Teccor® brand Thyristors
12 Amp Alternistor Quadrac for LED dimmer applications
Soldering Parameters
Reflow Condition
Pb – Free assembly
- Temperature Min (Ts(min))
Pre Heat - Temperature Max (Ts(max))
- Time (min to max) (ts)
Average ramp up rate (LiquidusTemp)
(TL) to peak
TS(max) to TL - Ramp-up Rate
Reflow
-Temperature (TL) (Liquidus)
- Temperature (tL)
Peak Temperature (TP)
Time within 5°C of actual peak
Temperature (tp)
Ramp-down Rate
Time 25°C to peakTemperature (TP)
Do not exceed
150°C
200°C
60 – 180 secs
5°C/second max
5°C/second max
217°C
60 – 150 seconds
260°C +0/-5
20 – 40 seconds
5°C/second max
8 minutes Max.
280°C
TP
TL
TS(max)
TS(min)
Ramp-up
Preheat
tS
25
time to peak temperature
tP
tL
Ramp-down
Time
Physical Specifications
Environmental Specifications
Terminal Finish
Body Material
Lead Material
1005 Matte Tin-plated
UL Recognized epoxy meeting
flammability classification 94v-0
Copper Alloy
http://www.DataSheet4U.net/
Design Considerations
Careful selection of the correct device for the application’s
operating parameters and environment will go a long way
toward extending the operating life of the Thyristor. Good
design practice should limit the maximum continuous
current through the main terminals to 75% of the device
rating. Other ways to ensure long life for a power discrete
semiconductor are proper heat sinking and selection of
voltage ratings for worst case conditions. Overheating,
overvoltage (including dv/dt), and surge currents are
the main killers of semiconductors. Correct mounting,
soldering, and forming of the leads also help protect
against component damage.
Test
High Temperature
Voltage Blocking
Temperature Cycling
Biased Temperature &
Humidity
High Temp Storage
Specifications and Conditions
MIL-STD-750: Method 1040, Condition A
Rated VDRM (VAC-peak), 110°C, 1008
hours
MIL-STD-750: Method 1051
-40°C to 150°C, 15-minute dwell,
100 cycles
EIA/JEDEC: JESD22-A101
320VDC, 85°C, 85%RH, 1008 hours
MIL-STD-750: Method 1031
150°C, 1008 hours
Low-Temp Storage -40°C, 1008 hours
Thermal Shock
Autoclave
(Pressure Cooker Test)
MIL-STD-750: Method 1056
0°C to 100°C, 5-minute dwell,
10-second transfer, 10 cycles
EIA/JEDEC: JESD22-A102
121°C, 100%RH, 2atm, 168 hours
Resistance to
Solder Heat
MIL-STD-750: Method 2031
260°C, 10 seconds
Solderability
ANSI/J-STD-002, Category 3, Test A
Lead Bend
MIL-STD-750: Method 2036, Condition E
Q6012LTH1LED Series
5
Revised: January 25, 2013 08:34 AM
©2013 Littelfuse, Inc
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
datasheet pdf - http://www.DataSheet4U.net/