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S3C8275/F8275/C8278
/F8278/C8274/F8274
8-BIT CMOS
MICROCONTROLLERS
USER'S MANUAL
Revision 1.2

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Important Notice
The information in this publication has been carefully
checked and is believed to be entirely accurate at the
time of publication. Samsung assumes no
responsibility, however, for possible errors or
omissions, or for any consequences resulting from
the use of the information contained herein.
Samsung reserves the right to make changes in its
products or product specifications with the intent to
improve function or design at any time and without
notice and is not required to update this
documentation to reflect such changes.
This publication does not convey to a purchaser of
semiconductor devices described herein any license
under the patent rights of Samsung or others.
Samsung makes no warranty, representation, or
guarantee regarding the suitability of its products for
any particular purpose, nor does Samsung assume
any liability arising out of the application or use of any
product or circuit and specifically disclaims any and
all liability, including without limitation any
consequential or incidental damages.
"Typical" parameters can and do vary in different
applications. All operating parameters, including
"Typicals" must be validated for each customer
application by the customer's technical experts.
Samsung products are not designed, intended, or
authorized for use as components in systems
intended for surgical implant into the body, for other
applications intended to support or sustain life, or for
any other application in which the failure of the
Samsung product could create a situation where
personal injury or death may occur.
Should the Buyer purchase or use a Samsung
product for any such unintended or unauthorized
application, the Buyer shall indemnify and hold
Samsung and its officers, employees, subsidiaries,
affiliates, and distributors harmless against all claims,
costs, damages, expenses, and reasonable attorney
fees arising out of, either directly or indirectly, any
claim of personal injury or death that may be
associated with such unintended or unauthorized use,
even if such claim alleges that Samsung was
negligent regarding the design or manufacture of said
product.
S3C8275/F8275/C8278/F8278/C8274/F8274 8-Bit CMOS Microcontrollers
User's Manual, Revision 1.2
Publication Number: 21.2-S3-C8275/F8275/C8278/F8278/C8274/F8274-082005
© 2005 Samsung Electronics
All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted in any
form or by any means, electric or mechanical, by photocopying, recording, or otherwise, without the prior written
consent of Samsung Electronics.
Samsung Electronics' microcontroller business has been awarded full ISO-14001
certification (BSI Certificate No. FM24653). All semiconductor products are
designed and manufactured in accordance with the highest quality standards and
objectives.
Samsung Electronics Co., Ltd.
San #24 Nongseo-Ri, Giheung- Eup
Yongin-City, Gyeonggi-Do, Korea
C.P.O. Box #37, Suwon 449-900
TEL: (82)-(031)-209-1934
FAX: (82)-(031)-209-1889
Home-Page URL: Http://www.samsungsemi.com
Printed in the Republic of Korea

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NOTIFICATION OF REVISIONS
ORIGINATOR:
Samsung Electronics, LSI Development Group, Ki-Heung, South Korea
PRODUCT NAME:
S3C8275/F8275/C8278/F8278/C8274/F8274 8-bit CMOS Microcontroller
DOCUMENT NAME:
S3C8275/F8275/C8278/F8278/C8274/F8274 User's Manual, Revision 1.2
DOCUMENT NUMBER: 21.2-S3- C8275/F8275/C8278/F8278/C8274/F8274 -082005
EFFECTIVE DATE:
August, 2005
SUMMARY:
As a result of additional product testing and evaluation, some specifications
published in the S3C8275/F8275/C8278/F8278/C8274/F8274 User's Manual,
Revision 1, have been changed. These changes for S3C8275/F8275/C8278/
F8278/C8274/F8274 microcontroller, which are described in detail in the
Revision Descriptions section below, are related to the
followings:
— Chapter 16. Embedded flash memory interface
— Chapter 17. Electrical Data
DIRECTIONS:
Please note the changes in your copy (copies) of the S3C8275/F8275/C8278/
F8278/C8274/F8274 User's Manual, Revision 1. Or, simply attach the Revision
Descriptions of the next page to S3C8275/F8275/C8278/F8278/C8274/F8274
User's Manual, Revision 1.
Revision
0
1
1.1
1.2
REVISION HISTORY
Date
February, 2005
April, 2005
July, 2005
August, 2005
Remark
Preliminary spec for internal release only.
First edition. Reviewed by Finechips.
Second edition. Reviewed by Finechips.
Third edition. Reviewed by Finechips.

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REVISION DESCRIPTIONS
1. ELECTRICAL DATA
Table 17-12. A.C. Electrical Characteristics for Internal Flash ROM
(TA = – 25 °C to + 85 °C, VDD = 2.0 V to 3.6 V)
Parameter
Symbol
Conditions
Programming time (1)
Ftp –
Chip erasing time (2)
Ftp1
Sector erasing time (3)
Ftp2
Data access time
FtRS
Min Typ
30 –
10 –
10 –
– 25
Number of writing/erasing
FNwe
––
Max
10,000(4)
Unit
µs
ms
ms
ns
Times
NOTES:
1. The programming time is the time during which one byte (8-bit) is programmed.
2. The chip erasing time is the time during which all 16K byte block is erased.
3. The sector erasing time is the time during which all 128 byte block is erased.
4. Maximum number of writing/erasing is 10,000 times for full-flash(S3F8275) and 100 times for half-flash
(S3F8278/F8274).
5. The chip erasing is available in Tool Program Mode o nly.
2. CONDITION OF OPERATING VOLTAGE
Condition of operating voltage is modified “fx = 0 – 4.2MHz” to “fx = 0.4 – 4.2MHz” at 2.0V – 3.6V and “fx = 0–8MHz”
to “fx = 0.4 – 8MHz” at 2.5V – 3.6V in the page 17-2.
3. CHAPTHER 16. EMBEDDED FLASH MEMORY INTERFACE
This chapter is modified for only S3F8275.

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Preface
The S3C8275/F8275/C8278/F8278/C8274/F8274 Microcontroller User's Manual is designed for application designers
and programmers who are using the S3C8275/F8275/C8278/F8278/C8274/F8274 microcontroller for application
development. It is organized in two main parts:
Part I
Programming Model
Part II
Hardware Descriptions
Part I contains software-related information to familiarize you with the microcontroller's architecture, programming
model, instruction set, and interrupt structure. It has six chapters:
Chapter 1
Chapter 2
Chapter 3
Product Overview
Address Spaces
Addressing Modes
Chapter 4
Chapter 5
Chapter 6
Control Registers
Interrupt Structure
Instruction Set
Chapter 1, "Product Overview," is a high-level introduction to S3C8275/F8275/C8278/F8278/C8274/F8274 with
general product descriptions, as well as detailed information about individual pin characteristics and pin circuit types.
Chapter 2, "Address Spaces," describes program and data memory spaces, the internal register file, and register
addressing. Chapter 2 also describes working register addressing, as well as system stack and user-defined stack
operations.
Chapter 3, "Addressing Modes," contains detailed descriptions of the addressing modes that are supported by the
S3C8-series CPU.
Chapter 4, "Control Registers," contains overview tables for all mapped system and peripheral control register values,
as well as detailed one-page descriptions in a standardized format. You can use these easy-to-read, alphabetically
organized, register descriptions as a quick-reference source when writing programs.
Chapter 5, "Interrupt Structure," describes the S3C8275/F8275/C8278/F8278/C8274/F8274 interrupt structure in
detail and further prepares you for additional information presented in the individual hardware module descriptions in
Part II.
Chapter 6, "Instruction Set," describes the features and conventions of the instruction set used for all S3C8-series
microcontrollers. Several summary tables are presented for orientation and reference. Detailed descriptions of each
instruction are presented in a standard format. Each instruction description includes one or more practical examples
of how to use the instruction when writing an application program.
A basic familiarity with the information in Part I will help you to understand the hardware module descriptions in Part
II. If you are not yet familiar with the S3C8-series microcontroller family and are reading this manual for the first time,
we recommend that you first read Chapters 1–3 carefully. Then, briefly look over the detailed information in Chapters
4, 5, and 6. Later, you can reference the information in Part I as necessary.
Part II "hardware Descriptions," has detailed information about specific hardware components of the
S3C8275/F8275/C8278/F8278/C8274/F8274 microcontroller. Also included in Part II are electrical, mechanical, Flash
MCU, and development tools data. It has 14 chapters:
Chapter 7
Chapter 8
Chapter 9
Chapter 10
Chapter 11
Chapter 12
Chapter 13
Clock Circuit
RESET and Power-Down
I/O Ports
Basic Timer
Timer 1
Watch Timer
LCD Controller/Driver
Chapter 14
Chapter 15
Chapter 16
Chapter 17
Chapter 18
Chapter 19
Chapter 20
Serial I/O Interface
Battery Level Detector
Embedded Flash Memory Interface
Electrical Data
Mechanical Data
S3F8275/F8278/F8274 Flash MCU
Development Tools
Two order forms are included at the back of this manual to facilitate customer order for
S3C8275/F8275/C8278/F8278/C8274/F8274 microcontrollers: the Mask ROM Order Form, and the Mask Option
Selection Form. You can photocopy these forms, fill them out, and then forward them to your local Samsung Sales
Representative.
S3C8275/F8275/C8278/F8278/C8274/F8274 MICROCONTROLLER
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