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19-5742; Rev 1; 7/11
EVAALVUAAILTAIOBNLEKIT
Dual-Output, 3-/2-/1-Phase + 2-/1-Phase
Quick-PWM Controllers for VR12/IMVP7
General Description
The MAX17411/MAX17511/MAX17511C/MAX17511N/
MAX17511T are dual-output, step-down, constant on-time
Quick-PWMK controllers for VR12/IMVP-7 CPU core sup-
plies. The controllers consist of two high-current switching
power supplies for CPU and GFX cores. The CPU regulator
(regulator A) is a three-phase constant on-time architecture.
The GFX regulator (regulator B) is also constant on-time
architecture. The MAX17411 supports 2-phase operation
and the MAX17511/MAX17511C/MAX17511N/MAX17511T
support 1-phase operation. The MAX17411/MAX17511/
MAX17511C/MAX17511N/MAX17511T include two internal
drivers on regulator A and one internal driver on regula-
tor B. External drivers such as the MAX17491 enable the
additional phases.
Both regulator A and regulator B include output voltage
sensing and accurate load-line gain. Switching frequen-
cies are programmable from 200kHz to 600kHz per
phase. Output overvoltage protection (OVP, MAX17411/
MAX17511/MAX17511C/MAX17511N), undervoltage pro-
tection (UVP), and thermal protection ensure effective and
reliable operation. When any of these protection features
detect a fault, the controller shuts down both outputs.
The multiphase regulators include transient-phase over-
lap and active overshoot suppression, which speed up
the response time and reduce the total output capaci-
tance. The CPU and GFX outputs are controlled inde-
pendently by writing the appropriate data into a function-
mapped register file. VID code transitions and soft-start
are enabled with a precision slew-rate control circuit. The
SVID interface also allows each regulator to be individu-
ally set into a low-power, single-phase, pulse-skipping
state to optimize efficiency. The MAX17411 is available in
a 48-pin, 6mm x 6mm, TQFN package. The MAX17511/
MAX17511C/MAX17511N/MAX17511T are available in a
40-pin, 5mm O 5mm, TQFN lead-free package.
Applications
VR12/IMVP-7 CPU Core Power Supplies
Notebooks / Desktops/Servers
Features
S Intel VR12/IMVP-7-Compliant Serial Interface
S 3-/2-/1-Phase Quick-PWM CPU Core Regulator
Two Internal Drivers and One External Driver
Transient-Phase Overlap Mode
Dynamic Phase Selection
S 2-/1-Phase Quick-PWM GFX Regulator
One Internal and One External Driver
S Active Overshoot Suppression
S 8-Bit VR12/IMVP-7 DAC
S ±0.5% VOUT Accuracy Over Line, Load, and
Temperature
S Active Voltage Positioning with Programmable
Gain
S Accurate Lossless Current Balance
S Accurate Droop and Current Limit
S Remote Output and Ground Sense
S Power-Good Window Comparators (POKA and
POKB)
S 4.5V to 24V Battery-Input Voltage Range
S Programmable 200kHz to 600kHz Switching
Frequency
S External Thermal-Fault Detection Output
(VR_HOT#)
S Overvoltage (MAX17411/MAX17511/MAX17511C/
MAX17511N), Undervoltage, and Thermal-Fault
Protection
S Slew-Rate Controlled Soft-Start
S Passive Soft-Shutdown (20I Discharge Switches)
S Integrated Boost Switches
S Low-Profile, 48-Lead/40-Lead TQFN Packages
Quick PWM is a trademark of Maxim Integrated Products, Inc.
Ordering Information
PART
MAX17411GTM+
MAX17511GTL+
TEMP RANGE
-40NC to +105NC
-40NC to +105NC
PIN-PACKAGE
48 TQFN-EP*
40 TQFN-EP*
Ordering Information continued on last page.
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
FEATURE
3-/2-/1-Phase + 2-/1-Phase
3-/2-/1-Phase + 1-Phase
________________________________________________________________ Maxim Integrated Products   1
For information on other Maxim products, visit Maxim’s website at www.maxim-ic.com.

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Dual-Output, 3-/2-/1-Phase + 2-/1-Phase
Quick-PWM Controllers for VR12/IMVP7
ABSOLUTE MAXIMUM RATINGS
VCC, VDDA, VDDB to GND (AGND).........................-0.3V to +6V
VDIO, CLK, ALERT# to GND (AGND).....................-0.3V to +6V
CSPAAVE, CSPBAVE, CSP_,
CSN_ to GND (AGND).........................................-0.3V to +6V
FBA, FBB to GND (AGND)....................... -0.3V to (VCC + 0.3V)
SR, IMAX_ to GND (AGND) ..................... -0.3V to (VCC + 0.3V)
POKA, POKB, EN to GND (AGND).........................-0.3V to +6V
VR_HOT# to GND (AGND)......................................-0.3V to +6V
THERMA, THERMB to GND (AGND)........ -0.3V to (VCC + 0.3V)
GNDSA, GNDSB to GND (AGND)........................-0.3V to +0.3V
TON to GND...........................................................-0.3V to +26V
DRVPWMA to GND (AGND)................... -0.3V to (VDDA + 0.3V)
DRVPWMB to GND (AGND)................... -0.3V to (VDDB + 0.3V)
DLA_ to GND (PGND)............................ -0.3V to (VDDA + 0.3V)
DLB to GND (PGND).............................. -0.3V to (VDDB + 0.3V)
BSTA_ to VDDA......................................................-0.3V to +26V
BSTB to VDDB........................................................-0.3V to +26V
LXA_ to BSTA_.........................................................-6V to +0.3V
LXB to BSTB............................................................-6V to +0.3V
LX_ to GND (AGND).................................................-6V to +26V
DHA_ to LXA_.......................................-0.3V to (VBSTA_ + 0.3V)
DHB to LXB............................................ -0.3V to (VBSTB + 0.3V)
Continuous Power Dissipation (TA = +70NC)
40-Pin TQFN (derate 35.7mW/NC above +70NC)....2857.1mW
48-Pin TQFN (derate 37mW/NC above +70NC)..........2963mW
Operating Temperature Range......................... -40NC to +105NC
Junction Temperature......................................................+150NC
Storage Temperature Range............................ -65NC to +165NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
PACKAGE THERMAL CHARACTERISTICS (Note 1)
40 TQFN
Junction-to-Ambient Thermal Resistance (qJA)...........28°C/W
Junction-to-Case Thermal Resistance (qJC)...............1.6°C/W
48 TQFN
Junction-to-Ambient Thermal Resistance (qJA)...........27°C/W
Junction-to-Case Thermal Resistance (qJC)...............1.3°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(Circuits of Figures 1 and 2. VIN = 10V, VCC = VDDA = VDDB = 5V, EN = VCC, VGNDS_ = 0V, VFB_ = VCSP_AVE = VCSP_ = VCSN_
= 1V; [SerialVID = 1.00, FPWM MODE]; TA = 0°C to +85°C, unless otherwise noted. Typical values are at TA = +25NC. All devices
100% tested at TA = +25NC. Limits over temperature guaranteed by design.)
PARAMETER
PWM CONTROLLER
Input Voltage Range
DC Output Voltage
Accuracy
SYMBOL
CONDITIONS
VCC, VDDA, VDDB
Measured at FB_ with
respect to GNDS_;
includes load regulation
error (Note 2)
DAC codes from
1.000V to 1.520V
DAC codes from
0.800V to 0.995V
DAC codes from
0.250V to 0.795V
MIN TYP MAX UNITS
4.5 5.5 V
-0.5
+0.5
%
-5 +5
mV
-8 +8
Line Regulation Error
VSETTLED Bit Accuracy
GNDS_ Input Range
GNDS_ Gain
GNDS_ Input Bias Current
TON Shutdown Current
Boot Voltage
VCC = 4.5V to 5.5V, VIN = 4.5V to 24V
Upward transitions
Downward transitions
AGNDS
VBOOT
DVOUT/DVGNDS_
TA = +25NC
EN = GND, VIN = 24V, VCC = 0V, TA = +25NC
MAX17511N only, Reg A and Reg B
MAX17511C only, Reg B only
-15
5
-200
0.97
-0.5
1.094
0.895
0.1
-10
10
1.00
0.01
1.100
0.900
-5
15
+200
1.03
+0.5
0.1
1.106
0.905
mV
mV
mV
V/V
FA
FA
V
2   _______________________________________________________________________________________

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Dual-Output, 3-/2-/1-Phase + 2-/1-Phase
Quick-PWM Controllers for VR12/IMVP7
ELECTRICAL CHARACTERISTICS (continued)
(Circuits of Figures 1 and 2. VIN = 10V, VCC = VDDA = VDDB = 5V, EN = VCC, VGNDS_ = 0V, VFB_ = VCSP_AVE = VCSP_ = VCSN_
= 1V; [SerialVID = 1.00, FPWM MODE]; TA = 0°C to +85°C, unless otherwise noted. Typical values are at TA = +25NC. All devices
100% tested at TA = +25NC. Limits over temperature guaranteed by design.)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
Measured at DHA_ (600kHz - 10%),
RTON = 96.7kI (MAX17411 only),
RTON = 48.35kI (MAX17511/MAX17511C/
MAX17511N/MAX17511T)
157 185 213
DHA_ On-Time (Note 3)
Measured at DHA_, VIN = 12V (300kHz - 10%),
tONA
RTON = 200kI (MAX17411 only), RTON = 100kI
(MAX17511/MAX17511C/MAX17511N/
276
307
338
MAX17511T)
ns
Measured at DHA_ (200kHz - 10%),
RTON = 303.3kI (MAX17411 only),
RTON = 151.65kI (MAX17511/MAX17511C/
MAX17511N/MAX17511T)
470 554 638
Measured at DHB (600kHz + 10%),
RTON = 96.7kI (MAX17411 only),
RTON = 48.35kI (MAX17511/MAX17511C/
MAX17511N/MAX17511T)
128 151 174
DHB On-Time (Note 3)
Measured at DHB, VIN = 12V (300kHz + 10%),
tONB
RTON = 200kI (MAX17411 only), RTON = 100kI
(MAX17511/MAX17511C/MAX17511N/
226
251
277
MAX17511T)
ns
Measured at DHB (200kHz + 10%),
RTON = 303.3kI (MAX17411 only), RTON =
151.65kI (MAX17511/MAX17511C/
MAX17511N/MAX17511T)
385 453 521
Minimum Off-Time (Note 3) tOFF(MIN) Measured at DH_
150 200 250
ns
Minimum DRVPWM_ Pulse
Width
40 ns
BIAS CURRENTS
Quiescent Supply Current
(VCC)
Quiescent Supply Current
(VDD_)
Shutdown Supply Current
(VCC)
IBIAS
IDRV
Measured at VCC, SKIP mode, FB_ forced above
the regulation point
TA = +25NC, measured at VDD_, FPWM mode,
FB_ forced above the regulation point
Measured at VCC, EN = GND
5
0.02
16
10
1
30
mA
FA
FA
Shutdown Supply Current
(VDD_)
TA = +25NC, measured at VDD, EN = GND
0.01
1
FA
SLEW-RATE CONTROL
Slew-Rate Accuracy
VSR = 0V or VSR = 5V
VSR = 3V or
VSR = 1.5V
SetVID - fast slew rate =
10mV/Fs (min)
SetVID - slow slew rate
= 2.5mV/Fs (min)
SetVID - fast slew rate =
20mV/Fs (min)
SetVID - slow slew rate
= 5mV/Fs (min)
10
2.5
20
5
mV/Fs
_______________________________________________________________________________________   3

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Dual-Output, 3-/2-/1-Phase + 2-/1-Phase
Quick-PWM Controllers for VR12/IMVP7
ELECTRICAL CHARACTERISTICS (continued)
(Circuit of Figure 1. VIN = 10V, VCC = VDDA = VDDB = 5V, EN = VCC, VGNDS_ = 0V, VFB_ = VCSP_AVE = VCSP_ = VCSN_ = 1V;
[SerialVID = 1.00, FPWM MODE]; TA = 0°C to +85°C, unless otherwise noted. Typical values are at TA = +25NC. All devices 100%
tested at TA = +25NC. Limits over temperature guaranteed by design.)
PARAMETER
Soft-Start Slew Rate
Discharge Switch
Resistance
SYMBOL
CONDITIONS
Non-zero VBOOT
CSNA, CSNB
MIN TYP MAX UNITS
2.5 mV/Fs
20 I
Low
Mid-low
0.4
1.2 1.8
SR Four-Level Logic
Thresholds
Mid-high
2.2
VCC
- 1.2V
V
High
VCC
- 0.4V
FAULT PROTECTION
Upper POK_ (MAX17411/
MAX17511/MAX17511C/
MAX17511N/MAX17511T)
and Output Overvoltage
Protection Trip
Threshold(MAX17411/
MAX17511/MAX17511C/
MAX17511N)
VOVP
SKIP mode after output reaches the regulation
voltage or PWM mode; measured at FB_ with
respect to the voltage target set by the VID code
(see Table 3)
Soft-start, SKIP mode, and output has not reached
the regulation voltage; measured at FB_
Minimum OVP threshold, measured at FB_
200
1.72
250
1.77
0.8
300
1.82
mV
V
Upper POK_ and Output
Overvoltage Propagation
Delay
tOVP
FB_ forced 25mV above trip threshold
(MAX17411/MAX17511/MAX17511C/MAX17511N)
5
Fs
Lower POK_ and Output
Undervoltage Protection
Trip Threshold
VUVP
Measured at FB_ with respect to unloaded output
voltage
-300
-250
-200
mV
Lower POK_ Propagation
Delay
Output Undervoltage
Propagation Delay
POK_ Output Low Voltage
POK_ Leakage Current
POK_ Startup Delay and
Transitions Blanking Time
VCC Undervoltage-Lockout
Threshold
FB_ forced 25mV below trip threshold
tUVP
tPOK_
VUVLO
FB_ forced 25mV below trip threshold
ISINK = 4mA
High state, POK_ forced to 5V, TA = +25NC
Measured from the time when FB_ reaches the
target voltage
Rising edge, 50mV typical hysteresis, controller
disabled below this level
5
100 200 350
0.3
1
20
4.05 4.25 4.45
Fs
Fs
V
FA
Fs
V
4   _______________________________________________________________________________________

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Dual-Output, 3-/2-/1-Phase + 2-/1-Phase
Quick-PWM Controllers for VR12/IMVP7
ELECTRICAL CHARACTERISTICS (continued)
(Circuits of Figures 1 and 2. VIN = 10V, VCC = VDDA = VDDB = 5V, EN = VCC, VGNDS_ = 0V, VFB_ = VCSP_AVE = VCSP_ = VCSN_
= 1V; [SerialVID = 1.00, FPWM MODE]; TA = 0°C to +85°C, unless otherwise noted. Typical values are at TA = +25NC. All devices
100% tested at TA = +25NC. Limits over temperature guaranteed by design.)
PARAMETER
THERMAL PROTECTION
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
VR_HOT# Trip Threshold
Measured at THERM_ with respect to VCC falling
edge; specify as % error for all TEMP MAX DAC
code settings, typical hysteresis = 100mV
49.5
50.5
%
Thermal Zone Registers Trip
Points
Thermal zone comparator trip points, measured
with respect to VCC; voltage threshold
corresponding to TMAX O (1 - N%),
N = 0, 3, 6, 9, 12, 15, 18, 25
THERM_ Input Leakage
ITHRM VTHERM_ = 2.5V, TA = +25NC
VR_HOT# Leakage Current
High-Z state (THERM_ > 0.505 x VCC), VR_HOT#
forced to 5V, TA = +25NC
Internal Thermal Fault
Shutdown Threshold
TTSHDN Typical hysteresis = 15NC
VALLEY CURRENT LIMIT AND DROOP
Valley Current-Limit
Threshold Voltage (Positive)
VILIMA
VCSP_ - VCSN_,
VSR = 0V,
VSR = 1.5V,
or one-phase
operation
RSENSE = 0.65mI, IMAXA = 39A
RSENSE = 0.65mI, IMAXA = 36A
RSENSE = 0.65mI, IMAXA = 30A
RSENSE = 0.65mI, IMAXA = 26A
RSENSE = 0.75mI, IMAXA = 39A
RSENSE = 0.75mI, IMAXA = 36A
RSENSE = 0.75mI, IMAXA = 30A
RSENSE = 0.75mI, IMAXA = 26A
RSENSE = 0.85mI, IMAXA = 39A
RSENSE = 0.85mI, IMAXA = 36A
RSENSE = 0.85mI, IMAXA = 30A
RSENSE = 0.85mI, IMAXA = 26A
RSENSE = 0.95mI, IMAXA = 39A
RSENSE = 0.95mI, IMAXA = 36A
RSENSE = 0.95mI, IMAXA = 30A
RSENSE = 0.95mI, IMAXA = 26A
49 +
24 O
N/31
-100
22.5
21.5
17.0
15.0
27.0
25.0
20.0
17.0
30.0
28.0
22.5
20.0
33.5
31.0
25.0
21.5
50 +
24 O
N/31
160
25.5
24.5
20.0
18.0
30.0
28.0
23.0
20.0
33.0
31.0
25.5
23.0
36.5
34.0
28.0
24.5
51 +
24 O
N/31
+100
1
28.5
27.5
23.0
21.0
33.0
31.0
26.0
23.0
36.0
34.0
28.5
26.0
39.5
37.0
31.0
27.5
%
nA
FA
NC
mV
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