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SSM6N37FE
TOSHIBA Field-Effect Transistor Silicon N-Channel MOS Type
SSM6N37FE
High-Speed Switching Applications
Analog Switching Applications
1.5-V drive
Suitable for high-density mounting due to compact package
Low ON-resistance
RDS(ON) = 5.60 (max) (@VGS = 1.5 V)
RDS(ON) = 4.05 (max) (@VGS = 1.8 V)
RDS(ON) = 3.02 (max) (@VGS = 2.5 V)
RDS(ON) = 2.20 (max) (@VGS = 4.5 V)
単位: mm
1.6±0.05
1.2±0.05
16
25
34
Absolute Maximum Ratings (Ta = 25°C) (Q1, Q2 Common)
Characteristic
Symbol
Rating
Unit
Drain–source voltage
Gate–source voltage
Drain current
Drain power dissipation
Channel temperature
Storage temperature
DC
Pulse
VDSS
VGSS
ID
IDP
PD (Note 1)
Tch
Tstg
20
± 10
250
500
150
150
55 to 150
V
V
mA
mW
°C
°C
ES6
1.Source1
2.Gate1
3.Drain2
4.Source2
5.Gate2
6.Drain1
JEDEC
JEITA
TOSHIBA
2-2N1D
Note: Using continuously under heavy loads (e.g. the application of high
Weight: 3.0 mg (typ.)
temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating
conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Total rating
Mounted on an FR4 board
(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 0.135 mm2 × 6)
Marking
65
4
Equivalent Circuit (top view)
6 54
SU
Q1
Q2
123
1 23
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SSM6N37FE
Electrical Characteristics (Ta = 25°C) (Q1, Q2 Common)
Characteristic
Drain-source breakdown voltage
Drain cutoff current
Gate leakage current
Gate threshold voltage
Forward transfer admittance
Drain-source ON-resistance
Input capacitance
Output capacitance
Reverse transfer capacitance
Switching time
Turn-on time
Turn-off time
Drain-source forward voltage
Note 2: Pulse test
Symbol
Test Condition
Min
V (BR) DSS
V (BR) DSX
IDSS
IGSS
Vth
|Yfs|
RDS (ON)
Ciss
Coss
Crss
ton
toff
VDSF
ID = 1 mA, VGS = 0 V
ID = 1 mA, VGS = -10 V
VDS = 20 V, VGS = 0 V
VGS = ±10 V, VDS = 0 V
VDS = 3 V, ID = 1 mA
VDS = 3 V, ID = 100 mA (Note 2)
ID = 100 mA, VGS = 4.5 V (Note 2)
ID = 50 mA, VGS = 2.5 V (Note 2)
ID = 20 mA, VGS = 1.8 V (Note 2)
ID = 10 mA, VGS = 1.5 V (Note 2)
VDS = 10 V, VGS = 0 V, f = 1 MHz
VDD = 10 V, ID = 100 mA
VGS = 0 to 2.5 V, RG = 50 Ω
ID = -250 mA, VGS = 0 V (Note 2)
20
12
0.35
0.14
Typ.
0.28
1.65
2.16
2.66
3.07
12
5.5
4.1
18
36
-0.9
Max Unit
V
1 μA
±1 μA
1.0 V
S
2.20
3.02
Ω
4.05
5.60
pF
ns
-1.2 V
Switching Time Test Circuit (Q1, Q2 Common)
(a) Test Circuit
2.5 V
IN
0
10 μs
OUT
VDD = 10 V
RG = 50 Ω
D.U. 1%
VIN: tr, tf < 5 ns
Common Source
Ta = 25°C
(b) VIN
2.5 V
0V
(c) VOUT VDD
VDD
VDS (ON)
10%
90%
90%
10%
tr
tf
ton toff
Precaution
Let Vth be the voltage applied between gate and source that causes the drain current (ID) to be low (1mA for the
SSM6N37FE). Then, for normal switching operation, VGS(on) must be higher than Vth, and VGS(off) must be lower than
Vth. This relationship can be expressed as: VGS(off) < Vth < VGS(on).
Take this into consideration when using the device.
Do not use this device under avalanche mode. It may cause the device to break down.
Handling Precaution
When handling individual devices that are not yet mounted on a circuit board, make sure that the environment is
protected against electrostatic discharge. Operators should wear antistatic clothing, and containers and other objects that
come into direct contact with devices should be made of antistatic materials.
Thermal resistance Rth (j-a) and drain power dissipation PD vary depending on board material, board area, board
thickness and pad area. When using this device, please take heat dissipation into consideration.
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(Q1, Q2 Common)
500
400
300
200
100
0
0
ID – VDS
10 V
4.5 V
2.5 V
1.8 V
1.5 V
VGS = 1.2 V
Common Source
Ta = 25 °C
0.2 0.4 0.6 0.8 1.0
Drain-source voltage VDS (V)
SSM6N37FE
1000
100
Ta = 100 °C
10
ID – VGS
1
0.1
0.01
0
25 °C
25 °C
Common Source
VDS = 3 V
1.0 2.0 3.0
Gate-source voltage VGS (V)
RDS (ON) – VGS
6
ID =100mA
5 Common Source
4
3 25 °C
2 Ta = 100 °C
1 25 °C
0
0 2 4 6 8 10
Gate-source voltage VGS (V)
RDS (ON) – ID
6
Common Source
5 Ta = 25°C
4
1.5 V
1.8 V
3
2.5V
2
VGS = 4.5
1
0
0
100 200 300
400
Drain current ID (mA)
500
RDS (ON) – Ta
5
Common Source
ID = 10m A / VGS = 1.5 V
4 20m A / 1.8 V
50m A / 2.5 V
3
2
100m A / 4.5 V
1
0
50 0 50 100 150
Ambient temperature Ta (°C)
Vth – Ta
1.0
Common Source
VDS = 3 V
ID = 1 mA
0.5
0
50 0 50 100 150
Ambient temperature Ta (°C)
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(Q1, Q2 Common)
1000
300
Common Source
VDS = 3 V
Ta = 25°C
|Yfs| – ID
100
30
10
1 10 100 1000
Drain current ID (mA)
C – VDS
100
50
30
Ciss
10
5 Coss
3 Common Source
Ta = 25°C
f = 1 MHz
VGS = 0 V
1
0.1
1
Crss
10
Drain-source voltage VDS (V)
100
PD* – Ta
250 Mounted on FR4 board.
(25.4mm × 25.4mm × 1.6mm , Cu Pad : 0.135 mm2 × 6)
200
150
100
150
0
-40 -20 0 20 40 60 80 100 120 140 160
*:Total Rating Ambient temperature Ta (°C)
SSM6N37FE
IDR – VDS
1000
100
25 °C
10
Ta =100 °C
1
Common Source
VGS = 0 V
D
G IDR
25 °C
0.1 S
0
–0.5
–1.0
–1.5
Drain-source voltage VDS (V)
1000
toff
tf
100
t – ID
Common Source
VDD = 10 V
VGS = 0 to 2.5 V
Ta = 25 °C
RG = 50Ω
ton
10
tr
1
1 10 100 1000
Drain current ID (mA)
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SSM6N37FE
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR
APPLICATIONS.
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
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ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
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FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
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technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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