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Freescale Semiconductor
Data Sheet: Technical Data
Document Number: K20P81M100SF2
Rev. 6, 9/2011
K20 Sub-Family Data Sheet
Supports the following:
MK20DX256ZVLK10,
MK20DN512ZVLK10,
MK20DX256ZVMB10,
MK20DN512ZVMB10
Features
Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 105°C
Performance
– Up to 100 MHz ARM Cortex-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
Memories and memory interfaces
– Up to 512 KB program flash memory on non-
FlexMemory devices
– Up to 256 KB program flash memory on
FlexMemory devices
– Up to 256 KB FlexNVM on FlexMemory devices
– 4 KB FlexRAM on FlexMemory devices
– Up to 128 KB RAM
– Serial programming interface (EzPort)
– FlexBus external bus interface
Clocks
– 3 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
System peripherals
– 10 low-power modes to provide power optimization
based on application requirements
– Memory protection unit with multi-master
protection
– 16-channel DMA controller, supporting up to 64
request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
K20P81M100SF2
Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– 128-bit unique identification (ID) number per chip
Human-machine interface
– Low-power hardware touch sensor interface (TSI)
– General-purpose input/output
Analog modules
– Two 16-bit SAR ADCs
– Programmable gain amplifier (PGA) (up to x64)
integrated into each ADC
– 12-bit DAC
– Three analog comparators (CMP) containing a 6-bit
DAC and programmable reference input
– Voltage reference
Timers
– Programmable delay block
– Eight-channel motor control/general purpose/PWM
timer
– Two 2-channel quadrature decoder/general purpose
timers
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
Communication interfaces
– USB full-/low-speed On-the-Go controller with on-
chip transceiver
– Two Controller Area Network (CAN) modules
– Two SPI modules
– Two I2C modules
– Four UART modules
– Secure Digital host controller (SDHC)
– I2S module
Freescale reserves the right to change the detail specifications as may be
required to permit improvements in the design of its products.
© 2010–2011 Freescale Semiconductor, Inc.
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Table of Contents
1 Ordering parts...........................................................................4
6 Peripheral operating requirements and behaviors....................22
1.1 Determining valid orderable parts......................................4
6.1 Core modules....................................................................22
2 Part identification......................................................................4
6.1.1 Debug trace timing specifications.......................22
2.1 Description.........................................................................4
6.1.2 JTAG electricals..................................................22
2.2 Format...............................................................................4
6.2 System modules................................................................26
2.3 Fields.................................................................................4
6.3 Clock modules...................................................................26
2.4 Example............................................................................5
6.3.1 MCG specifications.............................................26
3 Terminology and guidelines......................................................5
6.3.2 Oscillator electrical specifications.......................28
3.1 Definition: Operating requirement......................................5
6.3.3 32kHz Oscillator Electrical Characteristics.........30
3.2 Definition: Operating behavior...........................................6
6.4 Memories and memory interfaces.....................................31
3.3 Definition: Attribute............................................................6
6.4.1 Flash (FTFL) electrical specifications.................31
3.4 Definition: Rating...............................................................7
6.4.2 EzPort Switching Specifications.........................36
3.5 Result of exceeding a rating..............................................7
6.4.3 Flexbus Switching Specifications........................37
3.6 Relationship between ratings and operating
6.5 Security and integrity modules..........................................40
requirements......................................................................7
6.6 Analog...............................................................................40
3.7 Guidelines for ratings and operating requirements............8
6.6.1 ADC electrical specifications..............................40
3.8 Definition: Typical value.....................................................8
6.6.2 CMP and 6-bit DAC electrical specifications......48
3.9 Typical value conditions....................................................9
6.6.3 12-bit DAC electrical characteristics...................51
4 Ratings......................................................................................9
6.6.4 Voltage reference electrical specifications..........54
4.1 Thermal handling ratings...................................................10
6.7 Timers................................................................................55
4.2 Moisture handling ratings..................................................10
6.8 Communication interfaces.................................................55
4.3 ESD handling ratings.........................................................10
6.8.1 USB electrical specifications...............................55
4.4 Voltage and current operating ratings...............................10
6.8.2 USB DCD electrical specifications......................56
5 General.....................................................................................11
6.8.3 USB VREG electrical specifications...................56
5.1 AC electrical characteristics..............................................11
6.8.4 CAN switching specifications..............................57
5.2 Nonswitching electrical specifications...............................11
6.8.5 DSPI switching specifications (limited voltage
5.2.1 Voltage and current operating requirements......12
range).................................................................57
5.2.2 LVD and POR operating requirements...............13
6.8.6 DSPI switching specifications (full voltage
5.2.3 Voltage and current operating behaviors............13
range).................................................................58
5.2.4 Power mode transition operating behaviors.......14
6.8.7 I2C switching specifications................................60
5.2.5 Power consumption operating behaviors............15
6.8.8 UART switching specifications............................60
5.2.6 EMC radiated emissions operating behaviors....18
6.8.9 SDHC specifications...........................................60
5.2.7 Designing with radiated emissions in mind.........19
6.8.10 I2S switching specifications................................61
5.2.8 Capacitance attributes........................................19
6.9 Human-machine interfaces (HMI)......................................63
5.3 Switching specifications.....................................................19
6.9.1 TSI electrical specifications................................63
5.3.1 Device clock specifications.................................19
7 Dimensions...............................................................................64
5.3.2 General switching specifications.........................19
7.1 Obtaining package dimensions.........................................64
5.4 Thermal specifications.......................................................20
8 Pinout........................................................................................65
5.4.1 Thermal operating requirements.........................20
8.1 K20 Signal Multiplexing and Pin Assignments..................65
5.4.2 Thermal attributes...............................................21
8.2 K20 Pinouts.......................................................................70
K20 Sub-Family Data Sheet Data Sheet, Rev. 6, 9/2011.
2 Freescale Semiconductor, Inc.
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9 Revision History........................................................................72
K20 Sub-Family Data Sheet Data Sheet, Rev. 6, 9/2011.
Freescale Semiconductor, Inc.
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Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to http://www.freescale.com and perform a part number
search for the following device numbers: PK20 and MK20.
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
Q K## A M FFF R T PP CC N
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
Q
K##
A
M
Description
Qualification status
Kinetis family
Key attribute
Flash memory type
Values
• M = Fully qualified, general market flow
• P = Prequalification
• K20
• D = Cortex-M4 w/ DSP
• F = Cortex-M4 w/ DSP and FPU
• N = Program flash only
• X = Program flash and FlexMemory
Table continues on the next page...
K20 Sub-Family Data Sheet Data Sheet, Rev. 6, 9/2011.
4 Freescale Semiconductor, Inc.
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Field
FFF
Description
Program flash memory size
R Silicon revision
T Temperature range (°C)
PP Package identifier
CC Maximum CPU frequency (MHz)
N Packaging type
2.4 Example
This is an example part number:
MK20DN512ZVMD10
3 Terminology and guidelines
Terminology and guidelines
Values
• 32 = 32 KB
• 64 = 64 KB
• 128 = 128 KB
• 256 = 256 KB
• 512 = 512 KB
• 1M0 = 1 MB
• Z = Initial
• (Blank) = Main
• A = Revision after main
• V = –40 to 105
• C = –40 to 85
• FM = 32 QFN (5 mm x 5 mm)
• FT = 48 QFN (7 mm x 7 mm)
• LF = 48 LQFP (7 mm x 7 mm)
• EX = 64 LQFN (9 mm x 9 mm)
• LH = 64 LQFP (10 mm x 10 mm)
• LK = 80 LQFP (12 mm x 12 mm)
• MB = 81 MAPBGA (8 mm x 8 mm)
• LL = 100 LQFP (14 mm x 14 mm)
• MC = 121 MAPBGA (8 mm x 8 mm)
• LQ = 144 LQFP (20 mm x 20 mm)
• MD = 144 MAPBGA (13 mm x 13 mm)
• MF = 196 MAPBGA (15 mm x 15 mm)
• MJ = 256 MAPBGA (17 mm x 17 mm)
• 5 = 50 MHz
• 7 = 72 MHz
• 10 = 100 MHz
• 12 = 120 MHz
• 15 = 150 MHz
• R = Tape and reel
• (Blank) = Trays
K20 Sub-Family Data Sheet Data Sheet, Rev. 6, 9/2011.
Freescale Semiconductor, Inc.
5
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