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Freescale Semiconductor
Data Sheet: Technical Data
Document Number: K40P100M72SF1
Rev. 2, 4/2012
K40 Sub-Family
Supports: MK40DX128VLL7,
MK40DX256VLL7, MK40DX128VML7,
MK40DX256VML7
Features
Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 105°C
Clocks
– 3 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
System peripherals
– 10 low-power modes to provide power optimization
based on application requirements
– 16-channel DMA controller, supporting up to 63
request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– 128-bit unique identification (ID) number per chip
Human-machine interface
– Segment LCD controller supporting up to 36
frontplanes and 8 backplanes, or 40 frontplanes and
4 backplanes, depending on the package size
– Low-power hardware touch sensor interface (TSI)
– General-purpose input/output
K40P100M72SF1
Analog modules
– Two 16-bit SAR ADCs
– Programmable gain amplifier (PGA) (up to x64)
integrated into each ADC
– 12-bit DAC
– Three analog comparators (CMP) containing a 6-bit
DAC and programmable reference input
– Voltage reference
Timers
– Programmable delay block
– Eight-channel motor control/general purpose/PWM
timer
– Two 2-channel quadrature decoder/general purpose
timers
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
Communication interfaces
– USB full-/low-speed On-the-Go controller with on-
chip transceiver
– Controller Area Network (CAN) module
– Two SPI modules
– Two I2C modules
– Five UART modules
– I2S module
Freescale reserves the right to change the detail specifications as may be
required to permit improvements in the design of its products.
© 2012 Freescale Semiconductor, Inc.
Free Datasheet http://www.datasheet4u.com/

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Table of Contents
1 Ordering parts...........................................................................3
6 Peripheral operating requirements and behaviors....................22
1.1 Determining valid orderable parts......................................3
6.1 Core modules....................................................................22
2 Part identification......................................................................3
6.1.1 Debug trace timing specifications.........................22
2.1 Description.........................................................................3
6.1.2 JTAG electricals....................................................23
2.2 Format...............................................................................3
6.2 System modules................................................................25
2.3 Fields.................................................................................3
6.3 Clock modules...................................................................25
2.4 Example............................................................................4
6.3.1 MCG specifications...............................................25
3 Terminology and guidelines......................................................4
6.3.2 Oscillator electrical specifications.........................28
3.1 Definition: Operating requirement......................................4
6.3.3 32kHz Oscillator Electrical Characteristics............30
3.2 Definition: Operating behavior...........................................5
6.4 Memories and memory interfaces.....................................31
3.3 Definition: Attribute............................................................5
6.4.1 Flash electrical specifications................................31
3.4 Definition: Rating...............................................................6
6.4.2 EzPort Switching Specifications............................35
3.5 Result of exceeding a rating..............................................6
6.5 Security and integrity modules..........................................36
3.6 Relationship between ratings and operating
6.6 Analog...............................................................................36
requirements......................................................................6
6.6.1 ADC electrical specifications.................................37
3.7 Guidelines for ratings and operating requirements............7
6.6.2 CMP and 6-bit DAC electrical specifications.........45
3.8 Definition: Typical value.....................................................7
6.6.3 12-bit DAC electrical characteristics.....................47
3.9 Typical value conditions....................................................8
6.6.4 Voltage reference electrical specifications............50
4 Ratings......................................................................................9
6.7 Timers................................................................................51
4.1 Thermal handling ratings...................................................9
6.8 Communication interfaces.................................................52
4.2 Moisture handling ratings..................................................9
6.8.1 USB electrical specifications.................................52
4.3 ESD handling ratings.........................................................9
6.8.2 USB DCD electrical specifications........................52
4.4 Voltage and current operating ratings...............................9
6.8.3 USB VREG electrical specifications......................52
5 General.....................................................................................10
6.8.4 CAN switching specifications................................53
5.1 AC electrical characteristics..............................................10
6.8.5 DSPI switching specifications (limited voltage
5.2 Nonswitching electrical specifications...............................11
range)....................................................................53
5.2.1 Voltage and current operating requirements.........11
6.8.6 DSPI switching specifications (full voltage range).55
5.2.2 LVD and POR operating requirements.................12
6.8.7 I2C switching specifications..................................56
5.2.3 Voltage and current operating behaviors..............12
6.8.8 UART switching specifications..............................57
5.2.4 Power mode transition operating behaviors..........13
6.8.9 I2S/SAI Switching Specifications..........................57
5.2.5 Power consumption operating behaviors..............14
6.9 Human-machine interfaces (HMI)......................................61
5.2.6 Designing with radiated emissions in mind...........18
6.9.1 TSI electrical specifications...................................61
5.2.7 Capacitance attributes..........................................18
6.9.2 LCD electrical characteristics................................62
5.3 Switching specifications.....................................................19
7 Dimensions...............................................................................63
5.3.1 Device clock specifications...................................19
7.1 Obtaining package dimensions.........................................63
5.3.2 General switching specifications...........................19
8 Pinout........................................................................................64
5.4 Thermal specifications.......................................................20
8.1 K40 Signal Multiplexing and Pin Assignments..................64
5.4.1 Thermal operating requirements...........................20
8.2 K40 Pinouts.......................................................................69
5.4.2 Thermal attributes.................................................21
9 Revision History........................................................................71
K40 Sub-Family Data Sheet, Rev. 2, 4/2012.
2 Freescale Semiconductor, Inc.
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Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to http://www.freescale.com and perform a part number
search for the following device numbers: PK40 and MK40 .
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
Q K## A M FFF R T PP CC N
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
Q
K##
A
M
Description
Qualification status
Kinetis family
Key attribute
Flash memory type
Values
• M = Fully qualified, general market flow
• P = Prequalification
• K40
• D = Cortex-M4 w/ DSP
• F = Cortex-M4 w/ DSP and FPU
• N = Program flash only
• X = Program flash and FlexMemory
Table continues on the next page...
Freescale Semiconductor, Inc.
K40 Sub-Family Data Sheet, Rev. 2, 4/2012.
3
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Terminology and guidelines
Field
FFF
Description
Program flash memory size
R Silicon revision
T Temperature range (°C)
PP Package identifier
CC Maximum CPU frequency (MHz)
N Packaging type
2.4 Example
This is an example part number:
MK40DN512ZVMD10
3 Terminology and guidelines
Values
• 32 = 32 KB
• 64 = 64 KB
• 128 = 128 KB
• 256 = 256 KB
• 512 = 512 KB
• 1M0 = 1 MB
• Z = Initial
• (Blank) = Main
• A = Revision after main
• V = –40 to 105
• C = –40 to 85
• FM = 32 QFN (5 mm x 5 mm)
• FT = 48 QFN (7 mm x 7 mm)
• LF = 48 LQFP (7 mm x 7 mm)
• LH = 64 LQFP (10 mm x 10 mm)
• MP = 64 MAPBGA (5 mm x 5 mm)
• LK = 80 LQFP (12 mm x 12 mm)
• MB = 81 MAPBGA (8 mm x 8 mm)
• LL = 100 LQFP (14 mm x 14 mm)
• ML = 104 MAPBGA (8 mm x 8 mm)
• MC = 121 MAPBGA (8 mm x 8 mm)
• LQ = 144 LQFP (20 mm x 20 mm)
• MD = 144 MAPBGA (13 mm x 13 mm)
• MJ = 256 MAPBGA (17 mm x 17 mm)
• 5 = 50 MHz
• 7 = 72 MHz
• 10 = 100 MHz
• 12 = 120 MHz
• 15 = 150 MHz
• R = Tape and reel
• (Blank) = Trays
K40 Sub-Family Data Sheet, Rev. 2, 4/2012.
4 Freescale Semiconductor, Inc.
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3.1 Definition: Operating requirement
Terminology and guidelines
An operating requirement is a specified value or range of values for a technical
characteristic that you must guarantee during operation to avoid incorrect operation and
possibly decreasing the useful life of the chip.
3.1.1 Example
This is an example of an operating requirement, which you must meet for the
accompanying operating behaviors to be guaranteed:
Symbol
VDD
Description
Min.
1.0 V core supply
voltage
0.9
Max.
1.1
Unit
V
3.2 Definition: Operating behavior
An operating behavior is a specified value or range of values for a technical
characteristic that are guaranteed during operation if you meet the operating requirements
and any other specified conditions.
3.2.1 Example
This is an example of an operating behavior, which is guaranteed if you meet the
accompanying operating requirements:
Symbol
IWP
Description
Digital I/O weak pullup/ 10
pulldown current
Min.
Max.
130
Unit
µA
3.3 Definition: Attribute
An attribute is a specified value or range of values for a technical characteristic that are
guaranteed, regardless of whether you meet the operating requirements.
Freescale Semiconductor, Inc.
K40 Sub-Family Data Sheet, Rev. 2, 4/2012.
5
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