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Product Brief
December 2006
Revision 1.0
WPCN384U
Legacy-Reduced SuperI/O with Two Serial Ports, Parallel
Port and GPIOs for Notebook and Docking Applications
General Description
The WPCN384U, a member of the Winbond LPC SuperI/O
family, is targeted for a wide range of notebook and docking
applications. The WPCN384U is PC2001 and ACPI compli-
ant, and features two Serial Ports, Parallel Port and General-
Purpose Input/Output (GPIO) support for a total of 21 ports.
The WPCN384U is an optimized solution for notebook
systems requiring no FIR Port, and for LPC-based docking
stations implementing an on-board SuperI/O.
Outstanding Features
Pin and software compatible with the Winbond 87384
Two Serial Ports
LPC bus interface, based on Intel’s LPC Interface
Specification Revision 1.1, August 2002 (supports
CLKRUN and LPCPD signals)
PC2001 and ACPI Revision 3.0 compliant
IEEE 1284 Parallel Port
21 GPIO ports, including 14 with IRQ assertion capa-
bility
Two testability modes (XOR Tree and TRI-STATE®
device pins).
5V tolerant and back-drive protected pins (except LPC
bus pins)
64-pin TQFP package
System Block Diagram
South Bridge
I/O
Ports
Parallel
Port
Interface
LPC Bus
WPCN384U
TPM
(WPCT200)
EC
(WPC876xL)
Serial
Interface
Serial
Interface
Portable
Platform
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Features
Two Serial Ports (SP1 and SP2)
Software compatible with the 16550A and the 16450
Shadow register support for write-only bit monitoring
UART data rates up to 1.5 Mbaud
IEEE 1284-Compliant Parallel Port
ECP, with Level 2 (14 mA sink and source output
buffers)
Software or hardware control
Enhanced Parallel Port (EPP) compatible with EPP
1.7 and EPP 1.9
Supports EPP as mode 4 of the Extended Control
Register (ECR)
Selection of internal pull-up or pull-down resistor for
Paper End (PE) pin
Supports a demand DMA mode mechanism and a
DMA fairness mechanism for improved bus utilization
Protection circuit that prevents damage to the
parallel port when a printer connected to it is pow-
ered up or is operated at high voltages (in both
cases, even if the WPCN384U is in power-down
state)
21 General-Purpose I/O (GPIO) Ports
Supports IRQ assertion
Programmable drive type for each output pin (open-
drain, push-pull or output disable)
Programmable option for internal pull-up resistor on
each input pin
Output lock option
Input debounce mechanism
LPC System Interface
8-bit I/O cycles
LPCPD and CLKRUN support
Implements PCI mobile design guide recommenda-
tion (PCI Mobile Design Guide 1.1, Dec. 18, 1998)
PC2001 and ACPI 3.0 Compliant
PnP Configuration Register structure
Flexible resource allocation for all logical devices
Relocatable base address
15 IRQ routing options
Optional 8-bit DMA channels (where applicable)
selected from four possible DMA channels
Clock Sources
14.318 MHz or 48 MHz clock input
LPC clock, 0 or 30 MHz to 33 MHz
Strap Configuration
Base Address (BADDR) strap to determine the base
address of the Index-Data register pair
Strap Inputs to select testability mode
Power Supply
3.3V supply operation
All pins are 5V tolerant, except LPC bus pins
All pins are back-drive protected, except LPC bus pins
Testability
XOR Tree
TRI-STATE device pins
Internal Block Diagram
14.31818 MHz
Clock
Generator
Parallel Port Interface
IEEE 1284
Parallel Port
LPC Interface
Bus
Interface
48 MHz
GPIO Ports
Serial Port
Serial Port
Ports
I/O
Serial
Interface
Serial
Interface
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Revision 1.0

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Physical Dimensions
All dimensions are in millimeters
64-Pin Thin Quad Flatpack (TQFP)
Order Number WPCN384U_0MG
(Replace “_” with chip revision: A, B, and so on)
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment intended
for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic
signal instruments, combustion control instruments, or for other applications intended to support or sustain life. Furthermore, Win-
bond products are not intended for applications wherein failure of Winbond products could result or lead to a situation wherein
personal injury, death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify
Winbond for any damages resulting from such improper use or sales.
Headquarters
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
FAX: 886-3-5665577
http://www.winbond.com.tw/
Taipei Office
9F, No.480, Rueiguang Rd.,
Neihu District, Taipei, 114,
Taiwan, R.O.C.
TEL: 886-2-8177-7168
FAX: 886-2-8751-3579
Winbond Electronics Corporation America
2727 North First Street, San Jose,
CA 95134, U.S.A.
TEL: 1-408-9436666
FAX: 1-408-5441798
Winbond Electronics (Shanghai) Ltd.
27F, 2299 Yan An W. Rd. Shanghai,
200336 China
TEL: 86-21-62365999
FAX: 86-21-62365998
Winbond Electronics Corporation Japan
7F Daini-ueno BLDG, 3-7-18
Shinyokohama Kohoku-ku,
Yokohama, 222-0033
TEL: 81-45-4781881
FAX: 81-45-4781800
Winbond Electronics (H.K.) Ltd.
Unit 9-15, 22F, Millennium City,
No. 378 Kwun Tong Rd.,
Kowloon, Hong Kong
TEL: 852-27513100
FAX: 852-27552064
For Advanced PC Product Line information contact: APC.Support@winbond.com
Please note that all data and specifications are subject to change without notice.
All the trademarks of products and companies mentioned in this product brief belong to their respective owners.
www.winbond.com