YC-513HD.pdf 데이터시트 (총 7 페이지) - 파일 다운로드 YC-513HD 데이타시트 다운로드

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Part Number: YC-513HD
1.SPECIFICATIONS
Features:
Applications:
1.Low Power consumption
1.TV set
2.High efficiency
2.Monitor
3.Versatile mounting on P.C Board or panel
3.Telephone
4.Low current requirement
4.Computer
5.This product don't contained restriction substance, 5.Circuit board
compliance ROHS standard.
(1) Absolute Maximum Rating
Item Symbol
(Ta=25 )
Absolute Maximum Rating
Unit
Forward Current
IF
15 mA
Peak Forward Current
IFP
50
mA
Power Dissipation
PD
40 mW
Reverse Voltage
VR
5
V
Operating Temperature
TOP
-40 ~80
Storage Temperature
TSTG
-40 ~85
Lead Soldering Temperature TSOL
260 FOR 5 SECONDS
*1Condition for IFP is Pulse of 1/10 duty and 0.1msec width
(2) Initial Electrical/Optical Characteristics
(Ta=25 )
Item Symbol Condition Min Typ Max Unit
Forward Voltage
VF IF=20(mA) /
2.2 2.6
V
Reverse Current
IR VR=5(V)
/
/ 100 µA
Viewing Angle
2θ1/2 IF=20(mA) / 35 / deg
Spectral Line Half-width
IF=20(mA) / 90 / nm
Luminous Intensity
IV IF=20(mA) /
12.0
/
mcd
Peak Wavelength
λp IF=20(mA) / 700 /
nm
Remark:Viewing angle is the Off-axis angle at which the luminous intensity is half the
axial luminous intrnsity.

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Part Number: YC-513HD
2. Package Dimension:
FLAT DENOTES CATHODE
5.0(.197)
0.5(.02) SQ. TYP.
Part Number
YC-513HD
2.54(.10) NOM.
Chip
Material Emitting Color
GaP/GaP
Bright Red
Lens Color
Red Diffused
NOTES:
1.All dimensiong are millimeters(inches)
2.Tolerance is ±0.25mm(0.01") unless otherwise specified.
3.Lead spacing is measured where the leads emerge from the package.
4.specifications are subject to change without notice.

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Part Number: YC-513HD
3. Typical Electro-Optical Characteristic Curves:
Fig1.Spectrum Distribution
Fig2.Forward Current vs.Forward Voltage
1.0 50
40
30
0.5
20
0.0
600
650 700 750
Wavelength λP(nm)
800
Fig3.Relative Radiant Intensity
vs Ambient Temperature (If=20mA)
3.0
2.0
1.0
10
0
0 12345
Forward Voltage(Vf)-Volts
Fig4.Forward Current
vs Derating Curve
50
40
30
0.5
0.2
0
-30 -20 -10 0 10 20 30 40 50 60 70
Ambient Temperature Ta( )
Fig5.Relative Radiant Intensity
vs Forward Current
4.0
20
10
0
0 20 40 60 80 100
Ambient Temperature Ta( )
Fig6.Rodiation Diagram Ta=25
3.0
2.0
1.0
0
0 20 40 60 80
Farward current IF(mA)
100
Radiation Diagram

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Part Number: YC-513HD
4.Rreliability Performance
(1)Reliability test item and condition
NO Item
Test Conditions
1 Solder Heat
2 Temperature Cycle
3 Thermal Shock
4
High Temperature
Storage
5
Low Temperature
Storage
6 DC Operating Life
7
High Temperature
High Humidity
TEMP:260±5
H:+85 30min
δ5min
L:-55 30min
H:+100 5min
δ10sec
L:-10 5min
TEMP:100
TEMP:55
If=20mA
85 /85%RH
Test Hours/Cycle
Sample
Size
Ac/Re
5 SEC
76pcs 0/1
50CYCLE 76pcs 0/1
50CYCLE 76pcs 0/1
1000HRS
1000HRS
1000HRS
1000HRS
76pcs 0/1
76pcs 0/1
76pcs 0/1
76pcs 0/1
(2)CRITERIA FOR JUDGING THE DAMAGE
Test Conditions
Criteria for judgement
Min Max
Voltage(Forward) VF
Current(Reverse) IR
Luminous Intensity IV
IF=20mA
VR=5V
IF=20mA
-
-
L.S.L**)×0.7
U.S.L*)×1.1
U.S.L*)×2.0
-
*)U.S.L.: Upper Standard Level.
**)L.S.L.:Lower Standard Level.

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Part Number: YC-513HD
5. Application Notes
(1)Lead Forming
When forming a lead should be bent at a point at least 3mm from the base of the
epoxy bulb .Do not use the base of the leadframe as a fulcrum during lead forming.
Lead forming should be done before soldering.
Do not apply any bending stress to the base of the lead .The stress to the base may
damage the LED’s characteristics or it may bread the LED.
When mounting the LED’s onto a printed circuit board, the holes on the circuit
board should be exactly aligned with the leads of the LED.
If the LED’s are mounted with stress at the leads, it causes deterioration of
epoxyresin and this will degrade the LED.
(2)Soldering conditions
Solder the LED’s no closer than 3mm from the base of the epoxy bulb. Soldering
the LED beyond the tie-bar is recommended.
Maximum allowable soldering conditions are;
Solder dipping: at 260 degrees C, 5seconds max
Solder iron: at 300 degrees C, 3seconds max
Do not apply any stress to the lead particularly when heated.
When it is necessary to clamp the LED to prevent soldering failure it is important
to minimize the mechanical stress on the LED’s.
Cut the LED leadframe at room temperature. Cutting the leadframes at high
temperature may cause failure of the LED.
(3)Static Electricity and Surge
Static electricity and surge will damage the LED. It is recommend to use a wrist
band or anti-electrostatic glove when handling the LED’s.
All devices, equipment and machinery must be properly grounded.
(4)Heat Generation
Heat generation must be taken into design consideration when using the LED’s.
The coefficient of temperature increase per input electric power at room
temperature is about 0.5 degrees C/mW at the LED’s active layer. This
temperature gets higher when the LED’s are densely mounted.