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No. STSE-CC7174A
<Cat.No.070718>
www.DataSheet4U.com
SPECIFICATIONS FOR NICHIA CHIP TYPE WARM WHITE LED
MODEL : NSSL100DT
NICHIA CORPORATION
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Nichia STSE-CC7174A
<Cat.No.070718>
1.SPECIFICATIONS
(1) Absolute Maximum Ratings
Item
Forward Current
Pulse Forward Current
Reverse Voltage
Power Dissipation
Operating Temperature
www.DataSheeSt4tUo.croamge Temperature
Soldering Temperature
Symbol
IF
IFP
VR
PD
Topr
Tstg
Tsld
IFP Conditions : Pulse Width <= 10msec.
Absolute Maximum Rating
35
110
5
123
-30 ~ + 85
-40 ~ +100
Reflow Soldering : 260°C
Hand Soldering : 350°C
and Duty <= 1/10
(Ta=25°C)
Unit
mA
mA
V
mW
°C
°C
for 10sec.
for 3sec.
(2) Initial Electrical/Optical Characteristics
Item Symbol Condition
Forward Voltage
VF IF=20[mA]
Reverse Current
IR VR= 5[V]
Luminous Intensity
Iv IF=20[mA]
x
Chromaticity Coordinate
y
- IF=20[mA]
- IF=20[mA]
Please refer to CIE 1931 chromaticity diagram.
Typ.
(3.2)
-
(1150)
0.41
0.39
(Ta=25°C)
Max. Unit
3.5 V
50 µA
- mcd
--
--
(3) Ranking
Item Symbol Condition
Rank W Iv IF=20[mA]
Luminous Intensity Rank V Iv IF=20[mA]
Rank U Iv IF=20[mA]
Luminous Intensity Measurement allowance is ± 10%.
Min.
1240
880
620
(Ta=25°C)
Max. Unit
1760 mcd
1240 mcd
880 mcd
Color Ranks
x 0.3575
y 0.3612
0.3610
0.3850
(IF=20mA,Ta=25°C)
Rank d1
0.3780 0.3988 0.3897 0.3720
0.3970 0.4116 0.3823 0.3714
Rank d2
x 0.3545 0.3575 0.3720 0.3897 0.3822 0.3667
y 0.3408 0.3612 0.3714 0.3823 0.3580 0.3484
Rank e1
x 0.3897 0.3988 0.4162 0.4390 0.4255 0.4053
y 0.3823 0.4116 0.4200 0.4310 0.4000 0.3907
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Nichia STSE-CC7174A
<Cat.No.070718>
Rank e2
x 0.3822 0.3897 0.4053 0.4255 0.4129 0.3954
y 0.3580 0.3823 0.3907 0.4000 0.3725 0.3642
Rank f3
x 0.4255 0.4390 0.4680 0.4519
y 0.4000 0.4310 0.4385 0.4086
Rank f4
x 0.4519 0.4680 0.4970 0.4770
y 0.4086 0.4385 0.4466 0.4137
Rank f5
Rank f6
www.DataSheet4Ux.com 0.4129 0.4255 0.4519 0.4355
x 0.4355 0.4519 0.4770
y 0.3725 0.4000 0.4086 0.3785
y 0.3785 0.4086 0.4137
Color Coordinates Measurement allowance is ± 0.01.
Basically, a shipment shall consist of the LEDs of a combination of the above ranks.
The percentage of each rank in the shipment shall be determined by Nichia.
0.4588
0.3838
2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS
Please refer to figure’s page.
3.OUTLINE DIMENSIONS AND MATERIALS
Please refer to figure’s page.
Material as follows ; Package
: Ceramics
Encapsulating Resin : Silicone Resin (with Phosphor)
Electrodes
: Au Plating
4.PACKAGING
· The LEDs are packed in cardboard boxes after taping.
Please refer to figure’s page.
The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity
· In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.
· The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,
so precautions must be taken to prevent any damage.
· The boxes are not water resistant and therefore must be kept away from water and moisture.
· When the LEDs are transported, we recommend that you use the same packing method as Nichia.
5.LOT NUMBER
The first six digits number shows lot number.
The lot number is composed of the following characters;
-U
- Year ( 6 for 2006, 7 for 2007 )
- Month ( 1 for Jan., 9 for Sep., A for Oct.,
- Nichia's Product Number
U - Ranking by Color Coordinates
- Ranking by Luminous Intensity
B for Nov. )
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Nichia STSE-CC7174A
<Cat.No.070718>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Standard
Test Item
Test Method
Resistance to
JEITA ED-4701
Soldering Heat
300 301
(Reflow Soldering)
Solderability
JEITA ED-4701
(Reflow Soldering)
300 303
www.DataSheTeht4eUrm.coaml Shock
JEITA ED-4701
300 307
Temperature Cycle
JEITA ED-4701
100 105
Moisture Resistance Cyclic JEITA ED-4701
200 203
High Temperature Storage JEITA ED-4701
200 201
Temperature Humidity
JEITA ED-4701
Storage
100 103
Low Temperature Storage JEITA ED-4701
200 202
Steady State Operating Life
Condition 1
Steady State Operating Life
Condition 2
Steady State Operating Life
of High Temperature
Steady State Operating Life
of High Humidity Heat
Steady State Operating Life
of Low Temperature
Vibration
JEITA ED-4701
400 403
Substrate Bending
JEITA ED-4702
Test Conditions
Tsld=260°C, 10sec.
(Pre treatment 30°C,70%,168hrs.)
Tsld=215 ± 5°C, 3sec.
(Lead Solder)
0°C ~ 100°C
15sec. 15sec.
-40°C ~ 25°C ~ 100°C ~ 25°C
30min. 5min. 30min. 5min.
25°C ~ 65°C ~ -10°C
90%RH 24hrs./1cycle
Ta=100°C
Ta=60°C, RH=90%
Ta=-40°C
Ta=25°C, IF=20mA
Ta=25°C, IF=35mA
Ta=85°C, IF=10mA
60°C, RH=90%, IF=20mA
Ta=-30°C, IF=20mA
100 ~ 2000 ~ 100Hz Sweep 4min.
200m/s2
3directions, 4cycles
3mm, 5 ± 1 sec.
Note
2 times
Number of
Damaged
0/50
1 time
over 95%
20 cycles
100 cycles
10 cycles
1000 hrs.
1000 hrs.
1000 hrs.
1000 hrs.
1000 hrs.
1000 hrs.
500 hrs.
1000 hrs.
48min.
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
1 time
0/50
Adhesion Strength
JEITA ED-4702 5N, 10 ± 1 sec.
1 time
0/50
(2) CRITERIA FOR JUDGING DAMAGE
Criteria for Judgement
Item
Symbol Test Conditions
Min.
Max.
Forward Voltage
VF IF=20mA
- U.S.L.*) 1.1
Reverse Current
IR VR=5V
- U.S.L.*) 2.0
Luminous Intensity
IV
IF=20mA
L.S.L.**) 0.7
-
*) U.S.L. : Upper Standard Level
**) L.S.L. : Lower Standard Level
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Nichia STSE-CC7174A
<Cat.No.070718>
7.CAUTIONS
The LEDs are devices which are materialized by combining Blue LEDs and special phosphors.
Consequently, the color of the LEDs is changed a little by an operating current.
Care should be taken after due consideration when using LEDs.
(1) Moisture Proof Package
· When moisture is absorbed into the SMT package it may vaporize and expand during soldering.
There is a possibility that this can cause exfoliation of the contacts and damage to the optical
www.DataSheect4hUa.rcaomcteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture
to a minimum in the package.
· The moisture proof package is made of an aluminum moisture proof bag. A package of
a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag.
The silica gel changes its color from blue to pink as it absorbs moisture.
(2) Storage
· Storage Conditions
Before opening the package :
The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a
year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel)
is recommended.
After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered
within 168 hours (7days) after opening the package. If unused LEDs remain, they should be
stored in moisture proof packages, such as sealed containers with packages of moisture absorbent
material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag
and to reseal the moisture proof bag again.
· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage
time, baking treatment should be performed using the following conditions.
Baking treatment : more than 24 hours at 65 ± 5°C
· Nichia LED electrodes are gold plated. The gold surface may be affected by environments which
contain corrosive substances. Please avoid conditions which may cause the LED to corrode, tarnish
or discolor. This corrosion or discoloration may cause difficulty during soldering operations.
It is recommended that the User use the LEDs as soon as possible.
· Please avoid rapid transitions in ambient temperature, especially in high humidity environments where
condensation can occur.
(3) Heat Generation
· Thermal design of the end product is of paramount importance. Please consider the heat generation
of the LED when making the system design. The coefficient of temperature increase per input
electric power is affected by the thermal resistance of the circuit board and density of LED placement
on the board, as well as other components. It is necessary to avoid intense heat generation and operate
within the maximum ratings given in this specification.
· The operating current should be decided after considering the ambient maximum temperature of LEDs.
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