASE - 0.3VDC to VBOOT + 0.3V
VPHASE - 3.5V (<100ns Pulse Width, 2µJ) to VBOOT + 0.3V
LGATE . . . . . . . . . . . . . . . . . . . . . . GND - 0.3VDC to VPVCC + 0.3V
GND - 5V (<100ns Pulse Width, 2µJ) to VPVCC + 0.3V
PHASE. . . . . . . . . . . . . . . . . . . . . . . . . . . . GND - 0.3VDC to 15VDC
GND - 8V (<400ns, 20µJ) to 30V (<200ns, VBOOT-GND<36V)
ESD Rating
Human Body Model . . . . . . . . . . . . . . . . . . . . Class I JEDEC STD
Thermal Information
Thermal Resistance (Typical Notes 1, 2, 3) θJA(°C/W) θJC(°C/W)
SOIC Package (Note 1) . . . . . . . . . . . .
90
N/A
QFN Package (Notes 2, 3). . . . . . . . . .
46
9
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C
(SOIC - Lead Tips Only)
Recommended Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . . . .-40°C to 85°C
Maximum Operating Junction Temperature . . . . . . . . . . . . . . 125°C
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V to 13.2V
Supply Voltage Range, PVCC . . . . . . . . . . . . . . . . 5V to 12V ±10%
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.
2. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
3. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
4. Guaranteed by design. Not 100% tested in production.
Electrical Specifications Recommended Operating Conditions, Unless Otherwise Noted.
PARAMETER
SYMBOL
TEST CONDITIONS
MIN TYP MAX UNITS
VCC SUPPLY CURRENT
Bias Supply Current
Gate Drive Bias Current
POWER-ON RESET AND ENABLE
IVCC
IPVCC
fPWM = 300kHz, VPVCC = 12V
fPWM = 300kHz, VPVCC = 12V
- 7.1 - mA
- 9.7 - mA
VCC Rising Threshold
0°C to 85°C
6.60 6.9 7.25
V
VCC Rising Threshold
-40°C to 85°C
5.60 7.25 V
VCC Falling Threshold
0°C to 85°C
5.20 5.4 5.90
V
VCC Falling Threshold
-40°C to 85°C
4.20 5.90 V
PWM INPUT (See Timing Diagram on Page 7)
Input Current
PWM Rising Threshold
IPWM
VPWM = 5V
VPWM = 0V
VCC = 12V
- 500 -
- -460 -
- 3.00 -
µA
µA
V
PWM Falling Threshold
VCC = 12V
- 2.00 -
V
Typical Three-State Shutdown Window
VCC = 12V
1.80 2.40 V
Three-State Lower Gate Falling Threshold
VCC = 12V
- 1.50 -
V
Three-State Lower Gate Rising Threshold
VCC = 12V
- 1.00 -
V
Three-State Upper Gate Rising Threshold
VCC = 12V
- 3.20 -
V
Three-State Upper Gate Falling Threshold
VCC = 12V
- 2.60 -
V
Shutdown Holdoff Time
UGATE Rise Time
LGATE Rise Time
UGATE Fall Time
LGATE Fall Time
UGATE Turn-On Propagation Delay (Note 4)
tTSSHD
- 245 -
tRU VPVCC = 12V, 3nF Load, 10% to 90%
-
26
-
tRL VPVCC = 12V, 3nF Load, 10% to 90% - 18 -
tFU VPVCC = 12V, 3nF Load, 90% to 10%
-
18
-
tFL VPVCC = 12V, 3nF Load, 90% to 10% - 12 -
tPDHU
VPVCC = 12V, 3nF Load, Adaptive
- 10 -
ns
ns
ns
ns
ns
ns
5 FN9206.2
January 3, 2006