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W25X10, W25X20, W25X40, W25X80
1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT
SERIAL FLASH MEMORY WITH
4KB SECTORS AND DUAL OUTPUT SPI
www.DataSheet4U.com
Publication Release Date: September 22, 2006
- 1 - Preliminary - Revision I

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W25X10, W25X20, W25X40, W25X80
Table of Contents-
1. GENERAL DESCRIPTION ......................................................................................................... 4
2. FEATURES ................................................................................................................................. 4
3. PIN CONFIGURATION SOIC 150-MIL....................................................................................... 5
4. PIN CONFIGURATION SOIC 208-MIL....................................................................................... 5
5. PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 5
6. PIN CONFIGURATION WSON 6X5-MM .................................................................................... 6
7. PIN DESCRIPTION..................................................................................................................... 6
7.1 Package Types ............................................................................................................... 7
7.2 Chip Select (/CS) ............................................................................................................ 7
7.3 Serial Data Output (DO) ................................................................................................. 7
7.4 Write Protect (/WP)......................................................................................................... 7
7.5 HOLD (/HOLD) ............................................................................................................... 7
7.6 Serial Clock (CLK) .......................................................................................................... 7
7.7 Serial Data Input / Output (DIO) ..................................................................................... 7
8. BLOCK DIAGRAM ...................................................................................................................... 8
9. FUNCTIONAL DESCRIPTION ................................................................................................... 9
9.1
www.DataSheet4U.com9.2
SPI OPERATIONS ......................................................................................................... 9
9.1.1 SPI Modes ........................................................................................................................9
9.1.2 Dual Output SPI................................................................................................................9
9.1.3 Hold Function ...................................................................................................................9
WRITE PROTECTION.................................................................................................. 10
9.2.1 Write Protect Features....................................................................................................10
10. CONTROL AND STATUS REGISTERS................................................................................... 11
10.1
STATUS REGISTER .................................................................................................... 11
10.1.1 BUSY............................................................................................................................11
10.1.2 Write Enable Latch (WEL) ............................................................................................11
10.1.3 Block Protect Bits (BP2, BP1, BP0)..............................................................................11
10.1.4 Top/Bottom Block Protect (TB) .....................................................................................11
10.1.5 Reserved Bits ...............................................................................................................11
10.1.6 Status Register Protect (SRP) ......................................................................................12
10.1.7 Status Register Memory Protection ..............................................................................13
10.2
INSTRUCTIONS........................................................................................................... 14
10.2.1 Manufacturer and Device Identification.........................................................................14
10.2.2 Instruction Set (1)...........................................................................................................15
10.2.3 Write Ensable (06h)......................................................................................................16
10.2.4 Write Disable (04h).......................................................................................................16
-2-

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W25X10, W25X20, W25X40, W25X80
10.2.5 Read Status Register (05h) ..........................................................................................17
10.2.6 Write Status Register (01h) ..........................................................................................18
10.2.7 Read Data (03h) ...........................................................................................................19
10.2.8 Fast Read (0Bh) ...........................................................................................................20
10.2.9 Fast Read Dual Output (3Bh) .......................................................................................21
10.2.10 Page Program (02h) ...................................................................................................22
10.2.11 Sector Erase (20h) .....................................................................................................23
10.2.12 Block Erase (D8h) ......................................................................................................24
10.2.13 Chip Erase (C7h)........................................................................................................25
10.2.14 Power-down (B9h) ......................................................................................................26
10.2.15 Release Power-down / Device ID (ABh) .....................................................................27
10.2.16 Read Manufacturer / Device ID (90h) .........................................................................29
10.2.17 JEDEC ID (9Fh)..........................................................................................................30
11. ELECTRICAL CHARACTERISTICS (PRELIMINARY) (4) ....................................................... 31
11.1 Absolute Maximum Ratings (1) .................................................................................... 31
11.2 Operating Ranges......................................................................................................... 31
11.3 Endurance and Data Retention .................................................................................... 32
11.4 Power-up Timing and Write Inhibit Threshold .............................................................. 32
11.5 DC Electrical Characteristics ........................................................................................ 33
11.6 AC Measurement Conditions........................................................................................ 34
11.7 AC Electrical Characteristics ........................................................................................ 35
11.8 AC Electrical Characteristics (cont’d) ........................................................................... 36
11.9 Serial Output Timing ..................................................................................................... 37
www.DataSheet4U.com11.10 Input Timing................................................................................................................. 37
11.11 Hold Timing ................................................................................................................. 37
12. PACKAGE SPECIFICATION .................................................................................................... 38
12.1 8-Pin SOIC 150-mil (Package Code SN)...................................................................... 38
12.2 8-Pin SOIC 208-mil (Package Code SS)...................................................................... 39
12.3 8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 40
12.4 8-contact 6x5 WSON .................................................................................................... 41
12.5 8-contact 6x5 WSON Cont’d. ....................................................................................... 42
13. ORDERING INFORMATION (1)................................................................................................. 43
14. REVISION HISTORY ................................................................................................................ 44
Publication Release Date: September 22, 2006
- 3 - Preliminary - Revision I

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W25X10, W25X20, W25X40, W25X80
1. GENERAL DESCRIPTION
The W25X10 (1M-bit), W25X20 (2M-bit), W25X40 (4M-bit) and W25X80 (8M-bit) Serial Flash
memories provide a storage solution for systems with limited space, pins and power. The 25X series
offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code
download applications as well as storing voice, text and data. The devices operate on a single 2.7V to
3.6V power supply with current consumption as low as 5mA active and 1µA for power-down. All
devices are offered in space-saving packages.
The W25X10/20/40/80 array is organized into 512/1024/2048/4096 programmable pages of 256-bytes
each. Up to 256 bytes can be programmed at a time using the Page Program instruction. Pages can
be erased in groups of 16 (sector erase), groups of 256 (block erase) or the entire chip (chip erase).
The W25X10/20/40/80 has 32/64/128/256 erasable sectors and 2/4/8/16 erasable blocks respectively.
The small 4KB sectors allow for greater flexibility in applications that require data and parameter
storage. (See figure 2.)
The W25X10/20/40/80 supports the standard Serial Peripheral Interface (SPI), and a high
performance dual output SPI using four pins: Serial Clock, Chip Select, Serial Data I/O and Serial
Data Out. SPI clock frequencies of up to 75MHz are supported allowing equivalent clock rates of
150MHz when using the Fast Read Dual Output instruction. These transfer rates are comparable to
those of 8 and 16-bit Parallel Flash memories.
A Hold pin, Write Protect pin and programmable write protect, with top or bottom array control
features, provide further control flexibility. Additionally, the device supports JEDEC standard
manufacturer and device identification.
2. FEATURES
Family of Serial Flash Memories
W25X10: 1M-bit / 128K-byte (131,072)
W25X20: 2M-bit / 256K-byte (262,144)
www.DataSheet4UW.co2m5X40: 4M-bit / 512K-byte (524,288)
W25X80: 8M-bit / 1M-byte (1,048,576)
– 256-bytes per programmable page
– Uniform 4K-byte Sectors / 64K-byte Blocks
SPI with Single or Dual Outputs
– Clock, Chip Select, Data I/O, Data Out
– Optional Hold function for SPI flexibility
Data Transfer up to 150M-bits / second
– Clock operation to 75MHz
– Fast Read Dual Output instruction
Auto-increment Read capability
Flexible Architecture with 4KB sectors
– Sector Erase (4K-bytes)
– Block Erase (64K-byte)
Page program up to 256 bytes <2ms
Up to 100,000 erase/write cycles
20-year retention
Low Power Consumption, Wide
Temperature Range
– Single 2.7 to 3.6V supply
– 5mA active current, 1µA Power-down (typ)
– -40° to +85°C operating range
Software and Hardware Write Protection
– Write-Protect all or portion of memory
– Enable/Disable protection with /WP pin
Top or bottom array protection
Space Efficient Packaging
– 8-pin SOIC 150-mil (W25X10/20/40)
– 8-pin SOIC 208-mil (W25X40/80)
– 8-pin PDIP 300-mil (W25X10/20/40/80)
– 8-pin WSON 6x5-mm (W25X10/20/40/80)
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W25X10, W25X20, W25X40, W25X80
3. PIN CONFIGURATION SOIC 150-MIL
Figure 1a. W25X10, W25X20 and W25X40 Pin Assignments, 8-pin SOIC (Package Code SN)
4. PIN CONFIGURATION SOIC 208-MIL
Figure 1bW25X40 and W25X80 Pin Assignments, 8-pin SOIC (Package Code SS)
www.DataSheet4U.com
5. PIN CONFIGURATION PDIP 300-MIL
Figure 1cW25X10, W25X20, W25X40 and W25X80 Pin Assignments, 8-pin PDIP (Package Code DA)
Publication Release Date: September 22, 2006
- 5 - Preliminary - Revision I