MCIMX35SR2CEC.pdf 데이터시트 (총 30 페이지) - 파일 다운로드 MCIMX35SR2CEC 데이타시트 다운로드

No Preview Available !

Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MCIMX35SR2CEC
Rev. 10, 06/2012
IMX35
i.MX35 Applications
Processors for
Industrial and
Consumer Products
Package Information
Plastic Package
Case 5284 17 x 17 mm, 0.8 mm Pitch
Ordering Information
See Table 1 on page 3 for ordering information.
1 Introduction
The i.MX353 and the i.MX357 multimedia applications
processors represent the next generation of ARM11
products with the right performance and integration to
address applications within the industrial and consumer
markets for applications such as HMI and display
controllers. Unless otherwise specified, the material in
this data sheet is applicable to both the i.MX353 and
i.MX357 devices and referred to singularly throughout
this document as i.MX35 or MCIMX35. The i.MX353
devices do not include a graphics processing unit
(GPU). For information on i.MX35 devices for
automotive applications, please refer to document
number, MCIMX35SR2AEC.
The i.MX35 processor takes advantage of the
ARM1136JF-S™ core running at 532 MHz that is
boosted by a multi-level cache system and integrated
features such as LCD controller, Ethernet, and graphics
acceleration for creating rich user interfaces.
The i.MX35 supports connections to various types of
external memories, such as SDRAM, mobile DDR, and
DDR2, SLC and MCL NAND Flash, NOR Flash and
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Functional Description and Application Information. . . . . . 4
2.1. Application Processor Domain Overview . . . . . . . . . 5
2.2. Shared Domain Overview . . . . . . . . . . . . . . . . . . . . 6
2.3. Advanced Power Management Overview . . . . . . . . 6
2.4. ARM11 Microprocessor Core. . . . . . . . . . . . . . . . . . 6
2.5. Module Inventory . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3. Signal Descriptions: Special Function Related Pins . . . . 12
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.1. i.MX35 Chip-Level Conditions . . . . . . . . . . . . . . . . 12
4.2. Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.3. Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.4. Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.5. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 18
4.6. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . 19
4.7. I/O Pin DC Electrical Characteristics . . . . . . . . . . . 20
4.8. I/O Pin AC Electrical Characteristics . . . . . . . . . . . 23
4.9. Module-Level AC Electrical Specifications . . . . . . . 29
5. Package Information and Pinout . . . . . . . . . . . . . . . . . . 130
5.1. MAPBGA Production Package 1568-01, 17 × 17 mm,
0.8 Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
5.2. MAPBGA Signal Assignments . . . . . . . . . . . . . . . 132
6. Product Documentation . . . . . . . . . . . . . . . . . . . . . . . . . 144
7. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
© Freescale Semiconductor, Inc., 2010. All rights reserved.
Free Datasheet http://www.Datasheet4U.com

No Preview Available !

SRAM. The devices can be connected to a variety of external devices such as USB 2.0 OTG, ATA,
MMC/SDIO, and Compact Flash.
1.1 Features
It provides low-power solutions for applications demanding high-performance multimedia and graphics.
The i.MX35 is based on the ARM1136 platform, which has the following features:
• ARM1136JF-S processor, version r1p3
• 16-Kbyte L1 instruction cache
• 16-Kbyte L1 data cache
• 128-Kbyte L2 cache, version r0p4
• 128 Kbytes of internal SRAM
• Vector floating point unit (VFP11)
To boost multimedia performance, the following hardware accelerators are integrated:
• Image processing unit (IPU)
• OpenVG 1.1 graphics processing unit (GPU) (not available for the MCIMX351)
The MCIMX35 provides the following interfaces to external devices (some of these interfaces are muxed
and not available simultaneously):
• 2 controller area network (CAN) interfaces
• 2 SDIO/MMC interfaces, 1 SDIO/CE-ATA interface (CE-ATA is not available for the MCIMX351)
• 32-bit mobile DDR, DDR2 (4-bank architecture), and SDRAM (up to 133 MHz)
• 2 configurable serial peripheral interfaces (CSPI) (up to 52 Mbps each)
• Enhanced serial audio interface (ESAI)
• 2 synchronous serial interfaces (SSI)
• Ethernet MAC 10/100 Mbps
• 1 USB 2.0 host with ULPI interface or internal full-speed PHY. Up to 480 Mbps if external HS
PHY is used.
• 1 USB 2.0 OTG (up to 480 Mbps) controller with internal high-speed OTG PHY
• Flash controller—MLC/SLC NAND and NOR
• GPIO with interrupt capabilities
• 3 I2C modules (up to 400 Kbytes each)
• JTAG
• Key pin port
• Asynchronous sample rate converter (ASRC)
• 1-Wire
• Parallel camera sensor (4/8/10/16-bit data port for video color models: YCC, YUV, 30 Mpixels/s)
• Parallel display (primary up to 24-bit, 1024 x 1024)
• Parallel ATA (up to 66 Mbytes) (not available for the MCIMX351)
i.MX35 Applications Processors for Industrial and Consumer Products, Rev. 10
2 Freescale Semiconductor
Free Datasheet http://www.Datasheet4U.com

No Preview Available !

• PWM
• SPDIF transceiver
• 3 UART (up to 4.0 Mbps each)
1.2 Ordering Information
Table 1 provides the ordering information for the i.MX35 processors for consumer and industrial
applications.
Table 1. Ordering Information
Description
Part Number
Silicon
Revision
Package1
Speed
Operating
Temperature
Range (°C)
i.MX353
MCIMX353CVM5B
2.0
5284
i.MX353
MCIMX353DVM5B
2.0
5284
i.MX357
MCIMX357CVM5B
2.0
5284
i.MX357
MCIMX357DVM5B
2.0
5284
i.MX353
MCIMX353CJQ5C
2.1
5284
i.MX353
MCIMX353DJQ5C
2.1
5284
i.MX357
MCIMX357CJQ5C
2.1
5284
i.MX357
MCIMX357DJQ5C
2.1
5284
1 Case 5284 is RoHS-compliant, lead-free, MSL = 3, 1.
532 MHz
532 MHz
532 MHz
532 MHz
532MHz
532MHz
532MHz
532MHz
–40 to 85
–20 to 70
–40 to 85
–20 to 70
-40 to 85
-20 to 70
-40 to 85
-20 to 70
Signal Ball
Map
Locations
Table 94
Table 94
Table 94
Table 94
Table 95
Table 95
Table 95
Table 95
Ball Map
Table 96
Table 96
Table 96
Table 96
Table 97
Table 97
Table 97
Table 97
The ball map for silicon revision 2.1 is different than the ballmap for silicon revision 2.0. The layout for
each revision is not compatible, so it is important that the correct ballmap be used to implement the layout.
See Section 5, “Package Information and Pinout.”
Table 2 shows the functional differences between the different parts in the i.MX35 family.
Table 2. Functional Differences in the i.MX35 Parts
Module
I2C (3)
CSPI (2)
SSI/I2S (2)
ESAI
SPDIF I/O
USB HS Host
USB OTG
FlexCAN (2)
MLB
MCIMX351
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
MCIMX353
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
MCIMX355
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
MCIMX356
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
MCIMX357
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
i.MX35 Applications Processors for Industrial and Consumer Products, Rev. 10
Freescale Semiconductor
3
Free Datasheet http://www.Datasheet4U.com

No Preview Available !

Table 2. Functional Differences in the i.MX35 Parts (continued)
Module
Ethernet
1-Wire
KPP
SDIO/MMC (2)
SDIO/Memory Stick
External Memory Controller (EMC)
JTAG
PATA
CE-ATA
Image Processing Unit (IPU) (inversion
and rotation, pre- and post-processing,
camera interface, blending, display
controller)
Open VG graphics acceleration (GPU)
MCIMX351
Yes
Yes
Yes
Yes
Yes
Yes
Yes
MCIMX353
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
MCIMX355
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
MCIMX356
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
MCIMX357
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
i.MX35 Applications Processors for Industrial and Consumer Products, Rev. 10
4 Freescale Semiconductor
Free Datasheet http://www.Datasheet4U.com

No Preview Available !

1.3 Block Diagram
Figure 1 is the i.MX35 simplified interface block diagram.
DDR2/SDDR
RAM
NOR
Flash/
PSRAM
NAND
Flash
Camera
Sensor
LCD Display 1 External Graphics
LCD Display 2 Accelerator
External Memory
Interface (EMI)
Smart
DMA
SPBA
Peripherals
MSHC
ESAI
SPDIF
SSI
UART
ASRC
CSPI
ATA
FEC
3 FuseBox
ARM11
Platform
ARM1136JF-S
VFP
L1 I/D cache
L2 cache
AVIC
MAX
AIPS (2)
ETM
Internal
Memory
Image
Processing Unit
(IPU)
ARM1136 Platform Peripherals
SSI
AUDMUX
I2C(3)
UART(2)
CSPI
CAN(2)
IIM
RTICv3
RNGC
SCC
KPP
PWM
OWIRE
HS USBOTG
HS USBOTGPHY
HS USBHost
FS USBPHY
GPU 2D
eSDHC(3)
ECT
IOMUX
GPIO(3)
EPIT
Timers
RTC
WDOG
GPT
Audio/Power
Management JTAG
Bluetooth
MMC/SDIO
or WLAN
Keypin
Connectivity
Access
Figure 1. i.MX35 Simplified Interface Block Diagram
2 Functional Description and Application Information
The i.MX35 consists of the following major subsystems:
• ARM1136 Platform—AP domain
• SDMA Platform and EMI—Shared domain
2.1 Application Processor Domain Overview
The applications processor (AP) and its domain are responsible for running the operating system and
applications software, providing the user interface, and supplying access to integrated and external
peripherals. The AP domain is built around an ARM1136JF-S core with 16-Kbyte instruction and data L1
caches, an MMU, a 128-Kbyte L2 cache, a multiported crossbar switch, and advanced debug and trace
interfaces.
i.MX35 Applications Processors for Industrial and Consumer Products, Rev. 10
Freescale Semiconductor
5
Free Datasheet http://www.Datasheet4U.com