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ISOFACE™
ISO1H811G
Galvanic Isolated 8 Channel High-Side Switch
Datasheet
Revision 2.5, 2014-10-17
Power Management & Multimarket

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Edition 2014-10-17
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2014 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
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question, please contact the nearest Infineon Technologies Office.
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ISOFACE™
ISO1H811G
Revision History
Page or Item Subjects (major changes since previous revision)
Revision 2.5, 2014-10-17
Page 4
Feature list updated, Vbb Monitoring included
Page 7
Page 7 Chapter 2 Block diagram updated
Page 9
Page 9 Chapter 3.3.3 Description for repetitive short circuit corrected
Page 9
Page 9 Chapter 3.4 Vbb Monitoring included in common diagnostic output description
Page 14
Page 15
Page 14 Chapter 4.4 VISO changed to correct value ΔVISO = 500V
Page 15 Chapter 4.5 Footnotes corrected
Page 16
Page 17
Page 16 Chapter 4.8 Timing parameter for CS delay split into tCSD and tCSDMD
Page 17 Chapter 4.10 Parameter Minimum Internal Gap removed
all Correction of formats and typos
Revision 2.4
Page 12
Page 12 table 4.1 Extended operating temperature footnote removed
Revision 2.0
all Final Datasheet
Trademarks of Infineon Technologies AG
AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, EconoPACK™, CoolMOS™, CoolSET™,
CORECONTROL™, CROSSAVE™, DAVE™, DI-POL™, EasyPIM™, EconoBRIDGE™, EconoDUAL™,
EconoPIM™, EconoPACK™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™,
ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OptiMOS™, ORIGA™,
POWERCODE™; PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™,
ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, TEMPFET™,
thinQ!™, TRENCHSTOP™, TriCore™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,
PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR
development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™,
FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.
FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of
Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data
Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of
MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics
Corporation. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA
MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of
OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF
Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™
of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co.
TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™
of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas
Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes
Zetex Limited.
Last Trademarks Update 2011-11-11
Datasheet
3 Revision 2.5, 2014-10-17

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ISOFACE™
ISO1H811G
Coreless Transformer Isolated Digital
Output 8 Channel 0.625 A High-Side
Switch
Product Highlights
• Coreless transformer isolated data interface
• Galvanic isolation
• 8 High-side output switches 0.625A
• µC compatible 8-bit parallel peripheral
Features
Typical Application
• Interface 3.3/5V CMOS operation compatible
• Parallel interface
• Direct control mode
• High common mode transient immunity
• Short circuit protection
• Maximum current internally limited
• Overload protection
• Overvoltage protection (including load dump)
• Undervoltage shutdown with autorestart and
hysteresis
• Switching inductive loads
• Common output disable pin
• Thermal shutdown with restart
• Thermal independence of separate channels
• Common diagnostic output
• ESD protection
• Loss of GNDbb and loss of Vbb protection
• Reverse Output Voltage protection
• Isolated return path for DIAG signal
• Vbb monitoring
• UL508 / RoHS compliant
• Isolated switch for industrial applications (PLC)
• All types of resistive, inductive and capacitive loads
• µC compatible power switch for 24V DC
applications
• Driver for solenoid, relays and resistive loads
Description
The ISO1H811G is a galvanically isolated 8 bit data
interface in PG-DSO-36 package that provides 8 fully
protected high-side power switches that are able to
handle currents up to 625 mA.
An 8 bit parallel µC compatible interface allows to
connect the IC directly to a µC system. The input
interface supports also a direct control mode and is
designed to operate with 3.3/5V CMOS compatible
levels.
The data transfer from input to output side is realized by
the integrated Coreless Transformer Technology.
VCC
VCCP1.x
AD0
WR
P0.0
P0.1
P0.2
P0.3
P0.4
P0.5
P0.6
P0.7
µC (i.e
C166)
Typical Application
VCC
DIS
Control
CS Unit
WR
D0
D1
D2
D3 Parallel
D4 Interface
D5
D6
D7
DIAG
CT
DIAG Control
&
Protectio
n Unit
Vbb
OUT0
OUT1
Vbb
OUT7
GND
ISO1H811G GNDCC
GNDbb
Type
ISO1H811G
Datasheet
On-state Resistance
200mΩ
4
Package
PG-DSO36
Revision 2.5, 2014-10-17

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ISOFACE™
ISO1H811G
Pin Configuration and Functionality
1 Pin Configuration and Functionality
1.1 Pin Configuration
Pin Symbol
1 N.C.
2 VCC
3 DIS
4 CS
5 WR
6 D0
7 D1
8 D2
9 D3
10 D4
11 D5
12 D6
13 D7
14 DIAG
15 GNDCC
16 N.C.
17 N.C.
18 N.C.
19 GNDbb
20 N.C
21 OUT7
22 OUT7
23 OUT6
24 OUT6
25 OUT5
26 OUT5
27 OUT4
28 OUT4
29 OUT3
30 OUT3
31 OUT2
32 OUT2
33 OUT1
34 OUT1
35 OUT0
36 OUT0
TAB Vbb
Function
Not connected
Positive 3.3/5V logic supply
Output disable
Chip select
Parallel write
Data input bit0
Data input bit1
Data input bit2
Data input bit3
Data input bit4
Data input bit5
Data input bit6
Data input bit7
Common diagnostic output
Input logic ground
Not connected
Not connected
Not connected
Output driver ground
Not connected
High-side output of channel 7
High-side output of channel 7
High-side output of channel 6
High-side output of channel 6
High-side output of channel 5
High-side output of channel 5
High-side output of channel 4
High-side output of channel 4
High-side output of channel 3
High-side output of channel 3
High-side output of channel 2
High-side output of channel 2
High-side output of channel 1
High-side output of channel 1
High-side output of channel 0
High-side output of channel 0
Positive driver power supply voltage
N.C.
VCC
DIS
CS
WR
D0
D1
D2
D3
D4
D5
D6
D7
DIAG
GNDCC
N.C.
N.C.
N.C.
Figure 1
.
Vbb
1
2
TAB
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
TAB
Vbb
Power SO-36 (430mil)
36 OUT0
35 OUT0
34 OUT1
33 OUT1
32 OUT2
31 OUT2
30 OUT3
29 OUT3
28 OUT4
27 OUT4
26 OUT5
25 OUT5
24 OUT6
23 OUT6
22 OUT7
21 OUT7
20 N.C.
19 GNDbb
Datasheet
5 Revision 2.5, 2014-10-17