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NS6A12AT3G
600 Watt Peak Power Zener
Transient Voltage
Suppressor
Unidirectional
The NS6A12AT3G is designed to protect voltage sensitive
components from high voltage, high energy transients. This device has
excellent clamping capability, high surge capability, low zener
impedance and fast response time. The NS6A12AT3G is ideally suited
for use in computer hard disk drives, communication systems,
automotive, numerical controls, process controls, medical equipment,
business machines, power supplies, and many other industrial/
consumer applications.
Specification Features:
Peak Reverse Working Voltage of 12 V
Peak Pulse Power of 600 W (10 x 1000 msec)
ESD Rating of Class 3 (>16 kV) per Human Body Model
ESD Rating of Class 4 (>8 kV) IEC 6100042
Fast Response Time
Low Profile Package
This is a PbFree Device
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
FINISH: All external surfaces are corrosion resistant and leads are
readily Solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
LEADS: Modified LBend providing more contact area to bond pads
POLARITY: Cathode indicated by polarity band
MOUNTING POSITION: Any
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PLASTIC SURFACE MOUNT
ZENER OVERVOLTAGE
TRANSIENT SUPPRESSOR
Cathode
Anode
SMA
CASE 403D
PLASTIC
MARKING DIAGRAM
6LF
AYWWG
6LF = Specific Device Code
A = Assembly Location
Y = Year
WW = Work Week
G = PbFree Package
ORDERING INFORMATION
Device
NS6A12AT3G
Package
SMA
(PbFree)
Shipping
5000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
August, 2014 Rev. 0
1
Publication Order Number:
NS6A12A/D

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NS6A12AT3G
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Power Dissipation (Note 1) @ TL = 25°C, Pulse Width = 1 ms
DC Power Dissipation @ TL = 75°C
Measured Zero Lead Length (Note 2)
Derate Above 75°C
Thermal Resistance from Junction to Lead
PPK
PD
RqJL
600 W
1.5 W
20 mW/°C
50 °C/W
DC Power Dissipation (Note 3) @ TA = 25°C
Derate Above 25°C
Thermal Resistance from Junction to Ambient
PD
RqJA
0.5 W
4.0 mW/°C
250 °C/W
Operating and Storage Temperature Range
TJ, Tstg
65 to +150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. 10 X 1000 ms, nonrepetitive.
2. 1square copper pad, FR4 board
3. FR4 board, using ON Semiconductor minimum recommended footprint, as shown in 403D case outline dimensions spec.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless
otherwise noted)
Symbol
Parameter
IPP Maximum Reverse Peak Pulse Current
VC Clamping Voltage @ IPP
VRWM Working Peak Reverse Voltage
IR Maximum Reverse Leakage Current @ VRWM
VBR Breakdown Voltage @ IT
IT Test Current
IF Forward Current
VF Forward Voltage @ IF
4. 1/2 sine wave (or equivalent square wave), PW = 8.3 ms,
nonrepetitive duty cycle.
I
IF
VC VBR VRWM
IIRT VF
V
IPP
UniDirectional TVS
ELECTRICAL CHARACTERISTICS
Device
Device
Marking
VRWM
(Note 5)
V
IR @ VRWM
mA
Breakdown Voltage
VBR (Note 6) Volts
Min Nom Max
@ IT
mA
VC @ IPP (Note 7)
VC IPP
VA
NS6A12AT3G
6LF 12
0.5
13.3 14.0 14.7
1.0
31
19.5
5. A transient suppressor is normally selected according to the working peak reverse voltage (VRWM), which should be equal to or greater than
the DC or continuous peak operating voltage level.
6. VBR measured at pulse test current IT at an ambient temperature of 25°C.
7. Surge current waveform per Figure 1.
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NS6A12AT3G
tr 10 ms
PULSE WIDTH (tP) IS DEFINED AS
THAT POINT WHERE THE PEAK
CURRENT DECAYS TO 50% OF IPP.
100
PEAK VALUE - IPP
50
HALF VALUE -
IPP
2
tP
0
01 2 34
t, TIME (ms)
Figure 1. 10 × 1000 ms Pulse Waveform
160
140
120
100
80
60
40
20
0
0 25 50 75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Figure 2. Pulse Derating Curve
Zin
Vin
LOAD
VL
Figure 3. Typical Protection Circuit
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HE
E
bD
POLARITY INDICATOR
OPTIONAL AS NEEDED
(SEE STYLES)
NS6A12AT3G
PACKAGE DIMENSIONS
SMA
CASE 403D02
ISSUE G
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L.
MILLIMETERS
DIM MIN
NOM MAX
A 1.97
2.10
2.20
A1 0.05
0.10
0.20
b 1.27
1.45
1.63
c 0.15 0.28 0.41
D 2.29
2.60
2.92
E 4.06
4.32
4.57
H E 4.83
5.21
5.59
L 0.76
1.14
1.52
MIN
0.078
0.002
0.050
0.006
0.090
0.160
0.190
0.030
INCHES
NOM
0.083
0.004
0.057
0.011
0.103
0.170
0.205
0.045
MAX
0.087
0.008
0.064
0.016
0.115
0.180
0.220
0.060
A
L c A1
SOLDERING FOOTPRINT*
4.000
0.157
2.000
0.079
2.000
0.079
ǒ ǓSCALE 8:1
mm
inches
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/PatentMarking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone: 3036752175 or 8003443860 Toll Free USA/Canada
Fax: 3036752176 or 8003443867 Toll Free USA/Canada
Email: orderlit@onsemi.com
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USA/Canada
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Phone: 421 33 790 2910
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Phone: 81358171050
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For additional information, please contact your local
Sales Representative
NS6A12A/D