MT29C4G48MAPLCJQ-75IT.pdf 데이터시트 (총 15 페이지) - 파일 다운로드 MT29C4G48MAPLCJQ-75IT 데이타시트 다운로드

No Preview Available !

Preliminary
152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP
Features
NAND Flash and Mobile LPDRAM
152-Ball Package-on-Package (PoP)
Combination Memory (TI OMAP™)
MT29C Family
Current production part numbers: See Table 1 on page 3
Features
• Micron® NAND Flash and Mobile LPDRAM
components
• RoHS-compliant, “green” package
• Separate NAND Flash and Mobile LPDRAM
interfaces
• Space-saving package-on-package combination
• Low-voltage operation (1.70–1.95V)
• Industrial temperature range: –40°C to +85°C
NAND Flash-Specific Features
• Organization
Page size
x8: 2112 bytes (2048 + 64 bytes)
x16: 1056 words (1024 + 32 words)
Block size: 64 pages (128K + 4K bytes)
Mobile LPDRAM-Specific Features
• No external voltage reference required
• No minimum clock rate requirement
• 1.8V LVCMOS-compatible inputs
• Programmable burst lengths
• Partial-array self refresh (PASR)
• Deep power-down (DPD) mode
• Selectable output drive strength
• STATUS REGISTER READ (SRR) supported1
Figure 1: PoP Block Diagram
NAND Flash
Power
NAND Flash
Device
NAND Flash
Interface
LP-DRAM Power
www.DataSheet.net/
LP-DRAM
Device
LP-DRAM Interface
Options
• LP-DRAM
166 MHz CL32
133 MHz CL3
Marking
-6
-75
Notes: 1. Contact factory for remapped SRR output.
2. CL = CAS (READ) latency.
PDF: 09005aef8326e5ac / Source: 09005aef8326e59a
152ball_ nand_lpdram_j4xx_omap.fm - Rev. E 4/09 EN
1 Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2008 Micron Technology, Inc. All rights reserved.
‡Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by
Micron without notice. Products are only warranted by Micron to meet Micron’s production data sheet specifications.
Datasheet pdf - http://www.DataSheet4U.co.kr/

No Preview Available !

Preliminary
152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP
Part Numbering Information – 152-Ball PoP
Part Numbering Information – 152-Ball PoP
Micron NAND Flash and LPDRAM devices are available in different configurations and
densities.
Figure 2: 152-Ball Part Number Chart
Micron Technology
Product Family
29C = NAND + LPDRAM MCP
NAND Density
1G = 1Gb
2G = 2Gb
4G = 4Gb
LPDRAM Density
12M = 512Mb
24M = 1024Mb
48M = 2048Mb
Operating Voltage Range
A = 1.8V (1.70–1.95V)
NAND Flash Configuration
Width Density Generation
C x8
1Gb First
D x16 1Gb First
J x8
2Gb Second
K x16 2Gb Second
N x8
4Gb First
P x16 4Gb First
U x8
1Gb Second
V x16 1Gb Second
MT 29C 1G 24M A C J A CG – x
www.DataSheet.net/
LPDRAM Configuration
Type Width Density Generation
J DDR x16 1Gb First
L DDR x32 1Gb First
N DDR x16 512Mb Second
R DDR x32 512Mb Second
IT ES
Production Status
Blank = Production
ES = Engineering sample
MS = Mechanical sample
Operating Temperature Range
IT = Industrial (–40° to +85°C)
LPDRAM Self Refresh Current
Blank = Standard
LPDRAM Access Time
–6 166 MHz CL3
–75 133 MHz CL3
Package Codes
CA = 152-ball PoP VFBGA (14 x 14 x 0.9mm)
CG = 152-ball PoP VFBGA (14 x 14 x 1.0mm)
JQ = 152-ball PoP TFBGA (14 x 14 x 1.1mm)
Chip Count
CE#, CS# Chip Count
A 1, 1 1 NAND, 1 DRAM
B 1, 1 2 NAND, 1 DRAM
C 1, 2 1 NAND, 2 DRAM
D 1, 2 2 NAND, 2 DRAM
Note: Not all possible combinations are available. Contact factory for availability.
PDF: 09005aef8326e5ac / Source: 09005aef8326e59a
152ball_ nand_lpdram_j4xx_omap.fm - Rev. E 4/09 EN
2 Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2008 Micron Technology, Inc. All rights reserved.
Datasheet pdf - http://www.DataSheet4U.co.kr/

No Preview Available !

Preliminary
152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP
Device Marking
Table 1: Production Part Numbers
Part Number
MT29C4G48MAPLCCA-6 IT
MT29C4G48MAPLCCA-75 IT
MT29C4G48MAPLCJQ-6 IT
MT29C4G48MAPLCJQ-75 IT
MT29C1G12MADRACG-6 IT
MT29C1G12MADRACG-75 IT
MT29C2G24MAKLACG-6 IT
MT29C2G24MAKLACG-75 IT
MT29C1G12MAURACA-6 IT
MT29C1G12MAURACA-75 IT
MT29C1G12MAVRACA-6 IT
MT29C1G12MAVRACA-75 IT
NAND Product
MT46H32M32LFJG-6 IT
MT46H32M32LFJG-6 IT
MT46H32M32LFJG-6 IT
MT46H32M32LFJG-6 IT
MT46H16M32LFCM-6 IT
MT46H16M32LFCM-6 IT
MT46H32M32LFJG-6 IT
MT46H32M32LFJG-6 IT
MT46H16M32LFCM-6 IT
MT46H16M32LFCM-6 IT
MT46H16M32LFCM-6 IT
MT46H16M32LFCM-6 IT
LPDDR Product
MT29F4G16ABCWC-ET
MT29F4G16ABCWC-ET
MT29F4G16ABCWC-ET
MT29F4G16ABCWC-ET
MT29F1G16ABBHC-ET
MT29F1G16ABBHC-ET
MT29F2G16ABDHC-ET
MT29F2G16ABDHC-ET
MT29F1G08ABCHC-ET
MT29F1G08ABCHC-ET
MT29F1G16ABCHC-ET
MT29F1G16ABCHC-ET
Physical Part
Marking
JW399
JW400
JW297
JW296
JW226
JW227
JW188
JW189
JW385
JW384
JW375
JW374
Device Marking
Due to the size of the package, the Micron-standard part number is not printed on the
top of the device. Instead, an abbreviated device mark consisting of a 5-digit alphanu-
meric code is used. The abbreviated device marks are cross-referenced to the Micron
part numbers at the FBGA Part Marking Decoder site: www.micron.com/decoder. To
view the location of the abbreviated mark on the device, refer to customer service note
CSN-11, “Product Mark/Label,” at www.micron.com/csn.
www.DataSheet.net/
PDF: 09005aef8326e5ac / Source: 09005aef8326e59a
152ball_ nand_lpdram_j4xx_omap.fm - Rev. E 4/09 EN
3 Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2008 Micron Technology, Inc. All rights reserved.
Datasheet pdf - http://www.DataSheet4U.co.kr/

No Preview Available !

Preliminary
152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP
General Description
General Description
Micron package-on-package (PoP) products combine NAND Flash and Mobile LPDRAM
devices in a single MCP. These products target mobile applications with low-power,
high-performance, and minimal package-footprint design requirements. The NAND
Flash and Mobile LPDRAM devices are also members of the Micron discrete memory
products portfolio.
The NAND Flash and Mobile LPDRAM devices are packaged with separate interfaces (no
shared address, control, data, or power balls). This bus architecture supports an opti-
mized interface to processors with separate NAND Flash and Mobile LPDRAM buses.
The NAND Flash and Mobile LPDRAM devices have separate core power connections
and share a common ground (i.e., VSS is tied together on the two devices).
The bus architecture of this device also supports separate NAND Flash and Mobile
LPDRAM functionality without concern for device interaction. Operational characteris-
tics for the NAND Flash and Mobile LPDRAM devices are found in the standard Micron
data sheets for each of the discrete devices.
For device specifications and complete Micron NAND Flash features documentation,
please refer to the component data sheet at www.micron.com/products/nand, or con-
tact your local Micron sales office.
For device specifications and complete Mobile LPDRAM features documentation,
please refer to the component data sheet at www.micron.com/products/mobiledram, or
contact your local Micron sales office.
www.DataSheet.net/
PDF: 09005aef8326e5ac / Source: 09005aef8326e59a
152ball_ nand_lpdram_j4xx_omap.fm - Rev. E 4/09 EN
4 Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2008 Micron Technology, Inc. All rights reserved.
Datasheet pdf - http://www.DataSheet4U.co.kr/

No Preview Available !

Preliminary
152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP
Ball Assignments and Descriptions
Ball Assignments and Descriptions
Figure 3: 152-Ball VFBGA Ball Assignments (NAND x8; LPDDR x16)
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21
A NC NC VDDQ LDM DQ5 DQ7 VSSQ DQ2 DQ4 DQ8 DQ11 CK VSS UDM VDDQ DQ13 DQ12 NC NC NC NC A
B NC NC NC NC VDDQ DQ1 DQ6 LDQS DQ3 DQ0 DQ9 DQ10 CK# VSSQ UDQS VDD DQ15 DQ14 NC NC NC B
C VSSQ NC
NC NC
C
D NC NC
NC NC
D
E NC NC
NC NC
E
F VSSQ VDDQ
VSSQ VDDQ
F
G NC NC
A0 NC
G
H NC VSS
VSS VDD
H
J VDD NC
A2 A3
J
K WE# NC
A1 A9
K
L NC RE#
M NC VSS
www.DataSheet.net/
VDDQ VSSQ
L
A7 A6
M
N NC VCC
A8 A11 N
P NC NC
VSS VDD
P
R NC VSS
A5 A12
R
T NC VCC
CS1# CS0# T
U I/O1 I/O0
CAS# A4
U
V I/O3 I/O2
BA1 RAS# V
W CE1# LOCK
VSSQ VDDQ
W
Y NC NC I/O6 I/O7 WP# VSS VCC NC NC R/B# VSS A14 CKE1 VDD CKE0 A10 VSS WE# VSSQ NC NC Y
AA NC NC I/O4 I/O5 NC VCC VSS CE0# ALE CLE VDD TQ VSS VDDQ A13 VSSQ VDD BA0 VDDQ NC NC AA
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21
Top View – Ball Down
NAND
LPDDR
Supply
Ground
Note: Contact factory for availability of x16 LPDDR configuration.
PDF: 09005aef8326e5ac / Source: 09005aef8326e59a
152ball_ nand_lpdram_j4xx_omap.fm - Rev. E 4/09 EN
5 Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2008 Micron Technology, Inc. All rights reserved.
Datasheet pdf - http://www.DataSheet4U.co.kr/