CL325.pdf 데이터시트 (총 7 페이지) - 파일 다운로드 CL325 데이타시트 다운로드

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CL325
3-Channel 25mA Linear LED Driver
Features
±6% current accuracy @ 4.0 -15V
90V standoff voltage
Separate enable pins for each channel allow for
www.DataSheePt4WU.Mcomdimming
Over-temperature protection
8-Lead SOIC (w/Heat Slug) package
Applications
LCD backlighting
Indicator lamps
General Description
The CL325 is designed to drive 3 strings of LEDs at a
constant current of 25mA.
Other drivers with currents in the range of 20 - 30mA are
available. The drive current is fixed, with a ±6% tolerance
over a VOUT range of 4 - 15V.
Separate enable pins for each channel allow for PWM
dimming, 3-step linear dimming, or individual disconnection
of faulty LED strings.
Over-temperature protection circuitry shuts down all 3
channels when the nominal die temperature reaches 135°C.
Normal operation resumes when the die temperature drops
by 30°C.
The CL325 is available in the 8-Lead SOIC (w/Heat Slug)
package and requires a single ceramic bypass capacitor
which may be shared among several drivers.
Block Diagram and Typical Application Circuit
6.5 - 90V
Host
Controller
CIN
100nF
8
VIN
REG VDD
1 EN1
2 EN2
3 EN3
7
OUT1
6
OUT2
5
OUT3
CL325
GND
4

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CL325
Ordering Information
Device
8-Lead SOIC (w/Heat Slug)
CL325
CL325SG-G
-G indicates package is RoHS compliant (‘Green’)
Pin Configuration
OUT3
OUT2
OUT1
VIN
Underside plate
is ground
GND
EN3
EN2
EN1
8-Lead SOIC (w/Heat Slug) (SG)
www.DataSAhebet4sUo.colmute Maximum Ratings
Parameter
Value
Supply voltage, VIN
Output voltage, VOUT
Enable voltage, VEN
Operating temperature(1)
-0.5V to +100V
-0.5V to +100V
-0.5V to +6.5V
-40°C
Storage temperature
-65°C to +150°C
Absolute Maximum Ratings are those values beyond which damage to
the device may occur. Functional operation under these conditions is not
implied. Continuous operation of the device at the absolute rating level
may affect device reliability. All voltages are referenced to device ground.
Note:
(1) Maximum junction temperature internally limited.
Product Marking
YYWW
CL325
LLLL
YY = Year Sealed
WW = Week Sealed
L = Lot Number
= “Green” Packaging
8-Lead SOIC (w/Heat Slug) (SG)
Recommended Operating Conditions (all voltages with respect to GND pin)
Sym Parameter
Min Typ Max Units Conditions
VIN
VOUT
Supply voltage
Output voltage
6.5 - 90 V ---
15 V EN = 0
4.0 -
90 V EN = 1
fEN Enable toggling frequency
TJ Junction temperature
CIN VIN capacitor
0 - 100 kHz ---
-40 - 119 oC ---
- 100 -
nF ---
Thermal Characteristics
Sym Parameter
θJA
Thermal resistance,
junction to ambient
TLIM Over-temperature limit
THYS Over-temperature hysteresis
Min Typ Max Units Conditions
- 48 - OC/W Mounted on JEDEC test PCB (2s 2p)
120 135 150
- 30 -
OC ---
OC ---
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CL325
Electrical Characteristics
(Over recommended operating conditions. TJ @ 25OC unless otherwise specified.)
Sym Parameter
Min Typ
Max
IIN VIN supply current
- 220 250
- 2.2 2.3
IOUT(OFF) Output current, off
- 4.0 10
- - 26.5
IOUT(ON) Output current, on
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VEN(OFF)
CEN
IENL
IENH
tON
tRISE
tOFF
tFALL
Enable voltage, on
Enable voltage, off
Enable input capacitance
Enable low input current
Enable high input current
Enable on delay
Output current rise time
Enable off delay
Output current fall time
23.5 25.0 26.5
22.5 25.0 27.5
- - 0.8
2.4 -
-
- 5.0 10
- - 1.0
- - 1.0
- 2.0 2.4
- 1.0 1.2
- 440 800
- 170 250
Units Conditions
µA EN1-3 = 1
mA EN1-3 = 0
µA ENX = 1
ENX = 0, VOUT = 0 - 4.0V
mA ENX = 0, VOUT = 4.0 - 15V
ENX = 0, VOUT = 15 - 90V
V ---
V ---
pF ---
µA VEN = 0V
µA VEN = 5.0V
µs ---
µs ---
ns ---
ns ---
Timing
EN
VEN(ON)
tON
tRISE
IOUT
VEN(OFF)
tOFF
90% IOUT(ON)
10% IOUT(ON)
tFALL
Temperature Effects
1.05
1.00
0.95
0.90
0.85
0.80
-50
-40
0 25 50
100 120
Junction Temperature (°C)
150
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CL325
Load Regulation
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1.20
1.00
0.80
0.60
0.40
0.20
00
scale change
5 10 15 20 40 60 80 100
VOUT (V)
Pin Description
Pin #
1,2,3
4
5,6,7
8
Name
Description
EN1, EN2,
EN3
Output enable, active low.
GND
Circuit common.
OUT1, OUT2,
OUT3
Constant current output (sinking). Connect the cathodes of the LEDs to these pins.
VIN Supply voltage. 6.5V to 90V. Bypass locally with a 100nF capacitor to ground.
Underside
Plate
GND
The exposed underside plate is internally connected to the GND pin. The plate may either
be left floating or connected to ground. Solder the plate to an exposed copper area on the
PCB for heatsinking purposes (see recommended layout).
Recommended PCB Layout
1cm2 exposed copper
1cm2 exposed copper
Underside plate soldered
to copper area
Exposed copper area
may be plated
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Higher LED Current
VLL
CL325
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Host
Controller
CIN
100nF
8
VIN
REG VDD
1 EN1
2 EN2
3 EN3
7
OUT1
6
OUT2
5
OUT3
CL325
GND
4
By paralleling outputs, higher LED currents can be achieved. In addition, linear dimming in 3 discrete steps may be obtained
by enabling 1, 2, or 3 outputs.
Lowering CL325 Power Dissipation: Separate VIN Supply
VLL
Host
Controller
VIN
CIN
100nF
8
VIN
REG VDD
1 EN1
2 EN2
3 EN3
7
OUT1
6
OUT2
5
OUT3
CL325
GND
4
CL325 power dissipation may be lowered by supplying the CL325 from a voltage source (VIN) that is lower in voltage than
the LED supply (VLL).
5