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For FPC
FPC connectors
(0.4mm pitch)
Back lock
Y4BH Series
New
RoHS compliant
FEATURES
1. Differential impedance matching
(100, 90, 85 Ω) compliant with various
high-speed transmission standards
FPC connector for high-speed
transmission
By matching the differential impedance,
this FPC connector offers excellent high-
speed differential transmission
characteristics and supports all high-
speed transmission standards
(when pin assignments are GSSG).
120
110
100
90
80
70
60
100
Connector
FPC
Tr = 40ps (20-80%)
200 300 400 500 600
Time, ps
2. Mechanical design freedom is
achieved with 0.4 mm pitch, 1.0 mm
height and double top and bottom
contacts
More freedom in mechanical design
With top and bottom contact construction
and no pin assignments, this FPC
connector contributes to customer design
freedom. (All pins can be used except
those for differential signals.)
1.00
3.20
Unit: mm
3. Easy-to-handle back lock structure
4. Man-hours of assembly time can be
reduced by delivering the connectors
with their levers opened.
APPLICATIONS
Compact electronic devices such as
PCs, tablet PCs, digital still cameras
and digital video cameras.
ORDERING INFORMATION
AYF
41: 0.4 mm pitch (Back lock)
100Ω matched Differential impedance
42: 0.4 mm pitch (Back lock)
85Ω and 90Ω matched Differential impedance
Number of pins (2 digits)
Contact direction
3: Top and bottom double contacts
Surface treatment (Contact portion / Terminal portion)
5: Au plating/Au plating (Ni barrier)
35
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ACCTB67E 201410-T

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FPC connectors Y4BH (0.4mm pitch)
PRODUCT TYPES
Height
Differential impedance
Number of pins
Part number
1.0 mm
85Ω and 90Ω types
100Ω type
40
50
40
50
AYF424035
AYF425035
AYF414035
AYF415035
Notes: 1. Order unit; For volume production: 1-inner carton (1-reel) units.
Samples for mounting check: 50-connector units. Please contact our sales office.
Samples: Small lot orders are possible. Please contact our sales office.
2. Please contact our sales office for connectors having a number of pins other than those listed above.
Packing
Inner carton (1-reel)
Outer carton
5,000 pieces
10,000 pieces
SPECIFICATIONS
1. Characteristics: When using an applicable FPC (thickness 0.30 mm)
Item
Rated current
Rated voltage
Insulation resistance
Specifications
0.3A/pin contact
50V AC/DC
Min. 1,000MΩ (initial)
Breakdown voltage
250V AC for 1 min.
Electrical
characteristics
Contact resistance
Differential impedance
Max. 100mΩ
85Ω and 90Ω types
85Ω±10Ω (Connector part)
90Ω±10Ω (Connector part)
100Ω type
100Ω±15Ω (Connector part)
Mechanical
characteristics
FPC holding force
Ambient temperature
Storage temperature
Min. 0.10N/pin contact × pin contacts (initial)
–55°C to +85°C
–55°C to +85°C (Product only)
–40°C to +50°C (Emboss packaging)
Thermal shock resistance
(with FPC mated)
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
Environmental
characteristics
Humidity resistance
(with FPC mated)
Saltwater spray resistance
(with FPC mated)
H2S resistance
(with FPC mated)
Soldering heat resistance
Lifetime
characteristics
Unit weight
Insertion and removal life
2. Material and surface treatment
Part name
Molded portion
Contact
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
48 hours,
contact resistance max. 100mΩ
Peak temperature: 260°C or less
300°C within 5 sec. 350°C within 3 sec.
20 times
50 pin contacts: 0.10 g
Material
Housing: LCP resin (UL94V-0)
Lever: LCP resin (UL94V-0)
Copper alloy
Conditions
Using 250V DC megger (applied for 1 min.)
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Based on the contact resistance measurement method
specified by JIS C 5402.
Differential signal
Rise times (Tr): 40 ps (20% to 80%)
(FPC and PC board: Differential impedance 85Ω or 90Ω
controlled.)
Differential signal
Rise times (Tr): 40 ps (20% to 80%)
(FPC and PC board: Differential impedance 100Ω
controlled.)
Measurement of the maximum force applied until the
inserted compatible FPC is pulled out in the insertion axis
direction while the connector lever is closed
No freezing at low temperatures. No dew condensation.
Conformed to MIL-STD-202F, method 107G
Order
1
2
3
4
Temperature (°C)
–5503
85+30
–5503
Time (minutes)
30
Max. 5
30
Max. 5
Bath temperature 40±2°C,
humidity 90 to 95% R.H.
Bath temperature 35±2°C,
saltwater concentration 5±1%
Bath temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Reflow soldering
Soldering iron
Repeated insertion and removal: min. 10 sec./time
Surface treatment
Contact portion; Base: Ni plating, Surface: Au plating
Terminal portion; Base: Ni plating, Surface: Au plating
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DIMENSIONS (Unit: mm)
CAD Data
FPC connectors Y4BH (0.4mm pitch)
The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/
0.40±0.10
A
Terminal coplanarity
0.1
(Contact and
soldering terminals)
(0.15)
B±0.20
(3.70)
(1.60) (Suction area)
(0.10)
C±0.20
(0.30)
(0.50)
(1.50) (FPC insertion depth)
2.90
3.20
Number of pins/
dimension
40
50
A
18.00
22.00
B
17.32
21.32
C
15.60
19.60
Recommended FPC dimensions
(Finished thickness: t = 0.3±0.03)
The conductive parts should be based by Ni plating and then Au plating.
Normal FPC
Impedance matching FPC
(A+0.8)±0.05
A±0.03
0.40±0.07
0.40±0.03
0.27±0.03
R0.20±0.05
0.30±0.03
(A+0.8)±0.05
A±0.03
0.40±0.07
0.40±0.03
0.27
+0.04
0.03
0.10 max.
R0.20±0.05
0.30±0.03
Please match
100, 90 and 85Ω
differential
impedances.
Cutting direction*
*Cut FPC from the copper foil side
to the reinforcing plate side.
Please inquire separately for details about impedance
matching FPC.
Cutting direction*
*Cut FPC from the copper foil side
to the reinforcing plate side.
Number of pins/
dimension
40
50
A
15.60
19.60
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FPC connectors Y4BH (0.4mm pitch)
EMBOSSED TAPE DIMENSIONS (Unit: mm) (Common for respective contact type)
Specifications for taping
(A±0.3)
(C)
(B)
(1.75)
Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
(D±1)
Taping reel
Top cover tape
Embossed carrier tape
1.50 0+.00.1dia.
Label
Embossed mounting-hole
Dimension table (Unit: mm)
Number of pins
A
B
C
40
32.0
14.2
28.4
50
44.0
20.2
40.4
Connector orientation with respect to embossed tape feeding direction
Direction
of tape progress
Type
Y4BH
D
33.4
45.4
Quantity per reel
5,000
5,000
NOTES
1. Recommended PC board and metal mask patterns
Connectors are mounted with high pitch density, intervals of
contact pitch 0.4 mm, 0.5 mm or 0.6 mm.
In order to reduce solder and flux rise, solder bridges and other
issues make sure the proper levels of solder is used.
The figures to the right are recommended metal mask patterns.
Please use our recommended patterns basically.
Recommended PC board pattern (mounting layout)
0.40±0.05
0.23±0.05
0.40±0.05
0.86±0.05
0.86±0.05
Recommended metal mask pattern
Metal mask thickness: When 120μm
(Terminal portion opening area ratio: 86%)
(Terminal portion opening area ratio: 100%)
0.40±0.01
0.23±0.01
0.40±0.01
0.86±0.01
0.86±0.01
Please refer to the latest product specifications when
designing your product.
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ACCTB67E 201410-T

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Notes on Using FPC Connectors
Notes on Using FPC Connectors
PC board design
• Design the recommended foot pattern in order to secure the
mechanical strength in the soldered areas of the terminal.
• In order to facilitate the connector mount, make sure to design
the board with reduced warpage.
• Please design and pay attention to the distance from the board
edge to the pattern. When cutting the board, do not give an
excessive stress to the connector, which risks damaging the
connector.
(Y3BW/Y5BW)
• Depending on FPC dimension and FPC insertion location,
there is a possibility that the holding contact and an FPC pattern
of both end of signal contacts are in short-circuited.
Please design the equipment not to be affected even if a board
pattern of holding contacts and an FPC pattern of both end of
signal contacts are in short-circuited.
(For example: Do not connect a board pattern of holding
contacts and GND.
If connect a board pattern of holding contacts and GND, also
connect board pattern of both end of signal contacts.)
FPC and equipment design
• Design the FPC based with recommended dimensions to
ensure the required connector performance.
• When using back lock type, secure enough space for closing
the lever and for open-close operation of the lever.
• Make sure that connector positioning and FPC length are
appropriate to prevent diagonal insertion of the FPC.
• Due to the FPC size, weight, or the reaction force of the routed
FPC, FPC removed and connector deformation may occur by a
fall, vibration, or other impact. Carefully check the equipment
design and take required measures to prevent the FPC
removed.
If the shock of falling, vibration is applied to the FPC, please
design the equipment not to be applied a load to connector, such
as fixing the FPC.
• Make sure to design the FPC insertion part with reduced
warpage. Otherwise, the warpage may adversely affect the FPC
insertion.
(Y4BH)
When using in high-speed transmission applications,
please take care when designing the FPC, because the
differential impedance values may be uneven depending on
FPC dimensions settings, uneven dimensions, and layering
composition.
(Y3BW/Y5BW)
The holding contacts cannot be used as conductors.
The holding contacts are located on both ends of the
connector, and the shape of the soldered portions is the
same as that of the signal contacts.
Use caution to ensure connect identification.
(Y3BL)
Soldering terminal structure
Since soldering terminals touch FPC, note that the short
circuit may occur when the metal parts exposed on side of
FPC.
• Depending on FPC dimension, there is a possibility that
soldering terminals and an FPC pattern of both end of signal
contacts are in short-circuited.
Please design the equipment not to be affected even if a
board pattern of soldering terminals and an FPC pattern of
both end of signal contacts are in short-circuited.
(For example: Do not connect a board pattern of soldering
terminals and GND. If connect a board pattern of soldering
terminals and GND, also connect board pattern of both end of
signal contacts.)
Connector mounting
Excessive mounter chucking force may deform the molded or
metal part of the connector. Consult us in advance if chucking is
to be applied.
Soldering
1) Manual soldering
• Due to the connector’s compact size, if an excessive amount of
solder is applied during manual soldering, the solder may creep
up and flux wicking near the contact points, or solder interfer-
ence may cause impact contact.
• Make sure that the soldering iron tip is heated within the
temperature and time limits indicated in the specifications.
• Flux from the solder wire may adhere to the contact surfaces
during soldering operations. After soldering, carefully check the
contact surfaces and cleans off any flux solder use.
• Be aware that a load applied to the connector terminals while
soldering may displace the contact.
• Thoroughly clean the iron tip.
2) Reflow soldering
• Screen-printing is recommended for printing paste solder.
• To achieve the appropriate soldering state, make sure that the
reflow temperature, PC board foot pattern, window size and
thickness of metal mask are recommended condition.
• Note that excess solder on the terminals prevents complete
insertion of the FPC, and causes flux climbing up.
• A screen thickness of 120μm is recommended during cream
solder printing.
• Consult us when using a screen-printing thickness other than
that recommended.
• Depending on the size of the connector being used, self
alignment may not be possible. Accordingly, carefully position
the terminal with the PC board pattern.
• The recommended reflow temperature profile is given in the
figure below.
Temperature
260°C
230°C
180°C
150°C
Upper limit (Soldering heat resistance)
Lower limit (Solder wettability)
Peak temperature
Preheating
60 to 120 sec.
220°C
200°C
25 sec.
70 sec.
Time
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ACCTB13E 201410-T