SPN02N60S5
Maximum Ratings
Parameter
Drain Source voltage slope
VDS = 480 V, ID = 1.8 A, Tj = 125 °C
Thermal Characteristics
www.DataSheePt4Ua.rcaommeter
Thermal resistance, junction - soldering point
SMD version, device on PCB:
@ min. footprint
@ 6 cm2 cooling area 1)
Soldering temperature,
1.6 mm (0.063 in.) from case for 10s
Symbol
dv/dt
Value
20
Unit
V/ns
Symbol
RthJS
RthJA
Tsold
min.
-
Values
typ. max.
30 -
Unit
K/W
- 110 --
- - 70
- - 260 °C
Electrical Characteristics, at Tj=25°C unless otherwise specified
Parameter
Symbol Conditions
min.
Drain-source breakdown voltage
Drain-Source avalanche
breakdown voltage
V(BR)DSS VGS=0V, ID=0.25mA
V(BR)DS VGS=0V, ID=1.8A
600
-
Gate threshold voltage
Zero gate voltage drain current
VGS(th)
IDSS
ID=80µΑ, VGS=VDS
VDS=600V, VGS=0V,
Tj=25°C,
Tj=150°C
3.5
-
-
Gate-source leakage current
IGSS
Drain-source on-state resistance RDS(on)
VGS=20V, VDS=0V
VGS=10V, ID=1.1A,
Tj=25°C
Tj=150°C
-
-
-
Values
typ. max.
--
700 -
4.5 5.5
0.5 1
- 50
- 100
2.5 3
6.8 -
Unit
V
µA
nA
Ω
Rev. 2.1
Page 2
2004-03-30