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Zener diode
UDZS18B
Applications
Constant voltage control
Features
1) Compact, 2-pin mini-mold type for
high-density mounting. (UMD2)
2) High reliability.
3) Can be mounted automatically,
using chip mounter.
Dimensions (Unit : mm)
1.25±0.1
0.1±0.1
    0.05
Construction
Silicon epitaxial planar
0.3±0.05
ROHM : UMD2
JEDEC : S0D-323
JEITA : SC-90/A
dot (year week factory)
EX. UDZS3.6B
0.7±0.2
    0.1
Land size figure (Unit : mm)
0.9MIN.
UMD2
Structure
Taping specifications (Unit : mm)
4.0±0.1 2.0±0.05
φ1.55±0.05
0.3±0.1
1.40±0.1
4.0±0.1
φ1.05
Absolute maximum ratings (Ta=25C)
Parameter
Power dissipation
Junction temperature
Storage temperature
Operating temperature
Symbol
P
Tj
Tstg
Topr
Limits
200
150
-55 to +150
-55 to +150
Unit
mW
1.0±0.1
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c 2012 ROHM Co., Ltd. All rights reserved.
1/4
2012.02 - Rev.D

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UDZS18B
Data Sheet
Electrical characteristics (Ta=25C)
TYP.
Zener voltage Vz(V)
Symbol
Operating resistance Zz()
Rising operataing
resistance Zz()
Reverse current
IR(uA)
MIN. MAX. Iz(mA) MAX.
Iz(mA) MAX. Iz(mA) MAX. VR(V)
UDZS 3.6B
UDZS 3.9B
UDZS 4.3B
UDZS 4.7B
UDZS 5.1B
UDZS 5.6B
UDZS 6.2B
UDZS 6.8B
UDZS 7.5B
UDZS 8.2B
UDZS 9.1B
UDZS 10B
UDZS 11B
UDZS 12B
UDZS 13B
UDZS 15B
UDZS 16B
UDZS 18B
UDZS 20B
UDZS 22B
UDZS 24B
UDZS 27B
UDZS 30B
UDZS 33B
3.600
3.890
4.170
4.550
4.980
5.490
6.060
6.650
7.280
8.020
8.850
9.770
10.760
11.740
12.910
14.340
15.850
17.560
19.520
21.540
23.720
26.190
29.190
32.150
3.845
4.160
4.430
4.750
5.200
5.730
6.330
6.930
7.600
8.360
9.230
10.210
11.220
12.240
13.490
14.980
16.510
18.350
20.390
22.470
24.780
27.530
30.690
33.790
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
100
100
100
100
80
60
60
40
30
30
30
30
30
30
37
42
50
65
85
100
120
150
200
250
5.0
1000 1.0
10.0
1.0
5.0
1000 1.0
5.0
1.0
5.0
1000 1.0
5.0
1.0
5.0
800 0.5
2.0
1.0
5.0
500 0.5
2.0
1.5
5.0
200 0.5
1.0
2.5
5.0
100 0.5
1.0
3.0
5.0
60 0.5
0.5
3.5
5.0
60 0.5
0.5
4.0
5.0
60 0.5
0.5
5.0
5.0
60 0.5
0.5
6.0
5.0
60 0.5
0.1
7.0
5.0
60 0.5
0.1
8.0
5.0
80 0.5
0.1
9.0
5.0 80 0.5 0.1 10.0
5.0 80 0.5 0.1 11.0
5.0 80 0.5 0.1 12.0
5.0 80 0.5 0.1 13.0
5.0 100 0.5 0.1 15.0
5.0 100 0.5 0.1 17.0
5.0 120 0.5 0.1 19.0
5.0 150 0.5 0.1 21.0
5.0 200 0.5 0.1 23.0
5.0 250 0.5 0.1 25.0
UDZS 36B 35.070 36.870 5.0
300
5.0 300 0.5 0.1 27.0
()The zener voltage(Vz) is measured 40ms after power is supplied.
()The operating resistances(Zz,Zzk) are measured by superimposing a minute alternating current
on the regulated current(Iz)
Type No.
TYPE
UDZS  3.6B
UDZS  3.9B
UDZS  4.3B
UDZS  4.7B
UDZS  5.1B
UDZS  5.6B
UDZS  6.2B
UDZS  6.8B
UDZS  7.5B
UDZS  8.2B
UDZS  9.1B
UDZS  10B
UDZS  11B
TYPE NO.
62
72
82
92
A2
C2
E2
F2
H2
J2
L2
05
15
TYPE
UDZS  12B
UDZS  13B
UDZS  15B
UDZS  16B
UDZS  18B
UDZS  20B
UDZS  22B
UDZS  24B
UDZS  27B
UDZS  30B
UDZS  33B
UDZS  36B
 
TYPE NO.
25
35
45
55
65
75
85
95
A5
C5
E5
F5
 
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c 2012 ROHM Co., Ltd. All rights reserved.
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UDZS18B
Electrical characteristic curves (Ta=25C)
10
Data Sheet
1
0.1
4.7
0.01 4.3
3.9
3.6
5.1 5.6
6.8
6.2 7.5
8.2 9.1
10 11 12 13 15 16 18
20 22
24
27
30
0.001
0
5 10 15 20 25 30
ZENER VOLTAGE:Vz(V)
Vz-Iz CHARACTERISTICS
33 36
35
40
250
200
150
100
50
0
0 25 50 75 100 125 150
AMBIENT TEMPERATURE:Ta(℃)
Pd-Ta CHARACTERISTICS
0.12
0.1
0.08
0.06
0.04
0.02
0
-0.02
-0.04
-0.06
-0.08
0
10 20 30
ZENER VOLTAGE:Vz(V)
γz-Vz CHARACTERISTICS
40
35
30
25
20
15
10
5
0
-5
40
10000
1000
100
PRSM
t
10
1
0.1
0.001 0.01 0.1 1 10 100
TIME:t(ms)
PRSM-TIME CHARACTERISTICS
1000
Rth(j-a)
100 Rth(j-c)
10
1
0.1
0.001
Mounted on epoxy board
IM=10mA
IF=100mA
1ms time
300us
0.01 0.1 1 10 100
TIME:t(s)
Rth-t CHARACTERISTICS
1000
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UDZS18B
Data Sheet
Ta=-25℃ Ta=25℃ Ta=75℃ Ta=125℃
10
1
0.1
100
10
1
0.1
Ta=125℃
Ta=75℃
Ta=25℃
100
10
f=1MHz
0.01
Ta=-25℃
0.01
0.001
0.001
16
17 18 19
ZENER VOLTAGE:Vz(V)
Vz-Iz CHARACTERISTICS
0.0001
20 0 1 2 3 4 5 6 7 8 9 10 11 12 13
REVERSE VOLTAGE:VR(V)
VR-IR CHARACTERISTICS
1
0 2 4 6 8 10 12 14
REVERSE VOLTAGE:VR(V)
VR-Ct CHARACTERISTICS
18.2 1 20
Ta=25℃
0.9
Ta=25℃
19
IZ=5mA
R=13V
18.1
n=10pcs
0.8
n=30pcs
18
0.7 17
18 0.6 16
0.5 15
17.9 0.4 14
17.8
AVE:17.90V
17.7
0.3
0.2 AVE:0.0962nA
0.1
0
13
12
11
10
Vz DISPERSION MAP
IR DISPERSION MAP
Ta=25℃
f=1MHz
VR=0V
n=10pcs
AVE:13.98pF
Ct DISPERSION MAP
10000
1000
100
0.1
1
ZENER CURRENT(mA)
Zz-Iz CHARACTERISTICS
10
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Datasheet
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU CHINA
CLASS
CLASS
CLASS
CLASSb
CLASS
CLASS
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001