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Features
Provides ESD Protection per IEC 61000-4-2 Standard:
Air ±20kV, Contact ±15kV
1 Channel of ESD Protection
High Peak Pulse Current per IEC 61000-4-5 Standard
Typically Used in Cellular Handsets, Portable Electronics,
Communication Systems, Computers and Peripherals
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
D18V0L1B2LP
18V BIDIRECTIONAL TVS DIODE
Mechanical Data
Case: X1-DFN1006-2
Low Profile Package (0.53mm max) and Ultra-small PCB
Footprint Area (1.08 x 0.68mm max) Suitable for Compact
Portable Electronics
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: NiPdAu over Copper leadframe. Solderable per MIL-
STD-202, Method 208 e4
Weight: 0.001 grams (approximate)
X1-DFN1006-2
Pin 1
Pin 2
Bottom View
Device Schematic
Ordering Information (Note 4)
Product
D18V0L1B2LP-7B
Compliance
AEC-Q101
Marking
SE
Reel Size (inches)
7
Tape Width (mm)
8
Quantity per Reel
10,000/Tape & Reel
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
SE
SE = Product Type Marking Code
Line Denotes Pin 1
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Peak Pulse Power Dissipation
Peak Pulse Current
ESD Protection – Contact Discharge
ESD Protection – Air Discharge
Symbol
PPP
IPP
VESD_Contact
VESD_Air
Value
68
2.0
±15
±20
D18V0L1B2LP
Document number: DS36461 Rev. 1 - 2
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Unit Conditions
W 8/20μs, Per Figure 3
A 8/20μs, Per Figure 3
kV IEC 61000-4-2 Standard
kV IEC 61000-4-2 Standard
March 2014
© Diodes Incorporated

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D18V0L1B2LP
Thermal Characteristics
Characteristic
Package Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Operating and Storage Temperature Range
Symbol
PD
RθJA
TJ, TSTG
Value
250
500
-65 to +150
Unit
mW
°C/W
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Reverse Standoff Voltage
Channel Leakage Current (Note 6)
Clamping Voltage, Positive Transients
Breakdown Voltage
Differential Resistance
Channel Input Capacitance
Symbol
Min
Typ
Max Unit
Test Conditions
VRWM
— 18
V
IRM
100 nA VRWM = 18V
VCL
27 30
30 34
V IPP = 1A, tp = 8/20μS
V IPP = 2A, tp = 8/20μS
VBR 21
— 25
V IR = 1mA
RDIF
2.2
IR = 1A, tp = 8/20μS
CT — 7.0 12 pF VR = 0V, f = 1MHz
Notes:
5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website at
http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
250
225
200
175
150
125
100
75
50
25
0
0
Note 5
25 50 75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Figure 1 Power Derating Curve
175
100
75
50
25
0
0 25 50 75 100 125 150 175 200
TA, AMBIENT TEMPERATURE (°C)
Figure 2 Pulse Derating Curve
D18V0L1B2LP
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100
50
Peak Value Ipp
Half Value Ipp/2
0
0
10
8
8x20 Waveform
as defined by R.E.A.
20 40
t, TIME (μs)
Figure 3 Pulse Waveform
60
f = 1MHz
D18V0L1B2LP
10
TA = 125°C
TA = 85°C
TA = 150°C
TA = 25°C
TA = -55°C
1
0 5 10 15 20
VR, REVERSE VOLTAGE (V)
Figure 4 Typical Reverse Characteristics
20ns/div
40V/div
6
4
2
0
0 5 10 15 20
VR, REVERSE VOLTAGE (V)
Figure 5 Typical Total Capacitance vs. Reverse Voltage
20ns/div
40V/div
Figure 7 ESD Response to IEC 6100-4-2
(-8kV Contact Discharge)
Figure 6 ESD Response to IEC 6100-4-2
(+8kV Contact Discharge)
20
18
16
14
12
10
8
6
4
2
0 0 5 10 15 20 25 30 35
TLP VOLTAGE (V)
Figure 8 Transmission Line Pulsing (TLP) Current vs. Voltage
D18V0L1B2LP
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Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
D18V0L1B2LP
A
A1
E
D
R
b
X1-DFN1006-2
Dim Min Max Typ
A 0.47 0.53 0.50
A1 0 0.05 0.03
b 0.45 0.55 0.50
D 0.95 1.075 1.00
E 0.55 0.675 0.60
e - - 0.40
L 0.20 0.30 0.25
R 0.05 0.15 0.10
All Dimensions in mm
Le
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
X1
X
Y
G
C
Dimensions
C
G
X
X1
Y
Value (in mm)
0.70
0.30
0.40
1.10
0.70
D18V0L1B2LP
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D18V0L1B2LP
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
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