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WJA1001
+5V Active-Bias InGaP HBT Gain Block
Product Features
50 – 3000 MHz
19 dB Gain @ 900MHz
www.data+s2h0eedtB4um.coPm1dB @ 900MHz
+45 dBm OIP3 @ 900MHz
+5V Single Supply
Low current draw (100 mA)
Unconditionally stable
Internally matched to 50
Robust 1000V ESD, Class 1C
Lead-free/green/RoHS-compliant
SOT-89 package
Applications
GSM, PCS, CDMA, WCDMA
WiMAX, WiBro
Repeaters, BTS Transceivers
RFID
Product Description
Functional Diagram
The WJA1001 is a cascadable gain block that offers high
linearity in a low-cost surface-mount package. At 900 MHz,
the WJA1001 typically provides 19 dB gain, +45 dBm OIP3,
and +20 dBm P1dB. The device is housed in a lead-
free/green/RoHS-compliant SOT-89 SMT package using a
NiPdAu plating to eliminate the possibility of tin whiskering.
GND
4
The WJA1001 consists of a Darlington-pair amplifier using
a high reliability InGaP/GaAs HBT process technology.
The amplifier has been optimized internally to offer very
high linearity performance at 1 GHz while drawing very
low current. The MMIC amplifier is internally matched to
50Ω and only requires DC-blocking capacitors and a bias
inductor for operation. An internal active bias is designed
to enable stable performance over temperature and allow
for operation directly from a +5V supply voltage.
1
RF IN
2
GND
3
RF OUT
Function
Input
Output/Bias
Ground
Pin No.
1
3
2, 4
The broadband amplifier can be directly applied to various
current and next generation wireless technologies such as
GSM, CDMA, W-CDMA, WiBro, and WiMAX. The
WJA1001 is ideal for general purpose applications such as
LO buffering or amplification and pre-driver stages within
the 50 to 3000 MHz frequency range.
Specifications (1)
Typical Performance (3)
Parameter
Operational Bandwidth
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3 (2)
Noise Figure
Device Voltage
Device Current
Units
MHz
MHz
dB
dB
dB
dBm
dBm
dB
V
mA
Min
50
Typ
900
19
12
14
+19.7
+44.5
5.4
5.0
100
Max
3000
1. Test conditions: 25 ºC, Supply Voltage = +5 V, 50 System. S-parameters and 3OIP measured at
device pins. All other specifications measured on evaluation board.
2. 3OIP measured with two tones at an output power of +8 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Parameter Units
Frequency
MHz 200
S21 dB 19.6
S11 dB -13
S22 dB -22
Output P1dB dBm +20.4
Output IP3 (2) dBm +39.7
Noise Figure dB 4.8
Typical
500 900 1900
19.2 18.5 16.7
-15 -18 -30
-20 -15 -11
+20.3 +19.7 +19.2
+39 +44 +34
5.0 5.4 6.1
2100
16.4
-26
-12
+18.1
+34
6.4
3. Listed typical performance parameters measured on evaluation board.
Absolute Maximum Rating
Parameter
Storage Temperature
Supply Voltage
Input Power
θjc (junction to paddle)
Maximum Junction Temperature
Rating
-55 to +150 C
+6.5 V
+24 dBm
80.6 C / W
150 C
Ordering Information
Part No.
WJA1001
WJA1001-PCB
Description
+5V Active Bias InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 Package)
50 – 3000 MHz Fully Assembled Eval. Board
Operation of this device above any of these parameters may cause permanent damage.
Standard tape / reel size = 1000 pieces on a 7reel
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
Page 1 of 4 January 2008

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WJA1001
+5V Active-Bias InGaP HBT Gain Block
Typical Evaluation Board RF Performance
Supply Bias = +5V, Icc = 100 mA
Gainvs. Frequency
25
www.datasheet4u.com
20
15
10
5
-40C +25C +85C
0
0 1000 2000
Frequency (MHz)
0
-5
-10
-15
-20
-25
-30
-35
3000 0
ReturnLoss vs. Frequency
S11 S22
1000 2000
Frequency(MHz)
10
8
6
4
2
0
3000 0
NFvs. Frequency
-40C +25C +85C
1000 2000
Frequency (MHz)
3000
OIP3 vs. Output Power
Frequency=900MHz, T=25C
45
OIP3 vs. Frequency
Pout =8dBm/tone
45
OIP3 vs. Vcc
Frequency=900MHz, T=25C
45
40 40
40
35 35
35
30 30
25 25
0 2 4 6 8 10 12 0
Output Power per tone(dBm)
-40C +25C +85C
1000 2000
Frequency (MHz)
30
25
3000 4.7
4.8 4.9 5 5.1
Supply Voltage (V)
5.2
P1dBvs. Frequency
22
P1dBvs. Vcc
Frequency=900MHz, T=25C
22
Icc vs. Vcc
Frequency=900MHz, T=25C
120
20
18
16
14 -40C +25C +85C
20
18
16
14
110
100
90
80
70
12 12
60
0 1000 2000 3000 4.7 4.8 4.9 5 5.1 5.2 4.7 4.8 4.9 5 5.1 5.2
Frequency (MHz)
SupplyVoltage (V)
Supply Voltage (V)
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
Page 2 of 4 January 2008

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WJA1001
+5V Active-Bias InGaP HBT Gain Block
Vcc =+5.00V
Icc = 100 mA
Application Circuit
www.datasheet4u.com
R4
0
C3
Bypass
Capacitor
RF IN
C1
Blocking
Capacitor
R1
0
L1
RF Choke
WJA1001
R2
0
RF OUT
C2
Blocking
Capacitor
Recommended Component Values (1)
Ref. Name Value / Type
Size
L1 470 nH ferrite core wire wound inductor (2) 0805
C1, C2
1000 pF NPO chip capacitor
0603
C3
R1, R2, R4
C4, C5, C6,
0.018 F chip capacitor
0 (3)
Do Not Place (3)
0603
0603
R3, R5, R6,
R7, R8
1. The listed values are contained on the evaluation board to achieve optimal broadband performance
2. For lower cost and performance (500 – 2000 MHz) option use 39 nH ceramic core wire wound inductor.
3. Place holders for the 0resistors and “Do Not Place” references are not needed for final design.
Typical Device Data
S-Parameters (Vdevice = +5 V, ICC = 100 mA, T = 25 C, calibrated to device leads)
Freq (GHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB)
10
-16.19
-74.53
22.52
170.02
-25.75
50
-13.73
-150.31
20.24
167.55
-23.34
100
-13.40
-165.59
19.82
167.74
-23.16
200
-13.27
-173.49
19.60
162.77
-23.09
400
-12.67
-178.71
19.50
149.81
-23.01
600
-12.13
177.74
19.35
136.50
-22.97
800
-11.99
172.41
19.15
122.68
-22.90
1000
-12.07
163.93
18.99
109.45
-22.85
1200
-12.02
152.87
18.73
94.83
-22.84
1400
-11.71
142.18
18.33
81.54
-22.75
1600
-11.76
132.89
18.10
67.63
-22.81
1800
-12.61
125.70
17.71
53.78
-22.66
2000
-14.95
116.23
17.35
40.27
-22.75
2200
-18.89
100.16
16.88
26.53
-22.71
2400
-24.73
70.36
16.27
12.71
-22.78
2600
-32.51
32.55
15.76
-1.15
-22.67
2800
-28.92
-123.80
15.14
-14.50
-22.65
3000
-18.69
-139.28
14.31
-28.11
-22.55
3200
-13.74
-143.12
13.44
-41.58
-22.62
3400
-10.86
-145.10
12.37
-53.94
-22.64
3600
-9.38
-150.89
11.40
-65.62
-22.59
3800
-8.61
-162.51
10.54
-76.54
-22.46
4000
-7.74
-178.88
9.54
-88.57
-22.15
S12 (ang)
12.97
6.00
2.19
-1.09
-4.76
-8.79
-12.46
-16.03
-19.42
-23.24
-27.41
-30.65
-35.01
-38.53
-41.54
-45.93
-49.54
-53.67
-57.98
-61.93
-65.84
-69.00
-73.94
S22 (dB)
-11.35
-17.22
-18.78
-19.05
-18.29
-17.08
-15.70
-13.92
-12.73
-11.59
-10.74
-9.99
-9.15
-8.48
-8.13
-8.09
-8.09
-7.84
-7.43
-7.02
-6.80
-6.67
-6.65
Device S-parameters are available for Download from the website at: http://www.wj.com
S22 (ang)
-37.50
-110.83
-136.33
-148.58
-151.10
-151.78
-150.91
-151.81
-157.08
-165.19
-173.87
179.93
175.81
171.38
165.83
157.59
148.86
140.92
135.57
130.30
126.09
121.50
116.69
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
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WJA1001
+5V Active-Bias InGaP HBT Gain Block
Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 C reflow temperature) and leaded
(maximum 245 C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
www.datasheet4u.com
Outline Drawing
A1001
XXXX-X
Product Marking
The WJA1001 will be marked with an “A1001”
designator with an alphanumeric lot code
marked below the part designator.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
Land Pattern
ESD Rating: Class 1C
Value:
Passes 1000V min.
Test:
Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value:
Passes 1000V min.
Test:
Charged Device Model (CDM)
Standard: JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260 C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated thru
diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
Page 4 of 4 January 2008