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MBRS540T3G,
NRVBS540T3G
Surface Mount
Schottky Power Rectifier
The MBRS540T3 employs the Schottky Barrier principle in a large
area metaltosilicon power diode. Stateoftheart geometry
features epitaxial construction with oxide passivation and metal
overlay contact. Ideally suited for low voltage, high frequency
rectification, or as free wheeling and polarity protection diodes in
surface mount applications where compact size and weight are critical
to the system.
Features
Small Compact Surface Mountable Package with JBend Leads
Rectangular Package for Automated Handling
Highly Stable Oxide Passivated Junction
Excellent Ability to Withstand Reverse Avalanche Energy Transients
GuardRing for Stress Protection
NRVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AECQ101
Qualified and PPAP Capable
These are PBFree Packages*
Mechanical Characteristics
Case: Epoxy, Molded, Epoxy Meets UL 94 V0 @ 0.125 in
Weight: 217 mg (Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Polarity: Notch in Plastic Body Indicates Cathode Lead
ESD Rating:
Machine Model, C (> 400 V)
Human Body Model, 3B (> 8000 V)
Device Meets MSL 1 Requirements
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SCHOTTKY BARRIER
RECTIFIER
5.0 AMPERES, 40 VOLTS
SMC
CASE 403
MARKING DIAGRAM
AYWW
B540G
G
B540
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= PbFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping
MBRS540T3G
SMC
(PbFree)
2,500 /
Tape & Reel
NRVBS540T3G
SMC
(PbFree)
2,500 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2013
July, 2013 Rev. 8
1
Publication Order Number:
MBRS540T3/D

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MBRS540T3G, NRVBS540T3G
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
(At Rated VR, TC = 105°C)
Peak Repetitive Forward Current
(At Rated VR, Square Wave, 20 KHz, TC = 80°C)
NonRepetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
VRRM
VRWM
VR
IF(AV)
IFRM
IFSM
40
5
10
190
V
A
A
A
Storage Temperature Range
Tstg 65 to +150
°C
Operating Junction Temperature (Note 1)
Voltage Rate of Change (Rated VR)
TJ
dv/dt
65 to +150
10,000
°C
V/ms
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The heat generated must be less than the thermal conductivity from JunctiontoAmbient: dPD/dTJ < 1/RqJA.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance,
JunctiontoLead (Note 2)
Thermal Resistance,
JunctiontoAmbient (Note 2)
2. Rating applies when surface mounted on the minimum pad size recommended.
Symbol
RqJL
RqJA
Value
12
111
Unit
°C/W
ELECTRICAL CHARACTERISTICS
Characteristic
Maximum Instantaneous Forward Voltage (Note 3)
(iF = 5.0 A, TC= 25°C)
Maximum Instantaneous Reverse Current (Note 3)
(Rated dc Voltage, TC = 25°C)
(Rated dc Voltage, TC = 100°C)
3. Pulse Test: Pulse Width 300 ms, Duty Cycle 2.0%.
Symbol
VF
iR
Value
0.50
0.3
15
Unit
V
mA
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MBRS540T3G, NRVBS540T3G
TYPICAL CHARACTERISTICS
10 10
TJ = 125°C
1
TJ = 40°C
0.1
0.10
TJ = 100°C TJ = 25°C TJ = 55°C
0.20 0.30 0.40
0.50
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
0.60
Figure 1. Typical Forward Voltage
TJ = 125°C
1
TJ = 100°C
TJ = 25°C
TJ = 40°C
0.1
0.10
TJ = 55°C
0.20 0.30 0.40 0.50 0.60
VF, MAXIMUM INSTANTANEOUS FORWARD
VOLTAGE (V)
Figure 2. Maximum Forward Voltage
0.70
100E3
10E3
1E3
100E6
10E6
1E6
100E9
10E9
1E9
100E12
0
TJ = 125°C
TJ = 100°C
TJ = 25°C
TJ = 55°C
10 20 30
VR, REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Current
100E3
10E3
1E3
100E6
10E6
TJ = 125°C
TJ = 100°C
TJ = 25°C
TJ = 55°C
40 1E60
10 20 30
VR, REVERSE VOLTAGE (V)
Figure 4. Maximum Reverse Current
40
9
8 dc
freq = 20 kHz
7
6 SQUARE WAVE
5 Ipk/IO = p
4
3 Ipk/IO = 5
2
1
0
25 50 75 100 125 150
TL, LEAD TEMPERATURE (°C)
Figure 5. Current Derating
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
0
SQUARE
WAVE
dc
Ipk/IO = p
Ipk/IO = 5
Ipk/IO = 10
Ipk/IO = 20
1 2 3 456 7 8
IO, AVERAGE FORWARD CURRENT (A)
9
Figure 6. Forward Power Dissipation
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MBRS540T3G, NRVBS540T3G
TYPICAL CHARACTERISTICS
1000
TJ = 25 °C
100 0
5 10 15 20 25 30 35 40
VR, REVERSE VOLTAGE (V)
Figure 7. Capacitance
1000
125
RqJA = 12 °C/W
115
105 RqJA = 47 °C/W
95 RqJA = 81 °C/W
85
RqJA = 111 °C/W
75
65 RqJA = 136 °C/W
55 0 5 10 15 20 25 30 35 40 45
VR, DC REVERSE VOLTAGE (V)
Figure 8. Typical Operating Temperature
Derating
100 D = 0.5
0.2
10
0.1
0.05
0.02
1 0.01
0.1
0.00001
SINGLE PULSE
0.0001
0.001
0.01
P(pk)
t1
t2
DUTY CYCLE, D = t1/t2
Test Type > min pad 1 oz
RqJC = min pad 1 oz C/W
0.1 1
10 100 1000
t, TIME (s)
Figure 9. Thermal Response MBRS540T3G, NRVBS540T3G on min pad
100
D = 0.5
0.2
10
0.1
0.05 P(pk)
1 0.02
0.01
SINGLE PULSE
0.1
0.00001
0.0001
0.001
0.01
0.1
t1
t2
DUTY CYCLE, D = t1/t2
1 10
Test Type > min pad 1 oz
RqJC = min pad 1 oz C/W
100 1000
t, TIME (s)
Figure 10. Thermal Response MBRS540T3G, NRVBS540T3G on 1” pad
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HE
E
L
MBRS540T3G, NRVBS540T3G
PACKAGE DIMENSIONS
SMC
CASE 40303
ISSUE E
bD
L1 c
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
4. 403-01 THRU -02 OBSOLETE, NEW STANDARD 403-03.
MILLIMETERS
DIM MIN
NOM MAX
A 1.90
2.13
2.41
A1 0.05
0.10
0.15
b 2.92
3.00
3.07
c 0.15 0.23 0.30
D 5.59
5.84
6.10
E 6.60
6.86
7.11
H E 7.75
7.94
8.13
L 0.76
1.02
1.27
L1 0.51 REF
MIN
0.075
0.002
0.115
0.006
0.220
0.260
0.305
0.030
INCHES
NOM
0.084
0.004
0.118
0.009
0.230
0.270
0.313
0.040
0.020 REF
MAX
0.095
0.006
0.121
0.012
0.240
0.280
0.320
0.050
A
A1
SOLDERING FOOTPRINT*
4.343
0.171
3.810
0.150
2.794
0.110
ǒ ǓSCALE 4:1
mm
inches
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. SCILLC
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For additional information, please contact your local
Sales Representative
MBRS540T3/D