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Product Specification
AU OPTRONICS CORPORATION
( ) Preliminary Specifications
(V ) Final Specifications
Module
Model Name
Note ( )
10.1” SD+ 16:9 Color TFT-LCD
B101EW02 V1
LED Backlight with driving circuit design
Customer
Date
Approved by
Date
Checked &
Approved by
Date
CH Lin
Prepared by
Jeff Hou
03/16/2010
03/16/2010
Note: This Specification is subject to change without
notice.
NBBU Marketing Division /
AU Optronics corporation
B101EW02 V1 document version : 0.1
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Studio Technology Co. Ltd. ( www.yslcd.com.tw )

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Product Specification
AU OPTRONICS CORPORATION
Contents
1. Handling Precautions........................................................................................................ 4
2. General Description .......................................................................................................... 5
2.1 General Specification...................................................................................................................................... 5
2.2 Optical Characteristics ................................................................................................................................... 6
3. Functional Block Diagram ............................................................................................... 11
4. Absolute Maximum Ratings............................................................................................. 12
4.1 Absolute Ratings of TFT LCD Module......................................................................................................... 12
4.2 Absolute Ratings of Environment................................................................................................................ 12
5. Electrical characteristics ................................................................................................. 13
5.1 TFT LCD Module............................................................................................................................................ 13
5.2 Backlight Unit ................................................................................................................................................ 15
6. Signal Characteristic ....................................................................................................... 16
6.1 Pixel Format Image........................................................................................................................................ 16
6.2 The input data format.................................................................................................................................... 17
6.3 Signal Description/Pin Assignment ............................................................................................................. 18
6.4 Interface Timing............................................................................................................................................. 20
6.5 Power Sequence............................................................................................................................................ 21
6.5.1 Panel Power Sequence .............................................................................................................................. 21
7. Panel Reliability Test ...................................................................................................... 22
7.1 Vibration Test ................................................................................................................................................. 22
7.2 Shock Test...................................................................................................................................................... 22
7.3 Reliability Test ............................................................................................................................................... 22
8. Mechanical Characteristics.............................................................................................. 23
8.1 LCM Outline Dimension................................................................................................................................ 23
9. Shipping and Package..................................................................................................... 25
9.1 Shipping Label Format.................................................................................................................................. 25
9.2 Carton package.............................................................................................................................................. 26
9.3 Shipping package of palletizing sequence ................................................................................................. 26
10. Appendix: EDID description .......................................................................................... 27
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Product Specification
AU OPTRONICS CORPORATION
Record of Revision
Version and Date Page
Old description
0.1 2009/11/24 All
First Edition for Customer
New Description
Remark
B101EW02 V1 document version : 0.1
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Studio Technology Co. Ltd. ( www.yslcd.com.tw )