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VLMT3100
Vishay Semiconductors
Low Current SMD LED PLCC-2
19225
DESCRIPTION
These new devices have been designed to meet the
increasing demand for low current SMD LEDs.
The package of the VLMT3100 is the PLCC-2
(equivalent to a size B tantalum capacitor).
It consists of a lead frame which is embedded in a
white thermoplast. The reflector inside this package is
www.DatfailSlehdeeut4pUw.coitmh clear epoxy.
PRODUCT GROUP AND PACKAGE DATA
• Product group: LED
• Package: SMD PLCC-2
• Product series: Low current
• Angle of half intensity: ± 60°
FEATURES
• SMD LED with exceptional brightness
• Compatible with automatic placement
equipment
• EIA and ICE standard package
e3
• Compatible with infrared, vapor phase and
wave solder processes according to CECC
• Available in 8 mm tape
• Low profile package
• Non-diffused lens: excellent for coupling to light
pipes and backlighting
• Very low power consumption
• Luminous intensity ratio in one packaging unit
IVmax/IVmin 1.6
• Lead (Pb)-free device
• Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
• Automotive qualified AEC-Q101
APPLICATIONS
• Automotive:
backlighting in dashboards and switches
• Telecommunication:
indicator and backlighting in telephone and fax
• Indicator and backlight for audio and video
equipment
• Indicator and backlight for battery driven equipment
• Small indicator for outdoor applications
• Indicator and backlight in office equipment
• Flat backlight for LCDs, switches and symbols
• General use
PARTS TABLE
PART
VLMT3100
COLOR, LUMINOUS INTENSITY
Red, IV = 2.5 mcd (typ.)
TECHNOLOGY
GaAsP on GaP
Document Number 81710
Rev. 1.0, 01-Jun-07
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VLMT3100
Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS1) VLMT3100
PARAMETER
Reverse voltage2)
DC Forward current
Surge forward current
Power dissipation
Junction temperature
Operating temperature range
Storage temperature range
Soldering temperature
Thermal resistance junction/
ambient
TEST CONDITION
tp 10 μs
t5s
mounted on PC board
(pad size > 16 mm2)
SYMBOL
VR
IF
IFSM
PV
Tj
Tamb
Tstg
Tsd
RthJA
Note:
1) Tamb = 25 °C, unless otherwise specified
2) Driving the LED in reverse direction is suitable for short term application
VALUE
6
7
0.5
20
100
- 40 to + 100
- 40 to + 100
260
500
OPTICAL AND ELECTRICAL CHARACTERISTICS1) VLMT3100, RED
PARAMETER
Luminous intensity 2)
Dominant wavelength
Peak wavelength
TEST CONDITION
IF = 2 mA
IF = 2 mA
IF = 2 mA
SYMBOL
IV
λd
λp
MIN
0.28
612
TYP.
2.5
635
Angle of half intensity
Forward voltage
Reverse voltage
IF = 2 mA
IF = 2 mA
IR = 10 μA
ϕ ± 60
VF 2.2
VR 6 15
Junction capacitance
VR = 0, f = 1 MHz
Cj
50
Note:
1) Tamb = 25 °C, unless otherwise specified
2) In one Packing Unit IVmax/IVmin 1.6
LUMINOUS INTENSITY CLASSIFICATION
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LUMINOUS INTENSITY (MCD)
GROUP
MIN.
MAX.
C1 0.28 0.36
C2 0.36 0.45
D1 0.45 0.56
D2 0.56 0.71
E1 0.71 0.90
Note:
Luminous intensity is tested at a current pulse duration of 25 ms and
an accuracy of ± 11 %.
The above type numbers represent the order groups which include
only a few brightness groups. Only one group will be shipped on
each reel (there will be no mixing of two groups on each reel). In
order to ensure availability, single brightness groups will not be
orderable.
In a similar manner for colors where wavelength groups are
measured and binned, single wavelength groups will be shipped on
any one reel.
In order to ensure availability, singe wavelength groups will not be
orderable.
UNIT
V
mA
A
mW
°C
°C
°C
°C
K/W
MAX
625
2.9
UNIT
mcd
nm
nm
deg
V
V
pF
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Document Number 81710
Rev. 1.0, 01-Jun-07

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TYPICAL CHARACTERISTICS
Tamb = 25 °C, unless otherwise specified
10
8
6
4
2
0
0 20 40 60 80 100
95 10842
Tamb - Ambient Temperature (°C)
Figure 1. Forward Current vs. Ambient Temperature
0° 10° 20°
30°
40°
1.0
0.9 50°
0.8 60°
70°
0.7
8
95 10319 0.6 0.4 0.2 0 0.2 0.4 0.6
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Figure 2. Rel. Luminous Intensity vs. Angular Displacement
100
red
10
1
tP/T = 0.001
0.1 tP = 10 µs
01
23
45
95 10050
VF - Forward Voltage (V)
Figure 3. Forward Current vs. Forward Voltage
Document Number 81710
Rev. 1.0, 01-Jun-07
VLMT3100
Vishay Semiconductors
2.0
red
1.6
1.2
0.8
0.4
IF = 2 mA
0
0 20 40 60 80 100
95 10051
Tamb - Ambient Temperature (°C)
Figure 4. Rel. Luminous Intensity vs. Ambient Temperature
2.4
red
2.0
1.6
1.2
0.8
0.4
0
10
95 10321 1
20
0.5
50 100 200
0.2 0.1 0.05
500 IF (mA)
0.02 tP/T
Figure 5. Rel. Lumin. Intensity vs. Forw. Current/Duty Cycle
100
red
10
1
0.1
0.01
0.1
1
10 100
95 10061
IF - Forward Current (mA)
Figure 6. Relative Luminous Intensity vs. Forward Current
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VLMT3100
Vishay Semiconductors
1.2
red
1.0
0.8
0.6
0.4
0.2
0
590
95 10040
610 630 650 670
λ - Wavelength (nm)
690
Figure 7. Relative Intensity vs. Wavelength
METHOD OF TAPING/POLARITY AND TAPE AND REEL
SMD LED (VLM.3 - SERIES)
Vishay’s LEDs in SMD packages are available in an
antistatic 8 mm blister tape (in accordance with DIN
IEC 40 (CO) 564) for automatic component insertion.
The blister tape is a plastic strip with impressed
component cavities, covered by a top tape.
Adhesive Tape
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Blister Tape
REEL PACKAGE DIMENSION IN MM FOR
SMD LEDS, TAPE OPTION GS08
(= 1500 PCS.)
120°
10.0
9.0
Identification
Label:
Vishay
Type
Group
Tape Code
Production
Code
Quantity
4.5
3.5
2.5
1.5
13.00
12.75
63.5
60.5
180 14.4 max.
178
94 8665
Figure 9. Reel dimensions - GS08
Component Cavity
94 8670
TAPING OF VLM.3...
3.5
3.1
2.2
2.0
5.75
5.25
3.6 8.3
3.4 7.7
4.0
3.6
1.85
1.65
1.6 4.1
1.4 3.9
4.1
3.9
0.25
2.05
1.95
94 8668
Figure 8. Tape dimensions in mm for PLCC-2
REEL PACKAGE DIMENSION IN MM FOR
SMD LEDS, TAPE OPTION GS18
(= 8000 PCS.) PREFERRED
120°
10.4
8.4
Identification
Label:
Vishay
Type
Group
Tape Code
Production
Code
Quantity
4.5
3.5
2.5
1.5
13.00
12.75
62.5
60.0
321 14.4 max.
329
18857
Figure 10. Reel dimensions - GS18
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Document Number 81710
Rev. 1.0, 01-Jun-07

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SOLDERING PROFILE
IR Reflow Soldering Profile for lead (Pb)-free soldering
Preconditioning acc. to JEDEC Level 2a
300
250
255 °C
240 °C
217 °C
200
150
100
max. 120 s
max. 260 °C
245 °C
max. 30 s
max. 100 s
50 max. Ramp Up 3 °C/s
max. Ramp Down 6 °C/s
0
0
19885
50
100 150 200 250 300
Time (s)
max. 2 cycles allowed
Figure 11. Vishay Lead (Pb)-free Reflow Soldering Profile
(acc. to J-STD-020C)
TTW Soldering (acc. to CECC00802)
948626-1
300
5s
Lead Temperature
250
235 °C...260 °C
first wave
200
second
wave
full line: typical
dotted line: process limits
ca. 2 K/s
ca. 200 K/s
150
100 °C...130 °C
100
50
0
0
2 K/s
forced cooling
ca. 5 K/s
50 100 150 200
Time (s)
250
Figure 12. Double wave soldering of opto devices (all packages)
BARCODE-PRODUCT-LABEL
EXAMPLE:
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A
106
H
VISHAY
37
BC D E F
G 20126
A) Type of componenent
B) Manufacturing plant
C) SEL - Selection code (Bin):
e.g.: J1 = code for luminous intensity group
3 = code for color Group
D) Date code year/week
E) Day code (e.g. 1: Monday)
F) Batch no.
G) Total quantity
H) Company code
Document Number 81710
Rev. 1.0, 01-Jun-07
VLMT3100
Vishay Semiconductors
DRY PACKING
The reel is packed in an anti-humidity bag to protect
the devices from absorbing moisture during
transportation and storage.
Aluminum bag
Label
15973
Reel
FINAL PACKING
The sealed reel is packed into a cardboard box. A
secondary cardboard box is used for shipping
purposes.
RECOMMENDED METHOD OF STORAGE
Dry box storage is recommended as soon as the
aluminum bag has been opened to prevent moisture
absorption. The following conditions should be
observed, if dry boxes are not available:
• Storage temperature 10 °C to 30 °C
• Storage humidity 60 % RH max.
After more than 672 hours under these conditions
moisture content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover
to the former condition by drying under the following
condition:
192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH
(dry air/nitrogen) or
96 hours at 60 °C + 5 °C and < 5 % RH for all device
containers or
24 hours at 100 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC Standard JESD22-A112 Level 2a label
is included on all dry bags.
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