Maker : Agilent(Hewlett-Packard)
Part No. : HSDL-1000

Datasheet PDF : HSDL-1000.pdf
Cross Reference : HSDL-1000 Cross Reference
Buy Component : HSDL-1000 Find Stock and Price

Shortcut : HSDL-1000  HSDL-1000  HSDL-1001 

Product Information

H Infrared IrDA® Compliant Transceiver Technical Data HSDL-1000 Features • Low Cost Infrared Data Link • Guaranteed to Meet IrDA Physical Layer Specifications 1 cm to 1 Meter Operating Distance 30° Viewing Angle 2.4 KBd to 115.2 KBd Data Rate • Daylight Cancellation • Easily Implemented Direct Connection to Various I/O Chips • Small Form Factor • Several Lead and Shipping Configurations Available • Excellent EMI Immunity (> 10 V/m) Desktop PCs PDAs Printers Other Peripheral Devices • Telecom: Modem, Fax, Pager, Phone • Industrial: Data Collection Devices • Medical: Patient and Pharmaceutical Data Collection operate from 0 to 1 meter at a data rate of 115.2 Kbd per second at a 30° viewing angle. The HSDL-1000 contains a high speed, high efficiency TS AlGaAs 875 nm LED, a PIN Silicon photodiode and an integrated circuit. The IC contains an LED driver, amplifiers and a quantizer. The module is designed to interface directly with selected I/O chips that incorporate logic which performs pulse width modulation/ demodulation. V+ RLED Description: The HSDL-1000 serial infrared module performs low cost, low power, point-to-point, through the air data transfer in a serial, halfduplex mode. The module has been designed to the IrDA (Infrared Data Association) Physical Layer Specifications. The module is designed to Applications • Data Comm: Serial Data Transfer Between: Notebook Computers Subnotebooks Schematic BUTTRESS LEAD* TXD RI TXD LED C LED LED A VPIN PIN ONE RXD PHOTODIODE COMPARATOR RXD CX1 HP 1000 YYWW V+ VCC CX2 + PIN ONE INDICATOR PIN ONE CX4 CX3 CX2 VPIN GND GND * SIDE BUTTRESS LEADS ARE FOR MECHANICAL STABILITY AND SHOULD NOT BE CONNECTED TO ANY ELECTRICAL POTENTIAL. 5964-9641E 4-33 Package Dimensions Option X01* 0.43 MAX. (0.017) 3.4 ± 0.25 (0.14 ± 0.01) 12.95 (0.51) 13.45 (0.53) 6.4 ± 0.25 (0.25 ± 0.01) 3.4 ± 0.25 (0.14 ± 0.01) 8.54 ± 0.15 MAX. (0.336 ± 0.01) -B1 2 3 4 5 6 7 8 0.9 ± 0.25 (0.04 ± 0.01) 6.9 ± 0.25 (0.27 ± 0.01) 0.51 ± 0.08 (8x) (0.020 ± 0.003) -C- 1.27 ± 0.15 (7x) (0.050 ± 0.01) 1.9 ± 0.25 (0.08 ± 0.01) 16.61 ± 0.15 (0.654 ± 0.01) 6.2 ± 0.25 (0.24 ± 0.01) -A- 5.93 ± 0.25 (0.23 ± 0.01) 5.0° (10x) 0.6 ± 0.25 (10x) (0.02 ± 0.01) 0.13 ± 0.08 (0.005 ± 0.003) DIMENSIONS IN MILLIMETERS (INCHES). Option X02* 13.2 ± 0.25 (0.52 ± 0.01) 0.43 MAX. (0.017) 3.4 ± 0.25 (0.14 ± 0.01) 3.4 ± 0.25 (0.14 ± 0.01) 8.05 ± 0.15 MAX. (0.317 ± 0.01) 6.9 ± 0.25 (0.27 ± 0.01) 1 2 3 4 5 6 7 8 6.4 ± 0.25 (0.25 ± 0.01) 1.27 ± 0.15 (7x) (0.050 ± 0.01) 15.39 ± 0.15 (0.606 ± 0.01) -B-C- 0.51 ± 0.08 (8x) (0.020 ± 0.003) 4.56 ± 0.15 (0.180 ± 0.01) 1.28 ± 0.15 (0.050 ± 0.01) 3.36 ± 0.15 (0.132 ± 0.01) 0.50 ± 0.13 (0.020 ± 0.005) 6.2 ± 0.25 (0.24 ± 0.01) 15.13 ± 0.15 (0.596 ± 0.01) 3.12 ± 0.15 (0.123 ± 0.01) 3.28 ± 0.15 (0.129 ± 0.01) -A- 5.93 ± 0.25 (0.23 ± 0.01) 5.0° (8x) 0.60 ± 0.25 (0.02 ± 0.01) 3.80 ± 0.15 (0.150 ± 0.01) 8.88 ± 0.15 (0.349 ± 0.01) COPLANARITY ± 0.05 mm (0.002 INCHES). DIMENSIONS IN MILLIMETERS (INCHES). Note: The -B- datum is formed by the two highest points of the combined surface formed by this surface and the corresponding surface of the same lead on the opposite side of the package. *X position indicates packaging. 0 = tape and reel, 1 = JEDEC standard tray. 4-34 Package Dimensions (continued) Option X03* 0.43 (0.02) MAX. 3.4 ± 0.25 (0.14 ± 0.01) 3.43 ± 0.15 (0.135 ± 0.01) -B- 14.73 ± 0.15 (0.580 ± 0.01) 13.2 ± 0.25 (0.52 ± 0.01) 6.4 ± 0.25 (0.25 ± 0.01) 11.0 ± 0.13 (0.43 ± 0.01) 4.95 ± 0.15 COPLANARITY OF SURFACE MOUNT (0.195 ± 0.01) LEADS TO BE WITHIN 0.3 mm. 7.11 ± 0.15 (0.280 ± 0.01) 0.6 ± 0.25 (0.02 ± 0.01) 0.76 ± 0.15 (0.03 ± 0.01) 2.54 ± 0.15 (0.100 ± 0.01) -A- 6.9 ± 0.25 (0.27 ± 0.01) 2.79 ± 0.15 (0.110 ± 0.01) ∅ .30 S A B C 0.51 ± 0.15 (0.020 ± 0.01) -C- 11.68 ± 0.15 (0.460 ± 0.01) ∅ .30 S A B C 1.39 ± 0.15 (0.05 ± 0...

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