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ULTRA LOW CAPACITANCE ESD PROTECTION COMPONENT
P0402V Series
DESCRIPTION
The P0402V Series is an ultra low capacitance ESD component designed to protect very high-speed data interfaces. These devices have a typical capactiance of only
0.05pF (I/O to GND) and is compatible with the ESD immunity requirements of IEC61000-4-2.
FEATURES
Compatible with IEC 61000-4-2 (ESD): Air 15kV (Typical), 25kV(Max)
Compatible with IEC 61000-4-2 (ESD): Contact 8kV (Typical),
15kV(Max)
Low Leakage Current: 0.10µA
• Fast Response Time
Protects One Bidirectional Line
Ultra Low Capacitance: 0.15 pF (Typical)
RoHS Compliant
REACH Compliant
APPLICATIONS
HDMI
• DVI
• Display Port
Unified Display Interface (UDI)
Mobile Display Digital Interface (MDDI)
Gigabit Ethernet
USB2.0 & USB3.0
IEEE 1394 Interface
MECHANICAL CHARACTERISTICS
Molded Ceramic 0402 Package
Approximate Weight: 0.44 milligrams
Lead-Free Plating
Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
8mm Tape and Reel Per EIA Standard 481
Flammability Rating UL 94V-0
05392.R3 10/15
PIN CONFIGURATION
1
2
Page 1
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TYPICAL DEVICE CHARACTERISTICS
P0402V Series
Operating Temperature
Storage Temperature
Solder Temperature - 10s
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
PARAMETER
SYMBOL
TA
TSTG
TL
VALUE
-40 to 90
-55 to 125
260
UNITS
°C
°C
°C
PART
NUMBER
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
RATED
STAND-OFF
VOLTAGE
TYPICAL
TRIGGER
VOLTAGE
(Note 1)
TYPICAL
CLAMPING
VOLTAGE
(Note 1)
MAXIMUM
LEAKAGE
CURRENT
(Note 2)
VVOWLMTS
VOVLTTS
VOVLCTS
@µVIDAWM
P0402V05
5.0
350 35.0 0.10
P0402V15
15.0
350
35.0
0.10
NOTES
1. Trigger and Clamping Voltage are measured per IEC 61000-4-2, 8kV contact discharge method.
2. After reliability tests such as high temperature storage, temp cycle, continuous ESD strikes, the maximum leakage current is less than 10µA.
TYPICAL
CAPACITANCE
@0V, 1MHz
pCFJ
0.15
0.05
ESD Tester
RZ
CZ
IEC 61000-4-2 Network
RCZZ
=
=
150pF
330 Ohms
FIGURE 1
ESD CLAMPING TEST
450 Ohms
RG 223/U
50 Ohm Coax
DUT (Device Under Test)
10x
Attenuator
4GHz Digital
Oscilloscope
50 Ohm
05392.R3 10/15
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TYPICAL DEVICE CHARACTERISTICS
IPP
100%
90%
FIGURE 2
TYPICAL ESD WAVEFORM
P0402V Series
10%
tr = 0.7ns to 1ns
30ns
60ns
t
FIGURE 3
ESD WAVE AFTER CLAMPING
05392.R3 10/15
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TYPICAL DEVICE CHARACTERISTICS
FIGURE 4
CAPACITANCE VS FREQUENCY
P0402V Series
05392.R3 10/15
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SOLDER REFLOW INFORMATION
P0402V Series
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask Defined Pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.150mm
Solder Stencil Aperture Opening (Laser cut, 5% tapered walls)
0.330mm Round
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance - Edge To Corner Ball
±50µm
Solder Ball Side Coplanarity
±20µm
Maximum Dwell Time Above Liquidous (183°C)
60 seconds
Soldering Maximum Temperature
270°C
REQUIREMENTS
Temperature:
Preheat timTTePP
for Lead-Free (Sn/Ag/Cu): 260-270°C
for Tin-Lead: 240-245°C
and temperature depends on solder paste
and
flux
activa-
tion temperature, component size, weight, surface area and plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
Maximum Solder Reflow
(35-53°C Above Maximum Solder Melt Temp)
TP Solder Melt
Ramp-Up
(Maximum Temp)
Ramp-Down
05392.R3 10/15
Preheat
(Stay Below Flux Activation Temp)
30-60 seconds
Ramp-Up
15 seconds
(Minimize)
Page 5
Solder-Time Ramp-Down
15-20 seconds
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