Notes on Using FPC Connectors
Notes on Using FPC Connectors
■ PC board design
• Design the recommended foot pattern in order to secure the
mechanical strength in the soldered areas of the terminal.
• In order to facilitate the connector mount, make sure to design
the board with reduced warpage.
• Please design and pay attention to the distance from the board
edge to the pattern. When cutting the board, do not give an
excessive stress to the connector, which risks damaging the
• Depending on FPC dimension and FPC insertion location,
there is a possibility that the holding contact and an FPC pattern
of both end of signal contacts are in short-circuited.
Please design the equipment not to be affected even if a board
pattern of holding contacts and an FPC pattern of both end of
signal contacts are in short-circuited.
(For example: Do not connect a board pattern of holding
contacts and GND.
If connect a board pattern of holding contacts and GND, also
connect board pattern of both end of signal contacts.)
■ FPC and equipment design
• Design the FPC based with recommended dimensions to
ensure the required connector performance.
• When using back lock type, secure enough space for closing
the lever and for open-close operation of the lever.
• Make sure that connector positioning and FPC length are
appropriate to prevent diagonal insertion of the FPC.
• Due to the FPC size, weight, or the reaction force of the routed
FPC, FPC removed and connector deformation may occur by a
fall, vibration, or other impact. Carefully check the equipment
design and take required measures to prevent the FPC
If the shock of falling, vibration is applied to the FPC, please
design the equipment not to be applied a load to connector, such
as ﬁxing the FPC.
• Make sure to design the FPC insertion part with reduced
warpage. Otherwise, the warpage may adversely affect the FPC
When using in high-speed transmission applications,
please take care when designing the FPC, because the
differential impedance values may be uneven depending on
FPC dimensions settings, uneven dimensions, and layering
■ The holding contacts cannot be used as conductors.
The holding contacts are located on both ends of the
connector, and the shape of the soldered portions is the
same as that of the signal contacts.
Use caution to ensure connect identiﬁcation.
■ Soldering terminal structure
Since soldering terminals touch FPC, note that the short
circuit may occur when the metal parts exposed on side of
• Depending on FPC dimension, there is a possibility that
soldering terminals and an FPC pattern of both end of signal
contacts are in short-circuited.
Please design the equipment not to be affected even if a
board pattern of soldering terminals and an FPC pattern of
both end of signal contacts are in short-circuited.
(For example: Do not connect a board pattern of soldering
terminals and GND. If connect a board pattern of soldering
terminals and GND, also connect board pattern of both end of
■ Connector mounting
Excessive mounter chucking force may deform the molded or
metal part of the connector. Consult us in advance if chucking is
to be applied.
1) Manual soldering
• Due to the connector’s compact size, if an excessive amount of
solder is applied during manual soldering, the solder may creep
up and ﬂux wicking near the contact points, or solder interfer-
ence may cause impact contact.
• Make sure that the soldering iron tip is heated within the
temperature and time limits indicated in the speciﬁcations.
• Flux from the solder wire may adhere to the contact surfaces
during soldering operations. After soldering, carefully check the
contact surfaces and cleans off any ﬂux solder use.
• Be aware that a load applied to the connector terminals while
soldering may displace the contact.
• Thoroughly clean the iron tip.
2) Reﬂow soldering
• Screen-printing is recommended for printing paste solder.
• To achieve the appropriate soldering state, make sure that the
reﬂow temperature, PC board foot pattern, window size and
thickness of metal mask are recommended condition.
• Note that excess solder on the terminals prevents complete
insertion of the FPC, and causes ﬂux climbing up.
• A screen thickness of 120μm is recommended during cream
• Consult us when using a screen-printing thickness other than
• Depending on the size of the connector being used, self
alignment may not be possible. Accordingly, carefully position
the terminal with the PC board pattern.
• The recommended reﬂow temperature proﬁle is given in the
Upper limit (Soldering heat resistance)
Lower limit (Solder wettability)
60 to 120 sec.