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Freescale Semiconductor
Data Sheet: Product Preview
Document Number: K10P104M100SF2
Rev. 1, 11/2010
K10 Sub-Family Data Sheet
Supports the following:
MK10N512VLL100, MK10N512VML100
Features
Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 105°C
Performance
– Up to 100 MHz ARM Cortex-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
Memories and memory interfaces
– Up to 512 KB program flash memory on non-
FlexMemory devices
– Up to 128 KB RAM
– Serial programming interface (EzPort)
– FlexBus external bus interface
Clocks
– 1 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
System peripherals
– 10 low-power modes to provide power optimization
based on application requirements
– Memory protection unit with multi-master
protection
– 16-channel DMA controller, supporting up to 64
request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– Hardware random-number generator
– 128-bit unique identification (ID) number per chip
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K10P104M100SF2
Human-machine interface
– Low-power hardware touch sensor interface (TSI)
– General-purpose input/output
Analog modules
– 16-bit SAR ADC with PGA (x64)
– 12-bit DAC
– Analog comparator (CMP) containing a 6-bit DAC
and programmable reference input
– Voltage reference
Timers
– Programmable delay block
– Eight-channel motor control/general purpose/PWM
timers
– Two-channel quadrature decoder/general purpose
timers
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
Communication interfaces
– Controller Area Network (CAN) module
– SPI modules
– I2C modules
– UART modules
– Secure Digital host controller (SDHC)
– I2S
This document contains information on a product under development. Freescale
reserves the right to change or discontinue this product without notice.
© 2010–2010 Freescale Semiconductor, Inc.
Preliminary

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Table of Contents
1 Ordering parts...........................................................................4
6.1 Core modules....................................................................19
1.1 Determining valid orderable parts......................................4
6.1.1 Debug trace timing specifications.........................19
2 Part identification......................................................................4
6.1.2 JTAG electricals....................................................20
2.1 Description.........................................................................4
6.2 System modules................................................................23
2.2 Format...............................................................................4
6.3 Clock modules...................................................................23
2.3 Fields.................................................................................4
6.3.1 MCG Specifications...............................................23
2.4 Example............................................................................5
6.3.2 Oscillator Electrical Characteristics.......................25
3 Terminology and guidelines......................................................5
6.3.2.1 Oscillator DC Electrical Specifications 25
3.1 Definition: Operating requirement......................................5
6.3.2.2 Oscillator frequency specifications......26
3.2 Definition: Operating behavior...........................................6
6.3.3 32kHz Oscillator Electrical Characteristics............27
3.3 Definition: Attribute............................................................6
6.3.3.1 32kHz Oscillator DC Electrical
3.4 Definition: Rating...............................................................7
Specifications......................................27
3.5 Result of exceeding a rating..............................................7
6.3.3.2 32kHz Oscillator Frequency
3.6 Relationship between ratings and operating
Specifications......................................27
requirements......................................................................7
6.4 Memories and memory interfaces.....................................28
3.7 Guidelines for ratings and operating requirements............8
6.4.1 Flash (FTFL) Electrical Characteristics.................28
3.8 Definition: Typical value.....................................................8
6.4.1.1 Flash Timing Parameters — Program
3.9 Typical Value Conditions...................................................9
and Erase............................................28
4 Ratings......................................................................................9
6.4.1.2 Flash Timing Parameters —
4.1 Thermal handling ratings...................................................9
Commands..........................................28
4.2 Moisture handling ratings..................................................10
6.4.1.3 Flash (FTFL) Current and Power
4.3 ESD handling ratings.........................................................10
Parameters..........................................29
4.4 Voltage and current operating ratings...............................10
6.4.1.4 Reliability Characteristics....................29
5 General.....................................................................................11
6.4.2 EzPort Switching Specifications............................29
5.1 Nonswitching electrical specifications...............................11
6.4.3 Flexbus Switching Specifications..........................30
5.1.1 Voltage and Current Operating Requirements......11
6.5 Security and integrity modules..........................................32
5.1.2 LVD and POR operating requirements.................12
6.6 Analog...............................................................................32
5.1.3 Voltage and current operating behaviors..............13
6.6.1 ADC electrical specifications.................................32
5.1.4 Power mode transition operating behaviors..........13
6.6.1.1 16-bit ADC operating conditions..........33
5.1.5 Power consumption operating behaviors..............14
6.6.1.2 16-bit ADC electrical characteristics....35
5.1.5.1 Diagram: Typical IDD_RUN operating
6.6.1.3 16-bit ADC with PGA operating
behavior...............................................16
conditions............................................38
5.1.6 EMC radiated emissions operating behaviors.......17
6.6.1.4 16-bit ADC with PGA characteristics...39
5.1.7 Designing with radiated emissions in mind...........18
6.6.2 CMP and 6-bit DAC electrical specifications.........40
5.1.8 Capacitance attributes..........................................18
www.Da5t.a2ShSeweitt4chUin.cgoemlectrical specifications.....................................18
6.6.3 12-bit DAC electrical characteristics.....................41
6.6.3.1 12-bit DAC operating requirements.....41
5.3 Thermal specifications.......................................................18
6.6.3.2 12-bit DAC operating behaviors..........42
5.3.1 Thermal operating requirements...........................18
6.6.4 Voltage Reference Electrical Specifications..........44
5.3.2 Thermal attributes.................................................19
6.7 Timers................................................................................45
6 Peripheral operating requirements and behaviors....................19
6.8 Communication interfaces.................................................45
K10 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
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Preliminary
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6.8.1 DSPI Switching Specifications for Low-speed
Operation..............................................................46
6.8.2 DSPI Switching Specifications (High-speed
mode)....................................................................47
6.8.3 SDHC Specifications.............................................49
6.8.4 I2S Switching Specifications.................................50
6.9 Human-machine interfaces (HMI)......................................52
6.9.1 General Switching Specifications..........................52
6.9.2 TSI Electrical Specifications..................................52
7 Dimensions...............................................................................53
7.1 Obtaining package dimensions.........................................53
8 Pinout........................................................................................54
8.1 K10 Signal Multiplexing and Pin Assignments..................54
8.2 K10 Pinouts.......................................................................57
9 Revision History........................................................................58
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K10 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
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