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Freescale Semiconductor
Technical Data
1.0 A 6.8 V H-Bridge Motor
Driver IC
The 17511A is a monolithic H-Bridge designed to be used in
portable electronic applications to control small DC motors or bipolar
step motors. End applications include head positioners (CDROM or
disk drive), camera focus motors, and camera shutter solenoids.
The 17511A can operate efficiently with supply voltages as low as
2.0 V to as high as 6.8 V. Its low RDS(ON) H-Bridge output MOSFETs
(0.46 typical) can provide continuos motor drive currents of 1.0 A
and handle peak currents up to 3.0 A. It is easily interfaced to low-
cost MCUs via parallel 3.0 V- or 5.0 V- compatible logic. The device
can be pulse width modulated (PWM-ed) at up to 200 kHz.
This device contains an integrated charge pump and level shifter
(for gate drive voltages), integrated shoot-through current protection
(cross-conduction suppression logic and timing), and undervoltage
detection and shutdown circuitry.
The 17511A has four operating modes: Forward, Reverse, Brake,
and Tri-Stated (High Impedance).
Features
• 2.0 V to 6.8 V Continuous Operation
• Output Current 1.0 A (DC), 3.0 A (Peak)
• MOSFETs < 600 mRDS(ON) @ 25°C Guaranteed
• 3.0 V/5.0 V TTL-/CMOS-Compatible Inputs
• PWM Frequencies up to 200 kHz
• Undervoltage Shutdown
www.DataSheet4U.com Cross-Conduction Suppression
• Low Power Consumption
• Pb-Free Packaging Designated by Suffix Codes EV and EP
Document Number: MPC17511A
Rev 2.0, 4/2007
17511A
H-BRIDGE MOTOR DRIVER IC
EV SUFFIX (PB-FREE)
98ASH70109A
16-PIN VMFP
EP SUFFIX (PB-FREE)
98ARL10577D
24-PIN QFN
ORDERING INFORMATION
Device
Temperature
Range (TA)
Package
MPC17511AEV/EL
MPC17511AEP/ R2
-20°C to 65°C
16 VMFP
24 QFN
5.0 V 15 V
17511A
VDD
C1L
C1H
C2L
C2H
CRES
VM
GOUT
OUT1
EN MOTOR
MCU
GIN OUT2
IN1
IN2
GND
Figure 1. 17511A Simplified Application Diagram
Freescale Semiconductor, Inc. reserves the right to change the detail specifications,
as may be required, to permit improvements in the design of its products.
© Freescale Semiconductor, Inc., 2007. All rights reserved.

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INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
C2L
C1H
CRES
VDD
Charge Pump
Low-
Voltage
Shutdown
IN1
IN2
VDD
Control
Logic
GIN
VDD
EN
Level
Shifter
Predriver
Figure 2. 17511A Simplified Internal Block Diagram
C2H
C1L
GOUT
VM
OUT1
OUT2
PGND
LGND
17511A
2
Analog Integrated Circuit Device Data
Freescale Semiconductor

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PIN CONNECTIONS
PIN CONNECTIONS
C2L
C1H
C1L
VM
VDD
IN1
IN2
EN
1
2
3
4
5
6
7
8
16 C2H
15 CRES
14 GOUT
13 OUT2
12 PGND
11 OUT1
10 GIN
9 LGND
Figure 3. VMFP Pin Connections
Table 1. VMFP Pin Function Description
Pin
Number
1
Pin Name
C2L
Formal Name
Charge Pump 2L
Definition
Charge pump bucket capacitor 2 (negative pole).
2 C1H
Charge Pump 1H
Charge pump bucket capacitor 1 (positive pole).
3 C1L
Charge Pump 1L
Charge pump bucket capacitor 1 (negative pole).
4 VM Motor Drive Power Supply Driver power supply voltage input pin.
5 VDD
Logic Supply
Control circuit power supply pin.
6 IN1
Input Control 1
Control signal input 1
7 IN2
Input Control 2
Control signal input 2.
8 EN
Enable Control
Enable control signal input pin.
9 LGND
Logic Ground
Logic ground pin.
10 GIN
Gate Driver Input
LOW = True control signal for GOUT pin.
11 OUT1
H-Bridge Output 1
Driver output 1 (right half of H-Bridge).
12 PGND
Power Ground
Driver ground pin.
13 OUT2
H-Bridge Output 2
Driver output 2 (left half of H-Bridge).
14 GOUT
Gate Driver Output
Output gate driver signal to external MOSFET switch.
15 CRES Charge Pump Output Capacitor Charge pump reservoir capacitor pin.
Connection
16 C2H
Charge Pump 2H
Charge pump bucket capacitor 2 (positive pole).
Analog Integrated Circuit Device Data
Freescale Semiconductor
17511A
3

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PIN CONNECTIONS
24 23 22 21 20 19
VM 1
18 NC
VM 2
17 OUT2
VM 3
16 PGND
VM 4
15 PGND
NC 5
14 OUT1
NC 6
13 NC
7 8 9 10 11 12
Figure 4. QFN Pin Connections
Table 2. QFN Pin Function Description
Pin
Number
Pin Name
1, 2, 3, 4
VM
5, 6, 13, 18
NC
7 VDD
8 IN1
9 IN2
10 EN
11 LGND
12 GIN
14 OUT1
15, 16
PGND
17 OUT2
19 GOUT
20 CRES
21 C2H
22 C2L
23 C1H
24 C1L
Formal Name
Motor Drive Power Supply
No Connect
Logic Supply
Logic Input Control 1
Logic Input Control 2
Enable Control
Logic Ground
Gate Driver Input
Output 1
Power Ground
Output 2
Gate Driver Output
Pre-Driver Power Supply
Charge Pump 2H
Charge Pump 2L
Charge Pump 1H
Charge Pump 1L
Definition
Driver power supply voltage input pin.
This pin is not used.
Control circuit power supply pin.
Control signal input 1.
Control signal input 2.
Enable control signal input pin.
Logic ground pin.
LOW = True control signal for GOUT pin.
Driver output 1 (right half of H-Bridge).
Driver ground pin.
Driver output 2 (left half of H-Bridge).
Output gate driver signal to external MOSFET switch.
Pre-driver circuit power supply pin.
Charge pump bucket capacitor 2 (positive pole).
Charge pump bucket capacitor 2 (negative pole).
Charge pump bucket capacitor 1 (positive pole).
Charge pump bucket capacitor 1 (negative pole).
17511A
4
Analog Integrated Circuit Device Data
Freescale Semiconductor

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ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding the ratings may cause a malfunction or permanent
damage to the device.
Rating
Symbol
Value
Unit
Motor Supply Voltage
Charge Pump Output Voltage
Logic Supply Voltage
Signal Input Voltage (EN, IN1, IN2, GIN)
Driver Output Current
Continuous
Peak (1)
VM
VCRES
VDD
VIN
IO
IOPK
-0.5 to 8.0
-0.5 to 14.0
-0.5 to 7.0
-0.5 to VDD+0.5
1.0
3.0
V
V
V
V
A
ESD Voltage (2)
Human Body Model
Machine Model
VESD1
VESD2
±1800
± 100
V
Storage Temperature Range
Operating Ambient Temperature
Operating Junction Temperature
Thermal Resistance (3)
Power Dissipation (4)
Soldering Temperature (5)
Peak Package Reflow Temperature During Reflow (6), (7)
TSTG
TA
TJ
RθJA
PD
TSOLDER
TPPRT
-65 to 150
-20 to 65
-20 to 150
150
830
260
Note 7
°C
°C
°C
°C/W
mW
°C
°C
Notes
1. TA = 25°C, 10 ms pulse width at 200 ms intervals.
2. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ), ESD2 testing is performed in
accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 ).
3. 37 x 50 x 1.6 [mm] glass EPOXY board mount.
4. Maximum at TA = 25°C.
5. Soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
6. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
7. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
Analog Integrated Circuit Device Data
Freescale Semiconductor
17511A
5