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Freescale Semiconductor
Data Sheet: Technical Data
K30 Sub-Family Data Sheet
Supports the following:
MK30DX128ZVLQ10,
MK30DX128ZVMD10,
MK30DX256ZVLQ10,
MK30DX256ZVMD10,
MK30DN512ZVLQ10,
MK30DN512ZVMD10
Features
Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 105°C
Performance
– Up to 100 MHz ARM Cortex-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
Memories and memory interfaces
– Up to 512 KB program flash memory on non-
FlexMemory devices
– Up to 128 KB RAM
– Serial programming interface (EzPort)
– FlexBus external bus interface
Clocks
– 3 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
System peripherals
– 10 low-power modes to provide power optimization
based on application requirements
– Memory protection unit with multi-master
protection
– 16-channel DMA controller, supporting up to 64
request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
Document Number: K30P144M100SF2
Rev. 6, 9/2011
K30P144M100SF2
Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– 128-bit unique identification (ID) number per chip
Human-machine interface
– Segment LCD controller supporting up to 40
frontplanes and 8 backplanes, or 44 frontplanes and
4 backplanes
– Low-power hardware touch sensor interface (TSI)
– General-purpose input/output
Analog modules
– Two 16-bit SAR ADCs
– Programmable gain amplifier (PGA) (up to x64)
integrated into each ADC
– Two 12-bit DACs
– Three analog comparators (CMP) containing a 6-bit
DAC and programmable reference input
– Voltage reference
Timers
– Programmable delay block
– Eight-channel motor control/general purpose/PWM
timer
– Two 2-channel quadrature decoder/general purpose
timers
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
Freescale reserves the right to change the detail specifications as may be
required to permit improvements in the design of its products.
© 2010–2011 Freescale Semiconductor, Inc.
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Communication interfaces
– Two Controller Area Network (CAN) modules
– Three SPI modules
– Two I2C modules
– Six UART modules
– Secure Digital host controller (SDHC)
– I2S module
K30 Sub-Family Data Sheet Data Sheet, Rev. 6, 9/2011.
2 Freescale Semiconductor, Inc.
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Table of Contents
1 Ordering parts...........................................................................4
1.1 Determining valid orderable parts......................................4
2 Part identification......................................................................4
2.1 Description.........................................................................4
2.2 Format...............................................................................4
2.3 Fields.................................................................................4
2.4 Example............................................................................5
3 Terminology and guidelines......................................................5
3.1 Definition: Operating requirement......................................5
3.2 Definition: Operating behavior...........................................6
3.3 Definition: Attribute............................................................6
3.4 Definition: Rating...............................................................7
3.5 Result of exceeding a rating..............................................7
3.6 Relationship between ratings and operating
requirements......................................................................7
3.7 Guidelines for ratings and operating requirements............8
3.8 Definition: Typical value.....................................................8
3.9 Typical value conditions....................................................9
4 Ratings......................................................................................9
4.1 Thermal handling ratings...................................................10
4.2 Moisture handling ratings..................................................10
4.3 ESD handling ratings.........................................................10
4.4 Voltage and current operating ratings...............................10
5 General.....................................................................................11
5.1 AC electrical characteristics..............................................11
5.2 Nonswitching electrical specifications...............................11
5.2.1 Voltage and current operating requirements.........11
5.2.2 LVD and POR operating requirements.................13
5.2.3 Voltage and current operating behaviors..............13
5.2.4 Power mode transition operating behaviors..........14
5.2.5 Power consumption operating behaviors..............15
5.2.6 EMC radiated emissions operating behaviors.......18
5.2.7 Designing with radiated emissions in mind...........19
5.2.8 Capacitance attributes..........................................19
5.3 Switching specifications.....................................................19
5.3.1 Device clock specifications...................................19
5.3.2 General switching specifications...........................19
5.4 Thermal specifications.......................................................20
5.4.1 Thermal operating requirements...........................20
5.4.2 Thermal attributes.................................................21
6 Peripheral operating requirements and behaviors....................21
6.1 Core modules....................................................................22
6.1.1 Debug trace timing specifications.........................22
6.1.2 JTAG electricals....................................................22
6.2 System modules................................................................25
6.3 Clock modules...................................................................25
6.3.1 MCG specifications...............................................25
6.3.2 Oscillator electrical specifications.........................28
6.3.3 32kHz Oscillator Electrical Characteristics............30
6.4 Memories and memory interfaces.....................................31
6.4.1 Flash (FTFL) electrical specifications....................31
6.4.2 EzPort Switching Specifications............................33
6.4.3 Flexbus Switching Specifications..........................33
6.5 Security and integrity modules..........................................36
6.6 Analog...............................................................................36
6.6.1 ADC electrical specifications.................................36
6.6.2 CMP and 6-bit DAC electrical specifications.........44
6.6.3 12-bit DAC electrical characteristics.....................47
6.6.4 Voltage reference electrical specifications............50
6.7 Timers................................................................................51
6.8 Communication interfaces.................................................51
6.8.1 CAN switching specifications................................51
6.8.2 DSPI switching specifications (limited voltage
range)....................................................................52
6.8.3 DSPI switching specifications (full voltage range).53
6.8.4 I2C switching specifications..................................55
6.8.5 UART switching specifications..............................55
6.8.6 SDHC specifications.............................................55
6.8.7 I2S switching specifications..................................56
6.9 Human-machine interfaces (HMI)......................................58
6.9.1 TSI electrical specifications...................................58
6.9.2 LCD electrical characteristics................................59
7 Dimensions...............................................................................61
7.1 Obtaining package dimensions.........................................61
8 Pinout........................................................................................61
8.1 K30 Signal Multiplexing and Pin Assignments..................61
8.2 K30 Pinouts.......................................................................67
9 Revision History........................................................................69
K30 Sub-Family Data Sheet Data Sheet, Rev. 6, 9/2011.
Freescale Semiconductor, Inc.
3
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Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to http://www.freescale.com and perform a part number
search for the following device numbers: PK30 and MK30.
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
Q K## A M FFF R T PP CC N
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
Q
K##
A
M
Description
Qualification status
Kinetis family
Key attribute
Flash memory type
Values
• M = Fully qualified, general market flow
• P = Prequalification
• K30
• D = Cortex-M4 w/ DSP
• F = Cortex-M4 w/ DSP and FPU
• N = Program flash only
• X = Program flash and FlexMemory
Table continues on the next page...
K30 Sub-Family Data Sheet Data Sheet, Rev. 6, 9/2011.
4 Freescale Semiconductor, Inc.
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Field
FFF
Description
Program flash memory size
R Silicon revision
T Temperature range (°C)
PP Package identifier
CC Maximum CPU frequency (MHz)
N Packaging type
2.4 Example
This is an example part number:
MK30DN512ZVMD10
3 Terminology and guidelines
Terminology and guidelines
Values
• 32 = 32 KB
• 64 = 64 KB
• 128 = 128 KB
• 256 = 256 KB
• 512 = 512 KB
• 1M0 = 1 MB
• Z = Initial
• (Blank) = Main
• A = Revision after main
• V = –40 to 105
• C = –40 to 85
• FM = 32 QFN (5 mm x 5 mm)
• FT = 48 QFN (7 mm x 7 mm)
• LF = 48 LQFP (7 mm x 7 mm)
• EX = 64 LQFN (9 mm x 9 mm)
• LH = 64 LQFP (10 mm x 10 mm)
• LK = 80 LQFP (12 mm x 12 mm)
• MB = 81 MAPBGA (8 mm x 8 mm)
• LL = 100 LQFP (14 mm x 14 mm)
• MC = 121 MAPBGA (8 mm x 8 mm)
• LQ = 144 LQFP (20 mm x 20 mm)
• MD = 144 MAPBGA (13 mm x 13 mm)
• MF = 196 MAPBGA (15 mm x 15 mm)
• MJ = 256 MAPBGA (17 mm x 17 mm)
• 5 = 50 MHz
• 7 = 72 MHz
• 10 = 100 MHz
• 12 = 120 MHz
• 15 = 150 MHz
• R = Tape and reel
• (Blank) = Trays
K30 Sub-Family Data Sheet Data Sheet, Rev. 6, 9/2011.
Freescale Semiconductor, Inc.
5
Datasheet pdf - http://www.DataSheet4U.net/