Maker : Kemet Electronics
Part No. : C0805Cxxxx

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Product Information

CERAMIC CHIP CAPACITORS FEATURES • C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and +80%-20% • Tape and reel packaging per EIA481-1. (See page 92 for specific tape and reel information.) Bulk Cassette packaging (0402, 0603, 0805 only) per IEC60286-6 and EIAJ 7201. • RoHS Compliant CAPACITOR OUTLINE DRAWINGS W T S ELECTRODES L B TIN PLATE NICKEL PLATE CONDUCTIVE METALLIZATION DIMENSIONS—MILLIMETERS AND (INCHES) EIA SIZE CODE 0402* www.DataSheet4U.com METRIC SIZE CODE (Ref only) 1005 1608 2012 3216 3225 4532 4564 5650 5664 L# LENGTH 1.0 (.04) ± .05(.002) 1.6 (.063) ± 0.15 (.006) 2.0 (.079) ± 0.2 (.008) 3.2 (.126) ± 0.2 (.008) 3.2 (.126) ± 0.2 (.008) 4.5 (.177) ± 0.3 (.012) 4.5 (.177) ± 0.3 (.012) 5.6 (.220) ± 0.4 (.016) 5.6 (.220) ± 0.4 (.016) W# WIDTH 0.5 (.02) ± .05 (.002) 0.8 (.032) ± 0.15 (.006) 1.25 (.049) ± 0.2 (.008) 1.6 (.063) ± 0.2 (.008) 2.5 (.098) ± 0.2 (.008) 3.2 (.126) ± 0.3 (.012) 6.4 (.252) ± 0.4 (.016) 5.0 (.197) ± 0.4 (.016) 6.3 (.248) ± 0.4 (.016) B BANDWIDTH 0.20 (0.008)-0.40 (0.016) S MIN. SEPARATION 0.3 (.012) 0.7 (.028) 0.75 (.030) N/A N/A N/A N/A N/A N/A MOUNTING TECHNIQUE Solder Reflow 0603* 0805* 1206* 1210* 1812 1825* 2220 2225 See page 77 for thickness dimensions.7 0.35 (.014) ±0.15 (.006) 0.5 (.02) ±.25 (.010) 0.5 (.02) ±.25 (.010) 0.5 (.02) ±.25 (.010) 0.6 (.024) ±.35 (.014) 0.6 (.024) ±.35 (.014) 0.6 (.024) ±.35 (.014) 0.6 (.024) ±.35 (.014) Solder Wave † or Solder Reflow Solder Reflow CAPACITOR ORDERING INFORMATION (Standard Chips - For C 0805 C 103 K 5 R A C* CERAMIC SIZE CODE SPECIFICATION C - Standard CAPACITANCE CODE Expressed in Picofarads (pF) First two digits represent significant figures. Third digit specifies number of zeros. (Use 9 for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF) (Example: 2.2pF = 229 or 0.50 pF = 508) CAPACITANCE TOLERANCE B – ±0.10pF J – ±5% C – ±0.25pF K – ±10% D – ±0.5pF M – ±20% F – ±1% P – (GMV) – special order only G – ±2% Z – +80%, -20% Military see page 90) END METALLIZATION C-Standard (Tin-plated nickel barrier) FAILURE RATE LEVEL A- Not Applicable TEMPERATURE CHARACTERISTIC Designated by Capacitance Change Over Temperature Range G – C0G (NP0) (±30 PPM/°C) R – X7R (±15%) (-55°C + 125°C) P– X5R (±15%) (-55°C + 85°C) U – Z5U (+22%, -56%) (+10°C + 85°C) V – Y5V (+22%, -82%) (-30°C + 85°C) VOLTAGE 1 - 100V 3 - 25V 2 - 200V 4 - 16V 5 - 50V 8 - 10V * Part Number Example: C0805C103K5RAC (14 digits - no spaces) 7 - 4V 9 - 6.3V ©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300 71 Ceramic Surface Mount * Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk cassette, see page 96.) † For extended value 1210 case size – solder reflow only. CERAMIC CHIP/STANDARD C0G CAPACITANCE RANGE – 0402, 0603, 0805, 1206 Cap pF 0.50 0.75 1.0 1.1 1.2 1.5 1.6 1.8 2.0 2.2 2.4 2.7 3.0 3.3 3.9 4.3 4.7 5.1 5.6 6.0 6.2 6.8 7.0 7.5 8.2 9.1 10.0 11.0 12.0 13.0 15.0 16.0 18.0 20.0 22.0 24.0 27.0 30.0 33.0 36.0 39.0 43.0 47.0 51.0 56.0 62.0 68.0 75.0 82.0 91.0 100.0 110.0 120.0 130.0 150.0 160.0 180.0 200.0 220.0 240.0 270.0 300.0 330.0 360.0 390.0 430.0 470.0 510.0 560.0 620.0 680.0 750.0 820.0 910.0 1000.0 1100.0 1200.0 1300.0 1500.0 1600.0 1800.0 2000.0 2200.0 2400.0 2700.0 3000.0 3300.0 3600.0 3900.0 4300.0 4700.0 5100.0 5600.0 6200.0 6800.0 7500.0 8200.0 9100.0 10,000.0 Cap Code 508 758 109 119 129 159 169 189 209 229 249 279 309 339 399 439 479 519 569 609 629 689 709 759 829 919 100 110 120 130 150 160 180 200 220 240 270 300 330 360 390 430 470 510 560 620 680 750 820 910 101 111 121 131 151 161 181 201 221 241 271 301 331 361 391 431 471 511 561 621 681 751 821 911 102 112 122 132 ...

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