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EM MICROELECTRONIC - MARIN SA
603002
Title:
Product Family:
Part Number:
Application Note 603002
Highly accurate, DTCXO Temperature Compensated
Real Time Clock / Calendar Module with I2C Interface
RV-3029
RV-3029
TABLE OF CONTENTS
1. OVERVIEW ........................................................................................................................................................ 4
1.1. GENERAL DESCRIPTION......................................................................................................................... 4
1.2. APPLICATIONS ......................................................................................................................................... 4
2. BLOCK DIAGRAM ............................................................................................................................................. 5
2.1. PINOUT ...................................................................................................................................................... 6
2.2. PIN DESCRIPTION .................................................................................................................................... 7
2.3. FUNCTIONAL DESCRIPTION................................................................................................................... 7
2.4. DEVICE PROTECTION DIAGRAM ........................................................................................................... 8
3. REGISTER ORGANIZATION ............................................................................................................................ 9
3.1. REGISTER OVERVIEW ............................................................................................................................. 9
3.2. CONTROL PAGE REGISTER FUNCTION.............................................................................................. 10
3.2.1. CONTROL_1 (address 00h…bits description).................................................................................. 10
3.2.2. CONTROL_INT (address 01h…bits description) .............................................................................. 10
3.2.3. CONTROL_INT FLAG (address 02h…bits description) ................................................................... 11
3.2.4. CONTROL_STATUS (address 03h…bits description) ..................................................................... 11
3.2.5. CONTROL_RESET (address 04h…bits description)........................................................................ 12
3.3. WATCH PAGE REGISTER FUNCTION .................................................................................................. 12
3.3.1. SECONDS, MINUTES, HOURS, DAYS, WEEKDAYS, MONTHS, YEARS REGISTER ................. 12
3.3.2. DATA FLOW OF TIME AND DATE FUNCTION............................................................................... 14
3.4. ALARM PAGE REGISTER FUNCTION .................................................................................................. 15
3.4.1. SECONDS, MINUTES, HOURS, DAYS, WEEKDAYS, MONTHS, YEARS ALARM REGISTER .... 15
3.5. TIMER PAGE REGISTER FUNCTION .................................................................................................... 17
3.6. TEMPERATURE PAGE REGISTER FUNCTION .................................................................................... 17
3.7. EEPROM DATA PAGE REGISTER FUNCTION..................................................................................... 17
3.8. EEPROM CONTROL PAGE REGISTER FUNCTION ............................................................................. 18
3.8.1. EEPROM CONTROL (address 30h…bits description) ..................................................................... 18
3.8.2. XTAL OFFSET (address 31h…bits description) ............................................................................... 18
3.8.3. XTAL TEMPERATUR COEFFICIENT (address 32h…bits description) ........................................... 18
3.8.4. XTAL TURNOVER TEMPERATUR COEFFICIENT T0 (address 33h…bits description)................. 19
3.9. RAM DATA PAGE REGISTER FUNCTION ............................................................................................ 19
4. DETAILED FUNCTIONAL DESCRIPTION ..................................................................................................... 20
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603002
4.1. POWER-UP, POWER MANAGEMENT AND BATTERY SWITCHOVER .............................................. 20
4.1.1. POWER UP SEQUENCE ................................................................................................................. 21
4.1.2. SUPPLY VOLTAGE OPERATING RANGE AND LOW VOLTAGE DETECTION ............................ 22
4.2. RESET ...................................................................................................................................................... 24
4.2.1. POWER-UP RESET, SYSTEM RESET AND SELF-RECOVERY RESET ...................................... 24
4.2.2. REGISTER RESET VALUES............................................................................................................ 25
4.3. EEPROM MEMORY ACCESS ................................................................................................................. 27
4.4. TIMER FUNCTION ................................................................................................................................... 28
4.4.1. TIMER INTERRUT ............................................................................................................................ 30
4.5. ALARM FUNCTION ................................................................................................................................. 31
4.5.1. ALARM INTERRUPT ........................................................................................................................ 32
4.6. INTERRUPT OUTPUT INT....................................................................................................................... 33
4.7. WATCH ENABLE FUNCTION ................................................................................................................. 34
4.8. SELF-RECOVERY SYSTEM ................................................................................................................... 34
4.9. CLOCK OUTPUT CLKOUT ..................................................................................................................... 35
5. COMPENSATION OF FREQUENCY DEVIATION AND FREQUENCY DRIFT vs TEMPERATURE ............ 36
5.1. TEMPERATURE CHARACTERISTICS TUNING FORK CRYSTAL....................................................... 36
5.2. COMPENSATION PRINCIPLE ................................................................................................................ 37
5.2.1. THERMOMETER AND TEMPERATURE VALUE ............................................................................ 38
5.2.2. SETTING THE FREQUENCY COMPENSATION PARAMETERS .................................................. 39
5.3. METHOD OF COMPENSATING THE FREQUENCY DEVIATION ......................................................... 40
5.3.1. CORRECT METHOD FOR TESTING THE TIME ACCURACY ....................................................... 41
5.3.2. TESTING THE TIME ACCURACY USING CLKOUT OUTPUT........................................................ 41
5.3.3. TESTING THE TIME ACCURACY USING INTERRUPT OUTPUT 1 Hz ......................................... 42
5.4. TIME ACCURACY OPT: A / OPT: B ....................................................................................................... 44
6. I2C INTERFACE ............................................................................................................................................... 46
6.1. I2C INTERFACE CHARACTERISTICS.................................................................................................... 46
6.2. I2C INTERFACE SYSTEM CONFIGURATION ........................................................................................ 46
6.3. BIT TRANSFER ....................................................................................................................................... 47
6.4. START AND STOP CONDITIONS .......................................................................................................... 47
6.5. ACKNOWLEDGE ..................................................................................................................................... 48
6.6. I2C INTERFACE PROTOCOL .................................................................................................................. 49
6.7. I2C DEVICE ADDRESSES ....................................................................................................................... 49
6.8. I2C INTERFACE READ AND WRITE DATA TRANSMISSION............................................................... 50
6.8.1. WRITE MODE DATA TRANSMISSION............................................................................................ 50
6.8.2. READ MODE DATA TRANSMISSION AT SPECIFIC ADDRESS.................................................... 51
6.8.3. READ MODE..................................................................................................................................... 52
7. ELECTRICAL CHRACTERISTICS .................................................................................................................. 53
7.1. ABSOLUTE MAXIMUM RATINGS .......................................................................................................... 53
7.2. FREQUENCY AND TIME CHARACTERISTICS ..................................................................................... 53
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7.3. STATIC CHARACTERISTICS ................................................................................................................. 54
7.4. I2C INTERFACE TIMING CHARACTERISTICS ...................................................................................... 55
8. APPLICATION INFORMATION....................................................................................................................... 57
8.1. RECOMMENDED REFLOW TEMPERATURE (LEADFREE SOLDERING) .......................................... 58
Maximum Reflow Conditions in accordance with IPC/JEDEC J-STD-020C “Pb-free” ................................. 58
9. PACKAGE........................................................................................................................................................ 59
9.1. DIMENSIONS AND SOLDERPADS LAYOUT ........................................................................................ 59
9.2. MARKING AND PIN #1 INDEX................................................................................................................ 60
10.PACKING INFORAMTION............................................................................................................................... 61
10.1. CARRIER TAPE ....................................................................................................................................... 61
10.2. PARTS PER REEL................................................................................................................................... 62
10.3. REEL 13 INCH FOR 12 mm TAPE.......................................................................................................... 63
10.4. REEL 7 INCH FOR 12 mm TAPE............................................................................................................ 64
11.HANDLING PRECAUTIONS FOR CRYSTALS OR MODULES WITH EMBEDDED CRYSTALS ................ 65
Copyright 2014, EM Microelectronic-Marin SA
603002.doc, Version 1.0, 5-Mai-14
3
www.emmicroelectronic.com
420010-D01, 2.0