Part Number: YC-513HD
5. Application Notes
When forming a lead should be bent at a point at least 3mm from the base of the
epoxy bulb .Do not use the base of the leadframe as a fulcrum during lead forming.
Lead forming should be done before soldering.
Do not apply any bending stress to the base of the lead .The stress to the base may
damage the LED’s characteristics or it may bread the LED.
When mounting the LED’s onto a printed circuit board, the holes on the circuit
board should be exactly aligned with the leads of the LED.
If the LED’s are mounted with stress at the leads, it causes deterioration of
epoxyresin and this will degrade the LED.
Solder the LED’s no closer than 3mm from the base of the epoxy bulb. Soldering
the LED beyond the tie-bar is recommended.
Maximum allowable soldering conditions are;
Solder dipping: at 260 degrees C, 5seconds max
Solder iron: at 300 degrees C, 3seconds max
Do not apply any stress to the lead particularly when heated.
When it is necessary to clamp the LED to prevent soldering failure it is important
to minimize the mechanical stress on the LED’s.
Cut the LED leadframe at room temperature. Cutting the leadframes at high
temperature may cause failure of the LED.
(3)Static Electricity and Surge
Static electricity and surge will damage the LED. It is recommend to use a wrist
band or anti-electrostatic glove when handling the LED’s.
All devices, equipment and machinery must be properly grounded.
Heat generation must be taken into design consideration when using the LED’s.
The coefficient of temperature increase per input electric power at room
temperature is about 0.5 degrees C/mW at the LED’s active layer. This
temperature gets higher when the LED’s are densely mounted.