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MN101C74F, MN101C74G
www.DataSheet4U.com
Type
Internal ROM type
ROM (byte)
RAM (byte)
Package (Lead-free)
Minimum Instruction
Execution Time
MN101C74F
MN101C74G
MN101CF74G
Mask ROM
FLASH
96K 128K
6K
LQFP100-P-1414, MLGA100-L-1010, QFP100-P-1818B
0.1 µs (at 3.0 V to 3.6 V, 10 MHz)
0.235 µs (at 1.8 V to 3.6 V, 4.25 MHz)*
62.5 µs (at 1.8 V to 3.6 V, 32 kHz)*
* The lower limit for operation guarantee for flash memory built-in type is 2.2 V.
Interrupts
RESET, Watchdog, External 0 to 5, External 6 (key interrupt dedicated), Timer 0 to 3, Timer 6, Timer 7 (2 systems), Timer 8 (2
systems), Time base, Serial 0 (2 systems), Serial 1 (2 systems), Serial 3, A/D conversion finish, Automatic transfer finish
Timer Counter
Timer counter 0 : 8-bit × 1
(square-wave/8-bit PWM output, event count, generation of remote control carrier, simple pulse width measurement,
added pluse (2-bit) system PWM output)
(square-wave/PWM output to large current terminal PC3 possible)
Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input
Interrupt source ........... coincidence with compare register 0
Timer counter 1 : 8-bit × 1 (square-wave output, event count, synchronous output event)
Clock source................ 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input; timer counter 8 output
Interrupt source ........... coincidence with compare register 1
Timer counter 0, 1 can be cascade-connected.
Timer counter 2 : 8-bit × 1
(square-wave output, added pluse (2-bit) system PWM output, PWM output, serial transfer clock output, event count,
synchronous output event, simple pulse width measurement)
(square-wave/PWM output to large current terminal PC5 possible)
Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input
Interrupt source ........... coincidence with compare register 2
Timer counter 3 : 8-bit × 1
(square-wave output, event count, generation of remote control carrier, serial transfer clock)
Clock source................ 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input
Interrupt source ........... coincidence with compare register 3
Timer counter 2, 3 can be cascade-connected.
Timer counter 6 : 8-bit freerun timer
Clock source................ 1/1 of system clock frequency; 1/1, 1/128, 1/8192 of OSC oscillation clock frequency; 1/1, 1/128, 1/8192
of XI oscillation clock frequency
Interrupt source ........... coincidence with compare register 6
Timer counter 7 : 16-bit × 1
(square-wave output, 16-bit PWM output (cycle / duty continuous variable), event count, synchronous output event,
pulse width measurement, input capture, real time output control, high performance IGBT output (Cycle/Duty can be
changed constantly))
(square-wave/PWM output to large current terminal PC4 possible)
Clock source................ 1/1, 1/2, 1/4, 1/16 of system clock frequency; 1/1, 1/2, 1/4, 1/16 of OSC oscillation clock frequency; 1/1,
1/2, 1/4, 1/16 of external clock input frequency
Interrupt source ........... coincidence with compare register 7 (2 lines), input capture register
MAD00048DEM

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MN101C74F, MN101C74G
wwwT.iDmaetarSchoeuent4teUr.c8om: 16 bit × 1
(square-wave/16-bit PWM output [duty continuous variable], event count, pulse width measurement, input capture)
(square-wave/PWM output to large current terminal PC6 possible)
Clock source................ 1/1, 1/2, 1/4, 1/16 of system clock frequency; 1/1, 1/2, 1/4, 1/16 of OSC oscillation clock frequency; 1/1,
1/2, 1/4, 1/16 of external clock input frequency
Interrupt source ........... coincidence with compare register 8 (2 lines), input capture register
Timer counters 7, 8 can be cascade-connected. (square-wave output, PWM is possible as a 32-bit timer.)
Time base timer (one-minute count setting)
Clock source................ 1/1 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency
Interrupt source ........... 1/128, 1/256, 1/512, 1/1024, 1/4096, 1/8192, 1/16384, 1/32768, of clock source frequency
Watchdog timer
Interrupt source ........... 1/65536, 1/262144, 1/1048576 of system clock frequency
Serial interface
Serial 0 : synchronous type/UART (full-duplex) × 1
Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 1 or 2; 1/2, 1/4, 1/16, 1/64 of OSC
oscillation clock frequency, external clock
Serial 1 : synchronous type/UART (full-duplex) × 1
Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 2 or 3; 1/2, 1/4, 1/16, 1/64 of OSC
oscillation clock frequency, external clock
Serial 3 : synchronous type/single-master I²C × 1
Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 2 or 3; 1/2, 1/4, 1/16, 1/32 of OSC
oscillation clock frequency, external clock
Serial 4 : I²C slave × 1 (Applicable for I²C high-speed transfer mode, 7-bit/10-bit address setting, general call)
DMA controller
Max. Transfer cycles 255
Starting factor external request, various types of interrupt, software
Transfer mode 1-byte transfer, word transfer, burst transfer
I/O Pins
I/O
87 Common use , Specified pull-up resistor available, Input/output selectable (bit unit)
A/D converter
10-bit × 16-ch. (with S/H)
Display control function
LCD
47 segments × 4 commons (static, 1/2, 1/3, or 1/4 duty)
LCD power supply separated from VDD (usable if VDD VLCD 3.6 V)
LCD power step-up circuit contained (3/2, 2 and 3 times)
LCD power shunt resistance contained
Special Ports
Buzzer output, remote control carrier signal output, high-current drive port
ROM Correction
Correcting address designation : up to 7 addresses possible
MAD00048DEM

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Ewwlewc.tDriactaaSl hCeheta4rUa.ccotrmeistics (Supply current)
Parameter
Operating supply current
Supply current at HALT
Supply current at STOP
Symbol
Condition
IDD1
IDD2
IDD3
IDD4
IDD5
IDD6
fosc = 4 MHz , VDD = 3 V
fx = 32 kHz , VDD = 3 V
fx = 32 kHz , VDD = 3 V, Ta = 25°C
fx = 32 kHz , VDD = 3 V , Ta = –40°C to +85°C
VDD = 3 V , Ta = 25°C
VDD = 3 V , Ta = –40°C to +85°C
Development tools
In-circuit Emulator
PX-ICE101C/D+PX-PRB101C74-QFP100-P-1818B-M
PX-ICE101C/D+PX-PRB101C74-LQFP100-P-1414-M
Pin Assignment
Limit
Unit
min typ max
1.1 1.9 mA
6 20 µA
3 6 µA
13 µA
2 µA
10 µA
A7, SEG24, P57
A8, SEG23, P60
A9, SEG22, P61
A10, SEG21, P62
A11, SEG20, P63
A12, SEG19, P64
A13, SEG18, P65
A14, SEG17, P66
A15, SEG16, P67
A16, SEG15, P70
A17, SEG14, P71
SEG13, P72
SEG12, P73
SEG11, P74
SEG10, P75
SEG9, P76
SEG8, P77
SEG7, P80
SEG6, P81
SEG5, P82
SEG4, P83
SEG3, P84
SEG2, P85
SEG1, P86
SEG0, P87
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
MN101C74F
MN101C74G
50 P22, IRQ2
49 P21, ACZ1, IRQ1
48 P20, IRQ0
47 P15, TM8IO
46 P14, TM7IO
45 P13, TM3IO
44 P12, TM2IO
43 P11, TM1IO
42 P10, TM0IO, RMOUT
41 PB7, AN15, SBI1, RXD1
40 PB6, AN14, SBO1, TXD1
39 PB5, AN13, SBT1
38 PB4, AN12, SBI0A, RXD0A
37 PB3, AN11, SBO0A, TXD0A
36 PB2, AN10, SBT0A
35 PB1, AN9, SCL4A
34 PB0, AN8, SDA4A
33 PA7, AN7, SBI3A
32 PA6, AN6, SBO3A, SDA3A
31 PA5, AN5, SBT3A, SCL3A
30 PA4, AN4
29 PA3, AN3
28 PA2, AN2
27 PA1, AN1
26 PA0, AN0
QFP100-P-1818B
LQFP100-P-1414
MLGA100-L-1010
MAD00048DEM

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Request for your special attention and precautions in using the technical information and
semiconductors described in this book
www.D(a1)taISf haneyeto4fUt.hceopmroducts or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd. Industrial Co., Ltd.