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High Temperature
Thick Film Chip Resistors
HTC Series
Operation to 200°C
Excellent high temperature stability
Improved working voltage ratings
Pb-free wrap-around terminations
Standard chip sizes available from 1206 to 2512
Electrical Data
Characteristic
Resistance Range
150°C Power Rating
Max Voltage Rating
1206
200mW
200V
2010
1W to 10MW; ±1%, ±5%
10W to 1MW; ±0.5%, ±5%, ±1%
500mW
400V
2512
750mW
500V
Absolute TCR
± 100ppm/°C
Operating Temperature
-55°C to +200°C
Pad/Trace Area1
80mm2
200mm2
300mm2
Termination
Wrap-around Pb-free with leach resistant Ni barrier
Note1 : Recommended minimum pad and adjacent trace area for each termination for rated power on FR4 PCB.
Environmental Data
Test
Method
Load Life
High Temperature Exposure
Short Time Overload
Moisture Resistance
MIL-STD-202 Method 108
(Rated Power for 1000hrs @ 150°C)
1000 hours @ 200°C
MIL-PRF-55342H
(6.25X rated power for 5secs)
MIL-STD-202 Method 106G
Thermal Shock
MIL-STD-202 Method 107G Condition B
Resistance to Soldering Heat
Solderability
Note2 : 0.01W added for all resistance values <10W.
MIL-STD-202 Method 210F
MIL-STD-202 Method 208
(245°C, 5 seconds)
Specification
Maximum2
Typical
1.00%
0.25%
1.00%
0.20%
1.00%
0.10%
1.00%
0.25%
0.25%
0.25%
0.05%
0.05%
>95% Coverage
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TTelectronics plc
HTC Series Issue May 2009

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Pulse Withstanding
Chip Resistors
Physical Data
A
W
T
B
L
C
Overglaze
(Stability Enhancer)
Protective Overcoat
Sn Plating
Ni Barrier Layer
High Reliability
Resistance Element
Alumina Substrate
Conductor
Part Type
1206
2010
2512
L (mm)
3.2±0.4
5.1±0.3
6.5±0.3
W (mm)
1.6±0.2
2.5±0.2
3.2±0.2
T max (mm)
0.7
0.8
0.8
A (mm)
0.4±0.15
0.6±0.25
0.6±0.25
B min (mm)
0.4±0.2
0.6±0.3
0.6±0.3
C (mm)
1.7
3.0
4.4
Weight (grams)
0.020
0.036
0.055
Construction:
Thick film resistor material, overglaze and organic protection are screen printed on a 96% alumina substrate. Wrap-around
terminations have an electroplated Ni barrier and pure Sn matte finish, ensuring excellent `leach´ resistance properties and
solderability.
Marking:
Components are not marked. Reels are marked with type, value, tolerance, date code and quantity.
Solvent resistance:
The body protection is resistant to all normal industrial cleaning solvents suitable for printed circuits.
Power Derating Data
100
50
10
150°
Temperature in °C
200°
Ordering Data
Prefix
TKC - HTC - 2512LF - 100R - F
Chip Type
HTC (High Temperature Chip)
Chip Size and Termination
1206LF = 100% Tin (pb-free) termination
2010LF = 100% Tin (pb-free) termination
2512LF = 100% Tin (pb-free) termination
Resistance Value (4 Digit Code)
Ex. 1R00 = 1; 100R = 100; 10K0 =10K; 1M50 = 1.5M
Tolerance Code
J = ±5%; F = ±1%; D = ±0.5%
For additional information or to discuss your specific requirements,
please contact our Applications Team using the contact details below.
Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
HTC Series Issue May 2009