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SD05C through SD24C
Single Line TVS Diode for ESD
Protection in Portable Electronics
PROTECTION PRODUCTS
PRELIMINARY
Description
Features
The SDxxC TVS diodes are designed to replace multi-
layer varistors (MLVs) in portable applications such as
cell phones, notebook computers, and PDA’s. They
offer superior electrical characteristics such as lower
clamping voltage and no device degradation when
compared to MLVs. The SDxxC series TVS diodes are
designed to protect sensitive semiconductor compo-
nents from damage or upset due to electrostatic
discharge (ESD) and other voltage induced transient
events.
The SDxxC is in a SOD-323 package and will protect
one bidirectional line. They are available with working
voltages of 5 - 24 volts. These devices will fit on the
same PCB pad area as an 0805 MLV device. They give
the designer the flexibility to protect one line in applica-
tions where arrays are not practical. Additionally, it
may be “sprinkled” around the board in applications
where board space is at a premium.
They may may be used to meet the ESD immunity
requirements of IEC 61000-4-2, Level 4 (±15kV air,
±8kV contact discharge).
‹ 350 Watts peak pulse power (tp = 8/20µs)
‹ Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 24A (8/20µs)
‹ Small package for use in portable electronics
‹ Suitable replacement for MLV’s in ESD protection
applications
‹ Protects one I/O or power line
‹ Low clamping voltage
‹ Working voltages: 5V, 12V, 15V, 24V
‹ Low leakage current
‹ Solid-state silicon avalanche technology
Mechanical Characteristics
‹ EIAJ SOD-323 package
‹ Molding compound flammability rating: UL 94V-0
‹ Marking : Marking code
‹ Packaging : Tape and Reel per EIA 481
Applications
‹ Cell Phone Handsets and Accessoriesh t t p : / / w w w . D a t a S h e e t 4 U .
‹ Microprocessor based equipment
‹ Personal Digital Assistants (PDA’s)
‹ Notebooks, Desktops, and Servers
‹ Portable Instrumentation
‹ Pagers
‹ Peripherals
net
Schematic & PIN Configuration
12
Revision 07/06/04
SOD-323 (Top View)
1 www.semtech.com
dat

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PROTECTION PRODUCTS
Absolute Maximum Rating
Rating
Peak Pulse Power (tp = 8/20µs)
ESD Voltage (HBM Waveform per IEC 61000-4-2)
Lead Soldering Temperature
Operating Temperature
Storage Temperature
SD05C through SD24C
Symbol
Ppk
VESD
TL
TJ
TSTG
Value
350
30
260 (10 sec.)
-55 to +125
-55 to +150
Units
Watts
kV
°C
°C
°C
Electrical Characteristics
SD05C TVS
Parameter
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
Clamping Voltage
Peak Pulse Current
Junction Capacitance
Symbol
VRWM
VBR
IR
VC
VC
IPP
Cj
SD12C TVS
Parameter
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
Clamping Voltage
Peak Pulse Current
Junction Capacitance
Symbol
VRWM
VBR
IR
VC
VC
IPP
Cj
Conditions
Minimum
It = 1mA
VRWM = 5V, T=25°C
http://www.DataSheet4U.net/
IPP = 5A, tp = 8/20µs
IPP = 24A, tp = 8/20µs
tp = 8/20µs
VR = 0V, f = 1MHz
6
Conditions
Minimum
It = 1mA
VRWM = 12V, T=25°C
IPP = 5A, tp = 8/20µs
IPP = 15A, tp = 8/20µs
tp = 8/20µs
VR = 0V, f = 1MHz
13.3
Typical
Typical
Maximum
5
10
9.8
14.5
24
200
Units
V
V
µA
V
V
A
pF
Maximum
12
1
19
24
15
100
Units
V
V
µA
V
V
A
pF
2004 Semtech Corp.
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SD05C through SD24C
PROTECTION PRODUCTS
Electrical Characteristics (Continued)
SD15C TVS
Parameter
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
Clamping Voltage
Peak Pulse Current
Junction Capacitance
Symbol
VRWM
VBR
IR
VC
VC
IPP
Cj
Conditions
It = 1mA
VRWM = 15V, T=25°C
IPP = 5A, tp = 8/20µs
IPP = 12A, tp = 8/20µs
tp = 8/20µs
VR = 0V, f = 1MHz
Minimum
16.7
Typical
PRELIMINARY
Maximum
15
1
24
29
12
75
Units
V
V
µA
V
V
A
pF
SD24C TVS
Parameter
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
Clamping Voltage
Peak Pulse Current
Junction Capacitance
Symbol
VRWM
VBR
IR
VC
VC
IPP
Cj
Conditions
It = 1mA
http://www.DataSheet4U.net/
VRWM = 24V, T=25°C
IPP = 5A, tp = 8/20µs
IPP = 8A, tp = 8/20µs
tp = 8/20µs
VR = 0V, f = 1MHz
Minimum
26.7
Typical
Maximum
24
1
40
44
8
50
Units
V
V
µA
V
V
A
pF
2004 Semtech Corp.
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SD05C through SD24C
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
10
1
0.1
0.01
0.1
110
100
90
80
70
60
50
40
30
20
10
0
0
1 10 100
Pulse Duration - tp (µs)
Pulse Waveform
1000
Waveform
Parameters:
tr = 8µs
td = 20µs
e-t
td = IPP/2
5 10 15 20 25 30
Time (µs)
Power Derating Curve
110
100
90
80
70
60
50
40
30
20
10
0
0
25 50 75 100 125
Ambient Temperature - TA (oC)
150
Clamping Voltage vs. Peak Pulse Current
30
Waveform
25
Parameters:
tr = 8µs
td = 20µs
20
SD12C
15
http://www.DataSheet4U.net/
10
SD05C
5
0
0 5 10 15 20 25 30
Peak Pulse Current - IPP (A)
2004 Semtech Corp.
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SD05C through SD24C
PROTECTION PRODUCTS
Applications Information
Device Connection Options
The SDxxC TVS diodes are designed to protect one
data, I/O, or power supply line. The device is designed
to replace multi-layer varistors (MLVs) in portable
applications. It is easily implemented on existing 0805
MLV pads and is only slightly larger than 0603 MLV
pads. The device is bidirectional and may be used on
lines where the signal polarity is above and below
ground. The device is symmetrical, so there is no
cathode band.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of fast rise-time transients such as ESD. The following
guidelines are recommended (Refer to application note
SI99-01 for more detailed information):
PRELIMINARY
Device Schematic and Pin Configuration
Size Comparison to 0805 MLV
z Place the TVS near the input terminals or
connectors to restrict transient coupling.
z Minimize the path length between the TVS and
the protected line.
z The ESD transient return path to ground should
be kept as short as possible.
z Place a TVS and decoupling capacitor between
power and ground of components that may be
vulnerable to electrostatic discharges to the
ground plane.
z Minimize all conductive loops including power
and ground loops.
z Use multilayer boards when possible.
z Minimize interconnecting line lengths
z Never run critical signals near board edges.
z Fill unused portions of the PCB with ground
plane.
http://www.DataSheet4U.net/
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
2004 Semtech Corp.
5
SOD-323
Note: Nominal dimensions in inches
0805 MLV
Component Placement Comparison
0805 MLV on
0805 Solder Pad
SOD-323 on 0805
MLV Pad
SOD-323 on Recommended
(SOD-323) Solder Pad
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datasheet pdf - http://www.DataSheet4U.net/