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FFAF10U170S
Features
• High voltage and high reliability
• High speed switching
• Low forward voltage
Applications
• Suitable for damper diode in horizontal
deflection circuits
12
TO-3PF
1. Cathode 2. Anode
DAMPER DIODE
Absolute Maximum Ratings TC=25°C unless otherwise noted
Symbol
Parameter
VRRM
IF(AV)
IFSM
Peak Repetitive Reverse Voltage
Average Rectified Forward Current
@ TC = 125°C
Non-repetitive Peak Surge Current
60Hz Single Half-Sine Wave
TJ, TSTG
Operating Junction and Storage Temperature
Value
1700
10
100
- 65 to +150
Thermal Characteristics
Symbol
RθJC
Parameter
Maximum Thermal Resistance, Junction to Case
Value
1.5
Electrical Characteristics TC=25 °C unless otherwise noted
Symbol
Parameter
VFM *
IRM *
Maximum Instantaneous Forward Voltage
IF = 10A
IF = 10A
Maximum Instantaneous Reverse Current
@ rated VR
trr Maximum Reverse Recovery Time
(IF =1A, di/dt = 50A/µs)
tfr Maximum Forward Recovery Time
(IF =6.5A, di/dt = 50A/µs)
VFRM
Maximum Forward Recovery Voltage
* Pulse Test: Pulse Width=300µs, Duty Cycle=2%
TC = 25 °C
TC = 125 °C
TC = 25 °C
TC = 125 °C
Min.
-
-
-
-
-
-
-
Typ.
-
-
-
-
-
-
-
Max.
2.2
2.0
0.1
10
140
400
13
Units
V
A
A
°C
Units
°C/W
Units
V
mA
ns
ns
V
©2001 Fairchild Semiconductor Corporation
Rev. A, June 2001

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Typical Characteristics
100
TJ = 125oC
10
1
T = 25oC
J
0.1
012345
Forward Voltage , VF [V]
Figure 1. Typical Forward Voltage Drop
vs. Forward Current
200
Typical Capacitance
at 0V = 174 pF
160
120
80
40
0
0.1 1 10 100
Reverse Voltage , V [V]
R
Figure 3. Typical Junction Capacitance
1500
1200
900
di/dt = 100A/µs
600
di/dt = 50A/µs
300
0
1 2 3 4 5 6 7 8 9 10
Forward Current , IF [A]
Figure 5. Typical Stored Charge
vs. Forward Current
©2001 Fairchild Semiconductor Corporation
10000
1000
100
TJ = 125oC
10 TJ = 100oC
1
0.1
0.001
0
TJ = 25oC
300 600 900 1200
Reverse Voltage , VR [V]
1500 1700
Figure 2. Typical Reverse Current
vs. Reverse Voltage
300
di/dt = 50A/µs
200
100 di/dt = 100A/µs
0
1 2 3 4 5 6 7 8 9 10
Forward Current , I [A]
F
Figure 4. Typical Reverse Recovery Time
vs. Forward Current
12
10
8
6
4
2
0
80 100 120 140 160
Case Temperature , TC [oC]
Figure 6. Forward Current Derating Curve
Rev. A, June 2001

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Package Dimensions
TO-3PF-2L
©2001 Fairchild Semiconductor Corporation
Dimensions in Millimeters
Rev. A, June 2001

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TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not
intended to be an exhaustive list of all such trademarks.
ACEx™
FAST®
OPTOPLANAR™
STAR* POWER™
Bottomless™
FASTr™
PACMAN™
Stealth™
CoolFET™
FRFET™
POP™
SuperSOT™-3
CROSSVOLT
DenseTrench™
GlobalOptoisolator™
GTO™
Power247™
PowerTrench®
SuperSOT™-6
SuperSOT™-8
DOME™
HiSeC™
QFET™
SyncFET™
EcoSPARK™
E2CMOS™
ISOPLANAR™
LittleFET™
QS™
QT Optoelectronics™
TruTranslation™
TinyLogic™
EnSigna™
FACT™
MicroFET™
MICROWIRE™
Quiet Series™
SLIENT SWITCHER®
UHC™
UltraFET®
FACT Quiet Series™
OPTOLOGIC™
SMART START™
VCX™
STAR*POWER is used under license
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR
CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems 2. A critical component is any component of a life support
which, (a) are intended for surgical implant into the body, device or system whose failure to perform can be
or (b) support or sustain life, or (c) whose failure to perform reasonably expected to cause the failure of the life support
when properly used in accordance with instructions for use device or system, or to affect its safety or effectiveness.
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Advance Information
Preliminary
No Identification Needed
Product Status
Formative or In
Design
First Production
Full Production
Definition
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
©2001 Fairchild Semiconductor Corporation
Rev. H3