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ADVANCE
INFORMATION
IBIS4-A-6600
CYII4SM6600AB
6.6 MP CMOS Image Sensor
Features
Table 1. Key Performance Parameters
Parameter
Active Pixels
Pixel Size
Optical format
Active Imager Size
Shutter Type
Maximum Data
Rate/Master Clock
Frame rate
ADC resolution
Sensitivity (@ 650 nm)
Dynamic Range
Full Well Charge
Temporal Noise
Dark current
High Dynamic Range
Modes
Supply Voltage
Power consumption
Typical Value
2210 (H) x 3002 (V)
3.5 µm x 3.5 µm
1 inch
7.74 mm x 10.51 mm
Electronic Rolling Shutter
40 MPS/40 MHz
5 fps (2210 x 3002)
89 fps (640 x 480)
ADC resolution
411 V.m2/W.s, 4.83 V/lux.s
59 dB
Full Well Charge
24 e-
3.37 mV/s
Double Slope, Non Destructive
Read out (NDR).
Analog: 2.5V-3.3V, Digital: 2.5V,
I/O: 2.5V
190 mWatt
Table 1. Key Performance Parameters (continued)
Parameter
Operating temperature
Color Filter Array
Packaging
Typical Value
–30 °C to +65 °C
Mono, RGB Bayer Pattern
68-pins LCC
Description
The IBIS4-6600 is a solid -state CMOS image sensor that
integrates the functionality of complete analog image
acquisition, digitizer and digital signal processing system on a
single chip. The image sensor compromises a 6.6 MPixel
resolution with 2210x3002 active pixels. The image size is fully
programmable to user-defined windows of interest. The pixels
are on a 3.5-µm pitch. The sensor is available in a
Monochrome version or Bayer (RGB) patterned color filter
array.
User-programmable row and column start/stop positions allow
windowing down to 2x1 pixel window for digital zoom. Sub
sampling reduces resolution while maintaining the constant
field of view. The analog video output of the pixel array is
processed by an on-chip analog signal pipeline. Double
Sampling (DS) eliminates the fixed pattern noise. The
programmable gain and offset amplifier maps the signal swing
to the ADC input range. A 10-bit ADC converts the analog data
to a 10-bit digital word stream. The sensor uses a 3-wire
Serial-Parallel (SPI) interface. It operates with a single 2.5V
power supply and requires only one master clock for operation
up to 40 MHz. It is housed in a 68-pin ceramic LCC package.
This data sheet allows the user to develop a camera system
based on the described timing and interfacing.
Applications
• Machine vision
• Biometry
• Document scanning
Cypress Semiconductor Corporation
Document Number: 001-02366 Rev. *D
• 198 Champion Court •
San Jose, CA 95134-1709 • 408-943-2600
Revised January 2, 2007
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ADVANCE
INFORMATION
IBIS4-A-6600
CYII4SM6600AB
TABLE OF CONTENTS
Features .............................................................................................................................1
Description ........................................................................................................................1
Applications ......................................................................................................................1
Specifications ....................................................................................................................5
General Specifications ...................................................................................................5
Electro-optical specifications .........................................................................................5
Features and General Specifications ............................................................................7
Electrical Specifications .................................................................................................8
Sensor Architecture and Operation ................................................................................9
Floor Plan ......................................................................................................................9
Pixel ...............................................................................................................................10
Pixel Rate ......................................................................................................................11
Region of Interest (ROI) Read Out ................................................................................11
Output Amplifier .............................................................................................................12
Analog to Digital Converter ............................................................................................13
Subsample Modes .........................................................................................................14
Electronic Shutter ..........................................................................................................18
High Dynamic Range Modes .........................................................................................18
Sequencer and Registers ..............................................................................................20
Timing diagrams ...............................................................................................................26
Sequencer Control Signals ............................................................................................26
Basic Frame and Line Timing ........................................................................................26
Pixel Output Timing .......................................................................................................27
Pin List ...............................................................................................................................29
Packaging ..........................................................................................................................32
Bare Die .........................................................................................................................32
Package Drawing ..........................................................................................................33
Glass Lid Specifications ................................................................................................37
Storage and Handling .......................................................................................................37
Storage Conditions ........................................................................................................37
Handling and Soldering Conditions ...............................................................................37
RoHS (lead free) Compliance ........................................................................................38
Ordering Information ........................................................................................................39
Disclaimer ..........................................................................................................................39
Document History Page ...................................................................................................40
Document Number: 001-02366 Rev. *D
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ADVANCE
INFORMATION
IBIS4-A-6600
CYII4SM6600AB
LIST OF FIGURES
Spectral Response Curve ...................................................................................................6
Electro-voltaic Response Curve ..........................................................................................7
Floor Plan ............................................................................................................................9
3T Pixel Architecture ...........................................................................................................10
RGB Bayer Alignment .........................................................................................................10
Typical Response Curve of the RGB Filters .......................................................................10
Floor Plan Pixel Array .........................................................................................................11
Output Amplifier Architecture ..............................................................................................12
Offset for the Two Channels through DAC_RAW and DAC_FINE .....................................13
ADC resistor ladder .............................................................................................................14
X-subsampling ....................................................................................................................15
Y-subsampling ....................................................................................................................16
Pixel Readout in Various Subsample Modes ......................................................................17
Electronic Rolling Shutter Operation ...................................................................................18
Double Slope Response .....................................................................................................19
Principle of Non-destructive Readout .................................................................................19
Syncing of the Y-shift Registers. .........................................................................................23
SPI Interface .......................................................................................................................25
Relative Timing of the 3 Control Signals .............................................................................26
Basic Frame and Line Timing .............................................................................................27
Pixel Output Timing using Two Analog Outputs .................................................................27
Pixel Output Timing Multiplexing to One Analog Output .....................................................28
ADC Timing using Two Analog Outputs .............................................................................28
ADC Timing using One Analog Output ...............................................................................28
Bare Die Dimensions ..........................................................................................................32
Package Top View (all dimensions in inch) ........................................................................33
Package Side View (all dimensions in inch) .......................................................................34
Package Back View (all dimensions in inch) .......................................................................35
Bonding Scheme of the IBIS4-A-6600 in the LCC Package ...............................................36
Transmittance Curve of the D263 Cover Glass Lid ............................................................37
Reflow Soldering Temperature Profile ................................................................................38
Document Number: 001-02366 Rev. *D
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ADVANCE
INFORMATION
IBIS4-A-6600
CYII4SM6600AB
LIST OF TABLES
Key Performance Parameters .............................................................................................1
General Specifications. .......................................................................................................5
Electro-optical Specifications ..............................................................................................5
Features and General Specifications ..................................................................................7
Absolute Maximum Ratings ................................................................................................8
Recommended Operating Conditions .................................................................................8
DC Electrical Conditions .....................................................................................................8
Frame Rate vs. Resolution .................................................................................................11
PGA Gain Settings ..............................................................................................................12
ADC specifications ..............................................................................................................13
ADC resistor values ............................................................................................................14
Subsample Patterns ............................................................................................................14
Frame Rate vs. Subsample Mode ......................................................................................16
Pros and Cons of NDR .......................................................................................................19
List of Internal Registers .....................................................................................................20
Overview of NDR Modes. ...................................................................................................22
Granularity of X-Sequencer Clock and Corresponding Row Blanking Time (for NDR = 0). 23
Delay added by Changing the Settings of the DELAY Register .........................................24
Delay added by Changing the Settings of the DELAY_CLK_AMP Bits ..............................24
Pin List ................................................................................................................................29
Package Side View Dimensions. ........................................................................................34
Storage conditions. .............................................................................................................37
The Chemical Substances and Information about Any Intentional Content ........................38
Ordering Information. ...........................................................................................................39
Document Number: 001-02366 Rev. *D
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ADVANCE
INFORMATION
IBIS4-A-6600
CYII4SM6600AB
Specifications
General Specifications
Table 2. General Specifications.
Parameter
Pixel architecture
Pixel size
Resolution
Pixel rate
Shutter type
Full frame rate
Specification
3T-pixel
3.5 m x 3.5 m
2210 x3002
40 MHz
Electronic rolling shutter
5 frames/second
Electro-optical specifications
Overview
Table 3. Electro-optical Specifications
Parameter
FPN (local)
PRNU (local)
Conversion gain
Output signal amplitude
Saturation charge
Sensitivity (peak)
Sensitivity (visible)
Peak QE * FF
Peak Spectral Resp.
Specification
<0.20%
<1.5%
Conversion gain
0.6V
21.500 e-
411V.m2/W.s
4.83 V/lux.s
328 V.m2/W.s
2.01 V/lux.s
25%
0.13 A/W
Fill factor
Dark current
Dark Signal Non Uniformity
Temporal noise
S/N Ratio
Spectral sensitivity range
Optical cross talk
Power dissipation
35%
3.37 mV/s
78 e-/s
8.28 mV/s
191 e-/s
24 RMS e-
895:1 (59 dB)
400 - 1000 nm
15%
4%
190 mWatt
Remarks
The resolution and pixel size results in a 7.74 mm x 10.51 mm
optical active area.
Using a 40- MHz system clock and 1 or 2 parallel outputs.
Increases with ROI read out and/or sub sampling.
Remarks
RMS% of saturation signal.
RMS of signal level.
@ output (measured).
At nominal conditions.
@ 650 nm
(85 lux = 1 W/m2).
400-700 nm
(163 lux = 1 W/m2).
Average QE*FF = 22% (visible range).
Average SR*FF = 0.1 A/W (visible range).
See spectral response curve.
Light sensitive part of pixel (measured).
Typical value of average dark current of the whole pixel array
(@ 21 °C).
Dark current RMS value (@ 21 °C).
Measured at digital output (in the dark).
Measured at digital output (in the dark).
To the first neighboring pixel.
To the second neighboring pixel.
Typical (including ADCs).
Document Number: 001-02366 Rev. *D
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