LURF42741-C2.pdf 데이터시트 (총 5 페이지) - 파일 다운로드 LURF42741-C2 데이타시트 다운로드

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LIGITEK ELECTRONICS CwOw.w,L.DTatDaS.heet4U.com
Property of Ligitek Only
SUPER BRIGHT TOWER TYPE LED LAMPS
LURF42741/C2
DATA SHEET
DOC. NO : QW0905-LURF42741/C2
REV. : A
DATE : 23 - Sep. -2005

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PART NO. LURF42741/C2
Package Dimensions
3.62
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
www.DPaatagSehee1t4/4U.com
3.86
2.92
1.5MAX
0.5
TYP
2.35
2.95
25.0MIN
2.54TYP
+-
1.0MIN
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
0°
-30° 30°
-60° 60°
100% 75% 50% 25% 0 25% 50% 75% 100%

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PART NO. LURF42741/C2
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
www.DPaatagSehe2et/44U.com
Absolute Maximum Ratings at Ta=25
Parameter
Forward Current
Peak Forward Current
Duty 1/10@10KHz
Power Dissipation
Reverse Current @5V
Electrostatic Discharge
Operating Temperature
Storage Temperature
Soldering Temperature
Symbol
IF
IFP
PD
Ir
ESD
Topr
Tstg
Tsol
Ratings
URF
UNIT
50 mA
130 mA
120 mW
10 μA
2000
V
-40 ~ +85
-40 ~ +100
Max 260for 5 sec Max
(2mm from body)
Typical Electrical & Optical Characteristics (Ta=25 )
PART NO MATERIAL
COLOR
Emitted
Lens
Dominant Spectral Forward Luminous
wave halfwidth voltage
intensity
length △λnm @20mA(V) @20mA(mcd)
λDnm
Min. Max. Min. Typ.
Viewing
angle
2θ1/2
(deg)
LURF42741/C2 AlGaInP Red Red Transparent 630
20 1.5 2.4 900 1800 44
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.

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PART NO.LURF42741/C2
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
www.DPaatagSheee3t4/4U.com
Typical Electro-Optical Characteristics Curve
URF CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
1000
100
10
1.0
0.1
1.0
1.5 2.0 2.5
Forward Voltage(V)
3.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
1.0
10 100
Forward Current(mA)
1000
Fig.3 Forward Voltage vs. Temperature
1.2
1.1
1.0
0.9
0.8
-40 -20
-0
20 40 60 80 100
Ambient Temperature()
Fig.4 Relative Intensity vs. Temperature
3.0
2.5
2.0
1.5
1.0
0.5
0
-40 -20 -0 20 40 60 80 100
Ambient Temperature()
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0
550
600 650
Wavelength (nm)
700

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PART NO. LURF42741/C2
Reliability Test:
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
www.DPataSgheee4t4/U4.com
Test Item
Operating Life Test
High Temperature
Storage Test
Low Temperature
Storage Test
Test Condition
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
1.Ta=105 ℃±5
2.t=1000 hrs (-24hrs, +72hrs)
1.Ta=-40 ℃±5
2.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
The purpose of this is the resistance of
the device which is laid under ondition
of high temperature for hours.
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Reference
Standard
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
MIL-STD-883:1008
JIS C 7021: B-10
JIS C 7021: B-12
High Temperature
High Humidity Test
Thermal Shock Test
Solder Resistance
Test
Solderability Test
1.Ta=65 ℃±5
2.RH=90 %~95 %
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hous.
MIL-STD-202:103B
JIS C 7021: B-11
1.Ta=105 ℃±5&-40℃±5
(10min) (10min)
2.total 10 cycles
1.T.Sol=260 ℃±5
2.Dwell time= 10 ±1sec.
1.T.Sol=230 ℃±5
2.Dwell time=5 ±1sec
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
This test intended to see soldering well
performed or not.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2