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Freescale Semiconductor
Data Sheet: Product Preview
Document Number: K10P81M100SF2
Rev. 4, 3/2011
K10 Sub-Family Data Sheet
Supports the following:
MK10N512VLK100, MK10N512VMB100
Features
Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 105°C
Performance
– Up to 100 MHz ARM Cortex-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
Memories and memory interfaces
– Up to 512 KB program flash memory on non-
FlexMemory devices
– Up to 128 KB RAM
– Serial programming interface (EzPort)
– FlexBus external bus interface
Clocks
– 3 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
System peripherals
– 10 low-power modes to provide power optimization
based on application requirements
– Memory protection unit with multi-master
protection
– 16-channel DMA controller, supporting up to 64
request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– 128-bit unique identification (ID) number per chip
www.DataSheet4U.com
K10P81M100SF2
Human-machine interface
– Low-power hardware touch sensor interface (TSI)
– General-purpose input/output
Analog modules
– Two 16-bit SAR ADCs
– Programmable gain amplifier (up to x64) integrated
into each ADC
– 12-bit DAC
– Three analog comparators (CMP) containing a 6-bit
DAC and programmable reference input
– Voltage reference
Timers
– Programmable delay block
– Eight-channel motor control/general purpose/PWM
timer
– Two 2-channel quadrature decoder/general purpose
timers
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
Communication interfaces
– Two Controller Area Network (CAN) modules
– Two SPI modules
– Two I2C modules
– Four UART modules
– Secure Digital host controller (SDHC)
– I2S module
This document contains information on a product under development. Freescale
reserves the right to change or discontinue this product without notice.
© 2010–2011 Freescale Semiconductor, Inc.
Preliminary

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Table of Contents
1 Ordering parts...........................................................................3
5.3.2 Thermal attributes.................................................18
1.1 Determining valid orderable parts......................................3
6 Peripheral operating requirements and behaviors....................19
2 Part identification......................................................................3
6.1 Core modules....................................................................19
2.1 Description.........................................................................3
6.1.1 Debug trace timing specifications.........................19
2.2 Format...............................................................................3
6.1.2 JTAG electricals....................................................20
2.3 Fields.................................................................................3
6.2 System modules................................................................23
2.4 Example............................................................................4
6.3 Clock modules...................................................................23
3 Terminology and guidelines......................................................4
6.3.1 MCG specifications...............................................23
3.1 Definition: Operating requirement......................................4
6.3.2 Oscillator electrical specifications.........................26
3.2 Definition: Operating behavior...........................................5
6.3.3 32kHz Oscillator Electrical Characteristics............28
3.3 Definition: Attribute............................................................5
6.4 Memories and memory interfaces.....................................28
3.4 Definition: Rating...............................................................6
6.4.1 Flash (FTFL) electrical specifications....................29
3.5 Result of exceeding a rating..............................................6
6.4.2 EzPort Switching Specifications............................30
3.6 Relationship between ratings and operating
6.4.3 Flexbus Switching Specifications..........................31
requirements......................................................................6
6.5 Security and integrity modules..........................................33
3.7 Guidelines for ratings and operating requirements............7
6.6 Analog...............................................................................33
3.8 Definition: Typical value.....................................................7
6.6.1 ADC electrical specifications.................................33
3.9 Typical value conditions....................................................8
6.6.2 CMP and 6-bit DAC electrical specifications.........41
4 Ratings......................................................................................8
6.6.3 12-bit DAC electrical characteristics.....................44
4.1 Thermal handling ratings...................................................9
6.6.4 Voltage reference electrical specifications............47
4.2 Moisture handling ratings..................................................9
6.7 Timers................................................................................48
4.3 ESD handling ratings.........................................................9
6.8 Communication interfaces.................................................48
4.4 Voltage and current operating ratings...............................9
6.8.1 CAN switching specifications................................49
5 General.....................................................................................10
6.8.2 DSPI switching specifications (low-speed mode)..49
5.1 Nonswitching electrical specifications...............................10
6.8.3 DSPI switching specifications (high-speed mode) 50
5.1.1 Voltage and current operating requirements.........10
6.8.4 I2C switching specifications..................................52
5.1.2 LVD and POR operating requirements.................11
6.8.5 UART switching specifications..............................52
5.1.3 Voltage and current operating behaviors..............11
6.8.6 SDHC specifications.............................................52
5.1.4 Power mode transition operating behaviors..........12
6.8.7 I2S switching specifications..................................53
5.1.5 Power consumption operating behaviors..............13
6.9 Human-machine interfaces (HMI)......................................55
5.1.6 EMC radiated emissions operating behaviors.......16
6.9.1 TSI electrical specifications...................................55
5.1.7 Designing with radiated emissions in mind...........17
7 Dimensions...............................................................................56
5.1.8 Capacitance attributes..........................................17
7.1 Obtaining package dimensions.........................................56
5.2 Switching specifications.....................................................17
8 Pinout........................................................................................56
5.2.1 Device clock specifications...................................17
www.DataSh5e.2e.t24U.Gcoemneral switching specifications...........................17
8.1 K10 Signal Multiplexing and Pin Assignments..................56
8.2 K10 Pinouts.......................................................................61
5.3 Thermal specifications.......................................................18
9 Revision History........................................................................62
5.3.1 Thermal operating requirements...........................18
K10 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
2
Preliminary
Freescale Semiconductor, Inc.

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Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to http://www.freescale.com and perform a part number
search for the following device numbers: PK10 and MK10.
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
Q K## M FFF T PP CCC N
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
Q
Description
Qualification status
Values
• M = Fully qualified, general market flow
• P = Prequalification
K## Kinetis family
www.DMataSheet4U.com Flash memory type
• K10
• N = Program flash only
• X = Program flash and FlexMemory
Table continues on the next page...
K10 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
Freescale Semiconductor, Inc.
Preliminary
3