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MURS360BT3G,
NRVUS360VBT3G,
SURS8360BT3G
Surface Mount
Ultrafast Power Rectifiers
Ideally suited for high voltage, high frequency rectification, or as
free wheeling and protection diodes in surface mount applications
where compact size and weight are critical to the system.
Features
Small Compact Surface Mountable Package with J−Bend Leads
Rectangular Package for Automated Handling
High Temperature Glass Passivated Junction
NRVUS and SURS8 Prefix for Automotive and Other Applications
Requiring Unique Site and Control Change Requirements;
AEC−Q101 Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
Mechanical Characteristics
Case: Epoxy, Molded
Epoxy Meets UL 94 V−O @ 0.125 in
Weight: 95 mg (approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Polarity: Polarity Band Indicates Cathode Lead
ESD Rating:
Human Body Model (HBM) 3B (> 8 kV)
Machine Model (MM) C (> 400 V)
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
Non−Repetitive Peak Surge Current
(Surge applied at rated load conditions
halfwave, single phase, 60 Hz)
VRRM
VRWM
VR
IF(AV)
IFSM
600
3.0 @ TL = 105°C
100
V
A
A
Operating Junction Temperature
TJ
*65 to +175
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
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ULTRAFAST RECTIFIERS
3 AMPERES
600 VOLTS
SMB
CASE 403A
MARKING DIAGRAM
AYWW
B36BG
G
B36B
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
MURS360BT3G
SMB
(Pb−Free)
NRVUS360VBT3G
SMB
(Pb−Free)
NRVUS360VDBT3G SMB
(Pb−Free)
Shipping
2,500 /
Tape & Reel
2,500 /
Tape & Reel
2,500 /
Tape & Reel
SURS8360BT3G
SMB
2,500 /
(Pb−Free) Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2016
November, 2016 − Rev. 7
1
Publication Order Number:
MURS360BT3/D

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MURS360BT3G, NRVUS360VBT3G, SURS8360BT3G
THERMAL CHARACTERISTICS
Characteristic
Symbol
Value
Unit
Thermal Resistance, Junction−to−Lead (Note 1)
Thermal Resistance, Junction−to−Ambient (Note 1)
1. Mounted with minimum recommended pad size, PC Board FR4.
RqJL
14 °C/W
RqJA
125
ELECTRICAL CHARACTERISTICS
Characteristic
Symbol
Typ
Max
Unit
Maximum Instantaneous Forward Voltage (Note 2)
(iF = 3.0 A, TJ = 25°C)
(iF = 3.0 A, TJ = 150°C)
vF V
− 1.25
0.83 1.05
Maximum Instantaneous Reverse Current (Note 2)
(Rated DC Voltage, TJ = 25°C)
(Rated DC Voltage, TJ = 150°C)
iR mA
− 3.0
95 150
Maximum Reverse Recovery Time
(iF = 1.0 A, di/dt = 50 A/ms)
(iF = 0.5 A, iR = 1.0 A, IR to 0.25 A)
trr ns
− 75
− 50
Maximum Forward Recovery Time
(iF = 1.0 A, di/dt = 100 A/ms, Rec. to 1.0 V)
tfr ns
− 50
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%.
TYPICAL CHARACTERISTICS
10 10
125°C
150°C
25°C
11
150°C
125°C
25°C
0.1 0.1
0.01
0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 1. Typical Forward Voltage
1.2
0.1
0.01
0.001
150°C
125°C
0.01
0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 2. Maximum Forward Voltage
1
0.1
150°C
0.01
125°C
0.0001
0.00001
25°C
0.001
0.0001 25°C
0.000001
0
100 200 300 400 500
Vr, REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Current
0.00001
600 0
100 200 300 400 500
Vr, REVERSE VOLTAGE (V)
Figure 4. Maximum Reverse Current
600
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MURS360BT3G, NRVUS360VBT3G, SURS8360BT3G
TYPICAL CHARACTERISTICS
70 5
dc
60 TJ = 25°C
f = 1 MHz
4
50 Square
40 3
30 2
20
1
10
00
0 20 40 60 80 100
65 75 85 95 105 115 125 135 145 155
Vr, REVERSE VOLTAGE (V)
TC, CASE TEMPERATURE (°C)
Figure 5. Typical Capacitance
Figure 6. Current Derating, Lead
3
dc
2
dc
1
Square Wave
RqJA = 71°C/W
RqJA = 120°C/W
No Heatsink
4
TJ = 150°C
3
2
1
Square Wave
dc
0
0 25 50 75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Figure 7. Current Derating, Ambient
0
01234
IF(AV), AVERAGE FORWARD CURRENT (A)
Figure 8. Typical Forward Power Dissipation
4
TJ = 150°C
3
2
1
Square Wave
dc
10000
1000
100
0
0123
IF(AV), AVERAGE FORWARD CURRENT (A)
Figure 9. Maximum Forward Power
Dissipation
4
10
10
100
1,000
10,000
tp, SQUARE WAVE PULSE DURATION (ms)
Figure 10. Typical Non−Repetitive Surge
Current
*Typical performance based on a limited sample size.
ON Semiconductor does not guarantee ratings not listed
in the Maximum Ratings table.
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MURS360BT3G, NRVUS360VBT3G, SURS8360BT3G
100
50% Duty Cycle
20%
10 10%
5%
2%
1
1%
0.1
Single Pulse
0.01
0.000001 0.00001
0.0001
0.001
0.01 0.1
PULSE TIME (s)
1
Figure 11. Thermal Response, Junction−to−Ambient
10
100
1000
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MURS360BT3G, NRVUS360VBT3G, SURS8360BT3G
PACKAGE DIMENSIONS
HE
E
bD
POLARITY INDICATOR
OPTIONAL AS NEEDED
SMB
CASE 403A−03
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1.
MILLIMETERS
DIM MIN NOM MAX
A 1.95
2.30
2.47
A1 0.05
0.10
0.20
b 1.96 2.03 2.20
c 0.15 0.23 0.31
D 3.30
3.56
3.95
E 4.06
4.32
4.60
H E 5.21 5.44 5.60
L 0.76 1.02 1.60
L1 0.51 REF
MIN
0.077
0.002
0.077
0.006
0.130
0.160
0.205
0.030
INCHES
NOM
0.091
0.004
0.080
0.009
0.140
0.170
0.214
0.040
0.020 REF
MAX
0.097
0.008
0.087
0.012
0.156
0.181
0.220
0.063
A
L
L1 c
A1
SOLDERING FOOTPRINT*
2.261
0.089
2.743
0.108
2.159
0.085
ǒ ǓSCALE 8:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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MURS360BT3/D
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